Abstract: Self-cleaning features for extraction cleaners and attachments for extraction cleaners, such as accessory tools, wands, and/or hoses, are provided. The self-cleaning features are configured redirect cleaning fluid from a fluid supply system of the extraction cleaner into a working air or fluid recovery path of the extraction cleaner, including, but not limited to into the working air or fluid recovery path of a tool, wand, and/or hose of the extraction cleaner.

Abstract: A Fully Integrated Structural Building System has a pair of pre-stressed multi-stemmed concrete floors. The pre-stressed multi-stemmed concrete floors are adapted to contact each other on one parallel side edge to form peripheral edges and a central joining edge. A part of a building is coupled to a pre-stressed multi-stemmed concrete floor. The building is constructed with a primary structural frame and a secondary structural frame separated by a rigid foam spacer. The spacer is a Class I non-combustible closed-cell foam. The building is strong, energy efficient, non-combustible and easily transported from the factory to the building site. The building is Green and constructed only with renewable and recyclable materials.

Abstract: A method includes extracting at least one object file from a library of object files. The method also includes identifying an interprocedural optimization associated with a plurality of object files. The plurality of object files includes the at least one extracted object file. The method further includes invoking recompilation of at least one of the plurality of object files to implement the identified interprocedural optimization. In addition, the method includes generating at least one executable file using the at least one recompiled object file. The plurality of object files could include interprocedural summary information generated by a compiler during a compilation of at least one source file and a compiler internal representation associated with the compiler during the compilation. The interprocedural optimization could be identified using the interprocedural summary information, and the at least one recompiled object file could be generated using the compiler internal representation.

Abstract: A manufactured building system has a pair of pre-stressed multi-stemmed concrete floors. The pre-stressed multi-stemmed concrete floors are adapted to contact each other on one parallel side edge to form peripheral edges and a central joining edge. A part of a building is coupled to a pre-stressed multi-stemmed concrete floor. Also described is a Method of Transporting the pre-stressed multi-stemmed concrete floors with the partial building coupled there to, to a site. Also described is a Method of Manufacturing a pre-stressed multi-stemmed concrete floor.

Abstract: Metal faced insulated inserts have interior and exterior surfaces with parallel longitudinal edges between an upper and lower short edge. Each longitudinal edge of each insert has two deep recesses and a central shallow recess. A plurality of generally I-shaped concealed locking beams have a central section and parallel end sections. Each end section has a central region of a thickness less than end regions to form a locking ramp. A pair of similarly configured metal facings for each concealed locking beam with opposed end parts are located within the deep recesses at the longitudinal edges of each insert. Each end part terminates in a V-shaped projection configured to allow the end regions of the concealed edge lockings to compress the V-shaped projections and allow the end regions of the concealed locking beams to mate with the metal facings.

Abstract: A manufactured building system has a pair of pre-stressed multi-stemmed concrete floors. The pre-stressed multi-stemmed concrete floors are adapted to contact each other on one parallel side edge to form peripheral edges and a central joining edge. A part of a building is coupled to a pre-stressed multi-stemmed concrete floor. Also described is a Method of Transporting the pre-stressed multi-stemmed concrete floors with the partial building coupled there to, to a site. Also described is a Method of Manufacturing a pre-stressed multi-stemmed concrete floor.

Abstract: Patterns with feature sizes of less than 50 microns are rapidly formed directly in semiconductors, particularly silicon, GaAs, indium phosphide, or single crystalline sapphire, using ultraviolet laser ablation. These patterns include very high aspect ratio cylindrical through-hole openings for integrated circuit connections; singulation of processed die contained on semiconductor wafers; and microtab cutting to separate microcircuit workpieces from a parent semiconductor wafer. Laser output pulses (32) from a diode-pumped, Q-switched frequency-tripled Nd:YAG, Nd:YVO4, or Nd:YLF is directed to the workpiece (12) with high speed precision using a compound beam positioner. The optical system produces a Gaussian spot size, or top hat beam profile, of about 10 microns. The pulse energy used for high-speed ablative processing of semiconductors using this focused spot size is greater than 200 ?J per pulse at pulse repetition frequencies greater than 5 kHz and preferably above 15 kHz.

Abstract: A manufactured building system has a pair of pre-stressed multi-stemmed concrete floors. The pre-stressed multi-stemmed concrete floors are adapted to contact each other on one parallel side edge to form peripheral edges and a central joining edge. A part of a building is coupled to a pre-stressed multi-stemmed concrete floor. Also described is a Method of Transporting the pre-stressed multi-stemmed concrete floors with the partial building coupled there to, to a site. Also described is a Method of Manufacturing a pre-stressed multi-stemmed concrete floor.

Abstract: Patterns with feature sizes of less than 50 microns are rapidly formed directly in semiconductors, particularly silicon, using ultraviolet laser ablation. These patterns include very high aspect ratio cylindrical through-hole openings for integrated circuit connections; singulation of processed die contained on semiconductor wafers; and microtab cutting to separate microcircuit workpieces from a parent semiconductor wafer. Laser output pulses (32) from a diode-pumped, Q-switched frequency-tripled Nd:YAG, Nd:YVO4, or Nd:YLF is directed to the workpiece (12) with high speed precision using a compound beam positioner. The optical system produces a Gaussian spot size, or top hat beam profile, of about 10 microns. The pulse energy used for high-speed ablative processing of silicon using this focused spot size is greater than 200 &mgr;J per pulse at pulse repetition frequencies greater than 5 kHz and preferably above 15 kHz.

Abstract: A UV laser (102) cuts ceramics or glasses such as the alumina or ceramic of sliders (10), and particularly separates rows (60) or sliders (10) or rounds edges (66, 82, 86). A preferred process entails covering the surfaces of wafers (50), rows (60), or sliders (10) with a sacrificial layer; removing a portion of the sacrificial layer to create uncovered zones along existing edges or over intended edges; laser cutting wafers (50) into rows (60) or rows (60) into sliders (50); laser rounding edges (66, 68, 82, 84, and/or 86), and/or corners (85 and/or 87); cleaning debris from the uncovered zones; and removing the sacrificial layer. Although a preferred laser is a Q-switched, UV solid-state laser (100) providing imaged and/or shaped output at a bite size of between about 1 to 7 &mgr;m, other lasers including excimers can be employed.

Abstract: An adjustable connector assembly for coupling the adjacent lateral edges of construction panels including an intermediate extruded plate in a generally H-shaped configuration having planar interior legs with inwardly extending projections at their ends in a generally cylindrical configuration receivable within the receptors of first and second end components and having exterior arcuate legs extending in opposite directions from the center with centers of curvature coextensive with the projections and having an intermediate coupling member extending perpendicular between centers of the first legs and second legs.

Abstract: A structural connector system for the assembly of structural panel buildings is provided. The system is adapted for use in association with structural panels including roof and wall panels. The system comprises a pair of adjustable roof ridge structural connectors each having a generally U-shaped side with flat faces receiving adjacent ends of roof panels and with arched adjustable components therebetween. An adjustable eave structural connector is positioned between the upper edges of wall panels and roof panels adjacent to the periphery. The eave structural connectors have generally U-shaped sides with flat faces receiving wall panels adjacent their upper edges and with regions coupled to a roof panel with adjustment components therebetween. The base structural connectors have generally U-shaped sides with flat faces receiving opposed exterior faces of wall panels adjacent to their lower ends. Remote components are fixably positionable with respect to the base.

Abstract: An apparatus suitable for adaptation and use either as an exterior foundational base shroud or an interior decorative baseboard. In either case, the apparatus may be used to conceal and protect electrical, communications, or other conduit. The apparatus is suitable for use with a variety of standardized structural panels and may be manufactured through the extrusion process.

Abstract: The invention comprises a ridge beam apparatus which is adjustable to receive roof halves in a variety of roof pitches. Such adjustability results from inner and outer sleeves which may rotate about each other through a reasonable range of pitches. The apparatus is suitable for manufacture through the extrusion process.

Abstract: UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 ?m to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 (112) where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths. A multi-step process can optimize the laser processes for each individual layer.

Abstract: UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 ?m to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 (112) where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths. A multi-step process can optimize the laser processes for each individual layer.

Abstract: UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 ?m to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 (112) where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths. A multi-step process can optimize the laser processes for each individual layer.