Abstract: Examples are disclosed herein that relate to reducing reflectivity in a micro-LED array in a display device to avoid ghost images. One example provides a method comprising forming a structure comprising a plurality of light emitters arranged to form a scannable light-emitter array, and forming a material having a lower reflectivity than inactive regions located between the light emitters.

Abstract: Methods and apparatus for testing operation of a single or multiple tunable active optical device(s) operated by one or more driving electrodes are described. Test methods and apparatus are provided for device testing without necessarily requiring direct physical contact with the driving electrodes. Testing subjects devices to incident light along an optical path and to an external electric field applied to the device producing a dipolar charge distribution within the electrodes, causing the device to operate. The effect of device operation on incident light is optically sensed. The sensed effect is analyzed to identify device defects. Test methods and apparatus are provided for testing multiple unsingulated devices during fabrication employing a strip contact structure having contact strips connected to multiple devices and extending to wafer edges, such that singulating devices leaves portions of the strip contact structure exposed on device dice edges providing electrical contacts in use.

Abstract: A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

Abstract: A tunable liquid crystal optical device defining an optical aperture and having a layered structure. The device includes a film electrode formed on a surface of a first substrate and covered by a second substrate, and a contact structure filling a volume within the layered structure and contacting the film electrode. The contact structure is located outside of the optical aperture and provides an electrical connection surface much larger than a thickness of the film electrode, such that reliable electrical connections may be made to the electrode, particularly in the context of wafer scale manufacturing of such a device.

Abstract: A tunable liquid crystal optical device is described. The optical device has an electrode arrangement associated with a liquid crystal cell and includes a hole patterned electrode, wherein control of the liquid crystal cell depends on electrical characteristics of liquid crystal optical device layers. The optical device further has a circuit for measuring said electrical characteristics of the liquid crystal optical device layers, and a drive signal circuit having at least one parameter adjusted as a function of the measured electrical characteristics. The drive signal circuit generates a control signal for the electrode arrangement.

Abstract: Methods and apparatus for testing operation of a single or multiple tunable active optical device(s) operated by one or more driving electrodes are described. Test methods and apparatus are provided for device testing without necessarily requiring direct physical contact with the driving electrodes. Testing subjects devices to incident light along an optical path and to an external electric field applied to the device producing a dipolar charge distribution within the electrodes, causing the device to operate. The effect of device operation on incident light is optically sensed. The sensed effect is analyzed to identify device defects. Test methods and apparatus are provided for testing multiple unsingulated devices during fabrication employing a strip contact structure having contact strips connected to multiple devices and extending to wafer edges, such that singulating devices leaves portions of the strip contact structure exposed on device dice edges providing electrical contacts in use.

Abstract: Methods and apparatus for testing operation of a single or multiple tunable active optical device(s) operated by one or more driving electrodes are described Test methods and apparatus are provided for device testing without necessarily requiring direct physical contact with the driving electrodes Testing subjects devices to incident light along an optical path and to an external electric field applied to the device producing a dipolar charge distribution within the electrodes, causing the device to operate The effect of device operation on incident light is optically sensed The sensed effect is analyzed to identify device defects Test methods and apparatus are provided for testing multiple unsingulated devices during fabrication employing a strip contact structure having contact strips connected to multiple devices and extending to wafer edges, such that singulating devices leaves portions of the strip contact structure exposed on device dice edges providing electrical contacts in use.

Abstract: A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

Abstract: A tunable liquid crystal optical device defining an optical aperture and having a layered structure. The device includes a film electrode formed on a surface of a first substrate and covered by a second substrate, and a contact structure filling a volume within the layered structure and contacting the film electrode. The contact structure is located outside of the optical aperture and provides an electrical connection surface much larger than a thickness of the film electrode, such that reliable electrical connections may be made to the electrode, particularly in the context of wafer scale manufacturing of such a device.

Abstract: A method of forming a microelectronic assembly includes positioning a support structure adjacent to an active region of a device but not extending onto the active region. The support structure has planar sections. Each planar section has a substantially uniform composition. The composition of at least one of the planar sections differs from the composition of at least one of the other planar sections. A lid is positioned in contact with the support structure and extends over the active region. The support structure is bonded to the device and to the lid.

Abstract: A tunable liquid crystal optical device defining an optical aperture and having a layered structure. The device includes a film electrode formed on a surface of a first substrate and covered by a second substrate, and a contact structure filling a volume within the layered structure and contacting the film electrode. The contact structure is located outside of the optical aperture and provides an electrical connection surface much larger than a thickness of the film electrode, such that reliable electrical connections may be made to the electrode, particularly in the context of wafer scale manufacturing of such a device.

Abstract: A tunable liquid crystal optical device is described. The optical device has an electrode arrangement associated with a liquid crystal cell and includes a hole patterned electrode, wherein control of the liquid crystal cell depends on electrical characteristics of liquid crystal optical device layers. The optical device further has a circuit for measuring said electrical characteristics of the liquid crystal optical device layers, and a drive signal circuit having at least one parameter adjusted as a function of the measured electrical characteristics. The drive signal circuit generates a control signal for the electrode arrangement.

Abstract: Methods and apparatus for testing operation of a single or multiple tunable active optical device(s) operated by one or more driving electrodes are described Test methods and apparatus are provided for device testing without necessarily requiring direct physical contact with the driving electrodes Testing subjects devices to incident light along an optical path and to an external electric field applied to the device producing a dipolar charge distribution within the electrodes, causing the device to operate The effect of device operation on incident light is optically sensed The sensed effect is analyzed to identify device defects Test methods and apparatus are provided for testing multiple unsingulated devices during fabrication employing a strip contact structure having contact strips connected to multiple devices and extending to wafer edges, such that singulating devices leaves portions of the strip contact structure exposed on device dice edges providing electrical contacts in use.

Abstract: A tunable liquid crystal lens device is provided that uses a number of conductive elements and external contacts all located along a common side of a device housing. The device may include planar electrodes, a patterned electrode, a heating element and a sensor, which may be in different layers of the device. The device is produced as part of an array of such devices and, in addition to the devices in the array, a plurality of electrical conductive strips are used to provide high conductivity connection to conductive layers in each of the devices, thereby allowing simultaneous testing of the devices in the array.

Abstract: A tunable liquid crystal optical device defining an optical aperture and having a layered structure. The device includes a film electrode formed on a surface of a first substrate and covered by a second substrate, and a contact structure filling a volume within the layered structure and contacting the film electrode. The contact structure is located outside of the optical aperture and provides an electrical connection surface much larger than a thickness of the film electrode, such that reliable electrical connections may be made to the electrode, particularly in the context of wafer scale manufacturing of such a device.

Abstract: Liquid crystal optoelectronic devices are produced by fabricating a wafer-level component structure and affixing a plurality of discrete components to a surface structure prior to singulating the individual devices therefrom. After singulation, the individual devices include a portion of the wafer-level fabricated structure and at least of the discrete components. The wafer-level structure may include a liquid crystal and controlling electrodes, and the discrete components may include fixed lenses or image sensors. The discrete components may be located on either or both of two sides of the wafer-level structure. Multiple liquid crystal layers may be used to reduce nonuniformities in the interaction with light from different angles, and to control light of different polarizations. The liquid crystal devices may function as optoelectronic devices such as tunable lenses, shutters or diaphragms.

Abstract: Packaged microelectronic elements are provided. In an exemplary embodiment, a microelectronic element having a front face and a plurality of peripheral edges bounding the front face has a device region at the front face and a contact region with a plurality of exposed contacts adjacent to at least one of the peripheral edges. The packaged element may include a plurality of support walls overlying the front face of the microelectronic element such that a lid can be mounted to the support walls above the microelectronic element. For example, the lid may have an inner surface confronting the front face. In a particular embodiment, some of the contacts can be exposed beyond edges of the lid.

Abstract: A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.

Abstract: The present invention provides an integrated circuit chip assembly and a method of manufacturing the same. The assembly includes a package element having a top surface and an integrated circuit chip having a top surface, a bottom surface, edge surface between the top and bottom surfaces, and contacts exposed at the top surface. The package element is disposed below the chip with the top surface of the package element facing toward the bottom surface of the chip. At least one spacer element resides between the top surface of the package element and the bottom surface of the chip. According to one embodiment, the at least one spacer element may form a substantially closed cavity between the package element and the integrated circuit chip. According to another embodiment, first conductive features may extend from the contacts of the chip along the top surface, and at least some of said first conductive features extend along at least one of the edge surfaces of the chip.

Abstract: The present invention relates to a camera module. The camera module includes a circuit panel having a top side, a bottom side and transparent region, the circuit panel having conductors. The module further includes sensor unit disposed on the bottom side of the circuit panel, and the sensor unit includes a semiconductor chip having a front surface including an imaging area facing in a forward direction in alignment with the transparent region and an imaging circuit adapted to generate signals representative of an optical image impinging on the imaging area. The module further includes posts protruding from the bottom side of the circuit panel, wherein at least some of the posts being engagement posts having bottom surfaces, and at least some of the bottom surfaces abutting an engagement surface of the sensor unit.