Patents by Inventor Michael J. Tresidder

Michael J. Tresidder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12373369
    Abstract: Systems and methods are disclosed for scheduling a data link training by a controller. The system and method include receiving an indication that a physical layer of a data link is not transferring data and initiating a training process of the physical layer of the data link in response to the indication that the physical layer of the data link is not transferring data. In one aspect, the indication that the physical layer of a data link is not transferring data is an indication that the physical layer of the data link is in a low power state. In another aspect, the indication that the physical layer of a data link is not transferring data is an indication that a data transfer has been completed.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: July 29, 2025
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Michael J. Tresidder, Benjamin Tsien
  • Patent number: 12147366
    Abstract: Systems and methods are disclosed for voltage droop mitigation associated with a voltage rail that supplies power to circuitry of a chiplet. Techniques disclosed include detecting an upcoming transmission of data packets that are to be transmitted through a physical layer of the chiplet. Then, before transmitting the data packets through the physical layer, throttling a rate of bandwidth utilization in the physical layer and transmitting, by the controller, the data packets through the physical layer.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: November 19, 2024
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Michael J. Tresidder, Benjamin Tsien
  • Patent number: 12052153
    Abstract: Systems, apparatuses, and methods for enabling localized control of link states in a computing system are disclosed. A computing system includes at least a host processor, a communication fabric, one or more devices, one or more links, and a local link controller to monitor the one or more links. In various implementations, the local link controller detects and controls states of a link without requiring communication with, or intervention by, the host processor. In various implementations, this local control by the link controller includes control over the clock signals provided to the link. For example, the local link controller can directly control the frequency of a clock supplied to the link. In addition, in various implementations the link controller controls the power supplied to the link. For example, the link controller can control the voltage supplied to the link.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: July 30, 2024
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Alexander J. Branover, Thomas James Gibney, Michael J. Tresidder, Nat Barbiero
  • Patent number: 11960435
    Abstract: A semiconductor package for skew matching in a die-to-die interface, including: a first die; a second die aligned with the first die such that each connection point of a first plurality of connection points of the first die is substantially equidistant to a corresponding connection point of a second plurality of connection points of the second die; and a plurality of connection paths of a substantially same length, wherein each connection path of the plurality of connection paths couples a respective connection point of the first plurality of connection points to the corresponding connection point of the second plurality of connection points.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: April 16, 2024
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Pradeep Jayaraman, Dean Gonzales, Gerald R. Talbot, Ramon A. Mangaser, Michael J. Tresidder, Prasant Kumar Vallur, Srikanth Reddy Gruddanti, Krishna Reddy Mudimela Venkata, David H. McIntyre
  • Publication number: 20240004815
    Abstract: Systems and methods are disclosed for scheduling a data link training by a controller. The system and method include receiving an indication that a physical layer of a data link is not transferring data and initiating a training process of the physical layer of the data link in response to the indication that the physical layer of the data link is not transferring data. In one aspect, the indication that the physical layer of a data link is not transferring data is an indication that the physical layer of the data link is in a low power state. In another aspect, the indication that the physical layer of a data link is not transferring data is an indication that a data transfer has been completed.
    Type: Application
    Filed: June 29, 2022
    Publication date: January 4, 2024
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Michael J. Tresidder, Benjamin Tsien
  • Publication number: 20240004822
    Abstract: Systems, apparatuses, and methods for automatic firmware provision of high speed serializer/deserializer (SERDES) links are disclosed. A system on chip (SoC) includes one or more microcontrollers, a programmable interconnect, a plurality of physical layer engines, and a plurality of SERDES lanes. The programmable interconnect and the plurality of SERDES lanes are able to support communication protocols for interfaces such as PCIE, SATA, Ethernet, and others. On bootup, the SoC receives a custom specification of how the plurality of SERDES lanes are to be configured. The one or more microcontrollers generate a mapping for the programmable interconnect based on the specification. The mapping is used to configure the programmable interconnect to match the specification. The result is the programmable interconnect connecting the plurality of SERDES lanes to the appropriate physical layer circuits to implement the desired configuration.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 4, 2024
    Inventors: George D. Azevedo, Peter Malcolm Barnes, Michael J. Tresidder
  • Publication number: 20240004821
    Abstract: Systems and methods are disclosed for voltage droop mitigation associated with a voltage rail that supplies power to circuitry of a chiplet. Techniques disclosed include detecting an upcoming transmission of data packets that are to be transmitted through a physical layer of the chiplet. Then, before transmitting the data packets through the physical layer, throttling a rate of bandwidth utilization in the physical layer and transmitting, by the controller, the data packets through the physical layer.
    Type: Application
    Filed: June 29, 2022
    Publication date: January 4, 2024
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Michael J. Tresidder, Benjamin Tsien
  • Patent number: 11693465
    Abstract: A method and apparatus for scrambling and descrambling data in a computer system includes transmitting non-scrambled data from a first high speed inter chip (IP) link circuit located on a first chip to a first serializer/deserializer (SERDES) physical (PHY) circuit located on the first chip, the first high speed link IP indicating the data is not scrambled. The received non-scrambled data is scrambled by the first SERDES PHY circuit and transmitted to a second chip. The received scrambled data is descrambled by a second SERDES PHY circuit located on the second chip. The non-scrambled data is transmitted by the second SERDES PHY circuit to a second high speed link IP circuit located on the second chip to a third circuit for further processing or transmission.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: July 4, 2023
    Assignee: ADVANCED MICRO DEVICES, INC.
    Inventors: Yanfeng Wang, Michael J. Tresidder, Kevin M. Lepak, Larry David Hewitt, Noah Beck
  • Patent number: 11283589
    Abstract: Systems, apparatuses, and methods for implementing a deskewing method for a physical layer interface on a multi-chip module are disclosed. A circuit connected to a plurality of communication lanes trains each lane to synchronize a local clock of the lane with a corresponding global clock at a beginning of a timing window. Next, the circuit symbol rotates each lane by a single step responsive to determining that all of the plurality of lanes have an incorrect symbol alignment. Responsive to determining that some but not all of the plurality of lanes have a correct symbol alignment, the circuit symbol rotates lanes which have an incorrect symbol alignment by a single step. When the end of the timing window has been reached, the circuit symbol rotates lanes which have a correct symbol alignment and adjusts a phase of a corresponding global clock to compensate for missed symbol rotations.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: March 22, 2022
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Varun Gupta, Milam Paraschou, Gerald R. Talbot, Gurunath Dollin, Damon Tohidi, Eric Ian Carpenter, Chad S. Gallun, Jeffrey Cooper, Hanwoo Cho, Thomas H. Likens, III, Scott F. Dow, Michael J. Tresidder
  • Patent number: 11281280
    Abstract: Systems, apparatuses, and methods for reducing chiplet interrupt latency are disclosed. A system includes one or more processing nodes, one or more memory devices, a communication fabric coupled to the processing unit(s) and memory device(s) via link interfaces, and a power management unit. The power management unit manages the power states of the various components and the link interfaces of the system. If the power management unit detects a request to wake up a given component, and the link interface to the given component is powered down, then the power management unit sends an out-of-band signal to wake up the given component in parallel with powering up the link interface. Also, when multiple link interfaces need to be powered up, the power management unit powers up the multiple link interfaces in an order which complies with voltage regulator load-step requirements while minimizing the latency of pending operations.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: March 22, 2022
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Benjamin Tsien, Michael J. Tresidder, Ivan Yanfeng Wang, Kevin M. Lepak, Ann Ling, Richard M. Born, John P. Petry, Bryan P. Broussard, Eric Christopher Morton
  • Patent number: 11132327
    Abstract: A method and apparatus for physical layer bypass data transmission between physical coding sub-layers (PCS) includes encoding the data for transmission over a serial low-speed link. The data is transmitted from a first PCS via a serial connection over a serializer/deserializer (SERDES) transmission bypass path The data is received by a second PCS via a SERDES receive bypass path.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: September 28, 2021
    Assignees: ATI TECHNOLOGIES ULC, ADVANCED MICRO DEVICES, INC.
    Inventors: Michael J. Tresidder, Yanfeng Wang, Shiqi Sun
  • Publication number: 20210132675
    Abstract: A method and apparatus for scrambling and descrambling data in a computer system includes transmitting non-scrambled data from a first high speed inter chip (IP) link circuit located on a first chip to a first serializer/deserializer (SERDES) physical (PHY) circuit located on the first chip, the first high speed link IP indicating the data is not scrambled. The received non-scrambled data is scrambled by the first SERDES PHY circuit and transmitted to a second chip. The received scrambled data is descrambled by a second SERDES PHY circuit located on the second chip. The non-scrambled data is transmitted by the second SERDES PHY circuit to a second high speed link IP circuit located on the second chip to a third circuit for further processing or transmission.
    Type: Application
    Filed: January 15, 2021
    Publication date: May 6, 2021
    Applicants: ADVANCED MICRO DEVICES, INC., ATI TECHNOLOGIES ULC
    Inventors: Yanfeng Wang, Michael J. Tresidder, Kevin M. Lepak, Larry David Hewitt, Noah Beck
  • Publication number: 20210111861
    Abstract: Systems, apparatuses, and methods for implementing a deskewing method for a physical layer interface on a multi-chip module are disclosed. A circuit connected to a plurality of communication lanes trains each lane to synchronize a local clock of the lane with a corresponding global clock at a beginning of a timing window. Next, the circuit symbol rotates each lane by a single step responsive to determining that all of the plurality of lanes have an incorrect symbol alignment. Responsive to determining that some but not all of the plurality of lanes have a correct symbol alignment, the circuit symbol rotates lanes which have an incorrect symbol alignment by a single step. When the end of the timing window has been reached, the circuit symbol rotates lanes which have a correct symbol alignment and adjusts a phase of a corresponding global clock to compensate for missed symbol rotations.
    Type: Application
    Filed: December 21, 2020
    Publication date: April 15, 2021
    Inventors: Varun Gupta, Milam Paraschou, Gerald R. Talbot, Gurunath Dollin, Damon Tohidi, Eric Ian Carpenter, Chad S. Gallun, Jeffrey Cooper, Hanwoo Cho, Thomas H. Likens, III, Scott F. Dow, Michael J. Tresidder
  • Patent number: 10895901
    Abstract: A method and apparatus for scrambling and descrambling data in a computer system includes transmitting non-scrambled data from a first high speed inter chip (IP) link circuit located on a first chip to a first serializer/deserializer (SERDES) physical (PHY) circuit located on the first chip, the first high speed link IP indicating the data is not scrambled. The received non-scrambled data is scrambled by the first SERDES PHY circuit and transmitted to a second chip. The received scrambled data is descrambled by a second SERDES PHY circuit located on the second chip. The non-scrambled data is transmitted by the second SERDES PHY circuit to a second high speed link IP circuit located on the second chip to a third circuit for further processing or transmission.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: January 19, 2021
    Assignees: ADVANCED MICRO DEVICES INC., ATI TECHNOLOGIES ULC
    Inventors: Yanfeng Wang, Michael J. Tresidder, Kevin M. Lepak, Larry David Hewitt, Noah Beck
  • Patent number: 10873445
    Abstract: Systems, apparatuses, and methods for implementing a deskewing method for a physical layer interface on a multi-chip module are disclosed. A circuit connected to a plurality of communication lanes trains each lane to synchronize a local clock of the lane with a corresponding global clock at a beginning of a timing window. Next, the circuit symbol rotates each lane by a single step responsive to determining that all of the plurality of lanes have an incorrect symbol alignment. Responsive to determining that some but not all of the plurality of lanes have a correct symbol alignment, the circuit symbol rotates lanes which have an incorrect symbol alignment by a single step. When the end of the timing window has been reached, the circuit symbol rotates lanes which have a correct symbol alignment and adjusts a phase of a corresponding global clock to compensate for missed symbol rotations.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: December 22, 2020
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Varun Gupta, Milam Paraschou, Gerald R. Talbot, Gurunath Dollin, Damon Tohidi, Eric Ian Carpenter, Chad S. Gallun, Jeffrey Cooper, Hanwoo Cho, Thomas H. Likens, III, Scott F. Dow, Michael J. Tresidder
  • Publication number: 20200387208
    Abstract: Systems, apparatuses, and methods for reducing chiplet interrupt latency are disclosed. A system includes one or more processing nodes, one or more memory devices, a communication fabric coupled to the processing unit(s) and memory device(s) via link interfaces, and a power management unit. The power management unit manages the power states of the various components and the link interfaces of the system. If the power management unit detects a request to wake up a given component, and the link interface to the given component is powered down, then the power management unit sends an out-of-band signal to wake up the given component in parallel with powering up the link interface. Also, when multiple link interfaces need to be powered up, the power management unit powers up the multiple link interfaces in an order which complies with voltage regulator load-step requirements while minimizing the latency of pending operations.
    Type: Application
    Filed: May 18, 2020
    Publication date: December 10, 2020
    Inventors: Benjamin Tsien, Michael J. Tresidder, Ivan Yanfeng Wang, Kevin M. Lepak, Ann Ling, Richard M. Born, John P. Petry, Bryan P. Broussard, Eric Christopher Morton
  • Publication number: 20200344039
    Abstract: Systems, apparatuses, and methods for implementing a deskewing method for a physical layer interface on a multi-chip module are disclosed. A circuit connected to a plurality of communication lanes trains each lane to synchronize a local clock of the lane with a corresponding global clock at a beginning of a timing window. Next, the circuit symbol rotates each lane by a single step responsive to determining that all of the plurality of lanes have an incorrect symbol alignment. Responsive to determining that some but not all of the plurality of lanes have a correct symbol alignment, the circuit symbol rotates lanes which have an incorrect symbol alignment by a single step. When the end of the timing window has been reached, the circuit symbol rotates lanes which have a correct symbol alignment and adjusts a phase of a corresponding global clock to compensate for missed symbol rotations.
    Type: Application
    Filed: December 10, 2019
    Publication date: October 29, 2020
    Inventors: Varun Gupta, Milam Paraschou, Gerald R. Talbot, Gurunath Dollin, Damon Tohidi, Eric Ian Carpenter, Chad S. Gallun, Jeffrey Cooper, Hanwoo Cho, Thomas H. Likens, III, Scott F. Dow, Michael J. Tresidder
  • Publication number: 20200174962
    Abstract: A method and apparatus for physical layer bypass data transmission between physical coding sub-layers (PCS) includes encoding the data for transmission over a serial low-speed link. The data is transmitted from a first PCS via a serial connection over a serializer/deserializer (SERDES) transmission bypass path The data is received by a second PCS via a SERDES receive bypass path.
    Type: Application
    Filed: November 29, 2018
    Publication date: June 4, 2020
    Applicants: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Michael J. Tresidder, Yanfeng Wang, Shiqi Sun
  • Patent number: 10656696
    Abstract: Systems, apparatuses, and methods for reducing chiplet interrupt latency are disclosed. A system includes one or more processing nodes, one or more memory devices, a communication fabric coupled to the processing unit(s) and memory device(s) via link interfaces, and a power management unit. The power management unit manages the power states of the various components and the link interfaces of the system. If the power management unit detects a request to wake up a given component, and the link interface to the given component is powered down, then the power management unit sends an out-of-band signal to wake up the given component in parallel with powering up the link interface. Also, when multiple link interfaces need to be powered up, the power management unit powers up the multiple link interfaces in an order which complies with voltage regulator load-step requirements while minimizing the latency of pending operations.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: May 19, 2020
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Benjamin Tsien, Michael J. Tresidder, Ivan Yanfeng Wang, Kevin M. Lepak, Ann Ling, Richard M. Born, John P. Petry, Bryan P. Broussard, Eric Christopher Morton
  • Patent number: 10581587
    Abstract: Systems, apparatuses, and methods for implementing a deskewing method for a physical layer interface on a multi-chip module are disclosed. A circuit connected to a plurality of communication lanes trains each lane to synchronize a local clock of the lane with a corresponding global clock at a beginning of a timing window. Next, the circuit symbol rotates each lane by a single step responsive to determining that all of the plurality of lanes have an incorrect symbol alignment. Responsive to determining that some but not all of the plurality of lanes have a correct symbol alignment, the circuit symbol rotates lanes which have an incorrect symbol alignment by a single step. When the end of the timing window has been reached, the circuit symbol rotates lanes which have a correct symbol alignment and adjusts a phase of a corresponding global clock to compensate for missed symbol rotations.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: March 3, 2020
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Varun Gupta, Milam Paraschou, Gerald R. Talbot, Gurunath Dollin, Damon Tohidi, Eric Ian Carpenter, Chad S. Gallun, Jeffrey Cooper, Hanwoo Cho, Thomas H. Likens, III, Scott F. Dow, Michael J. Tresidder