Abstract: The invention relates to a disinfectant composition comprising: (A) a peracetic acid-generating component comprising acetic acid, hydrogen peroxide and an organic phosphonic acid; and (B) a stabilizer component comprising an alkaline agent and a chelating agent, wherein the chelating agent is selected from the group consisting of N,N-bis(carboxymethyl)L-glutamic acid, methylglycine diacetic acid, nitrilotriacetic acid, and alkali metal salts thereof, and a mixture of two or more thereof and to the aqueous disinfectant solution obtainable by mixing and diluting components (A) and (B) in water. The invention further relates to a method of disinfecting surface and instruments, particularly flexible endoscopes, using said aqueous disinfectant solution.

Abstract: The present invention provides novel antibodies and methods for using recombinant antigen-binding regions and antibodies and functional fragments containing such antigen-binding regions that are specific for CD38, which plays an integral role in various disorders or conditions. These methods take advantage of newly discovered antibodies and surprising properties of such antibodies, such as the ability to bind CD38 of minipig origin and the ability to induce, by cross-linking, specific killing of cells that express CD38. These antibodies as well as the novel methods for using those antibodies can be used to treat, for example, hematological malignancies such as multiple myeloma.

Abstract: Provided is a system and method for acquiring training data and building an organizational-based language model based on the training data. In one example, the method may include collecting organizational data that is generated via one or more applications associated with an organization, aggregating the collected organizational data with previously collected organizational data to generate aggregated organizational training data, training an organizational-based language model for speech processing based on the aggregated organizational training data, and storing the trained organizational-based language model.

Abstract: An improved electroacoustic transducer with an improved mode profile is provided. The transducer comprises a transversal velocity profile with a periodic structure and an edge structure flanking the periodic structure. The velocity profile also allows to suppress the SH wave mode. A dielectric material with a periodic structure contributes to the formation of the periodic structure of the velocity profile.

Abstract: An electroacoustic component is disclosed. In an embodiment, the electroacoustic component includes a piezoelectric substrate comprising a rare earth metal and calcium oxoborates (RE-COB) and component structures arranged on the substrate, the component structures being suitable for converting between RF signals and acoustic waves, wherein the waves are capable of propagation in a direction x??, and wherein the direction x?? is determined by Euler angles (?, ?, ?), the Euler angles being selected from angle ranges (20-90, 95-160, 15-55), (20-85, 95-160, 95-125) and (15-25, 85-100, 0-175).

Abstract: The invention provides a novel semiconductive polymer composition with improved smoothness and dispersibility of carbon black when compounding the polymer composition and feasible balance with other properties such as volume resistivity. The semiconductive polymer composition comprises (a) from 30 to 90 wt % of a polymer component, (b) from 10 to 70 wt % of carbon black and the carbon black (b) has a mass pellet strength (MPS) according to ASTM D1937-13 of from 50 to 250 N. The invention further relates to a process for preparing the semiconductive polymer composition comprising the steps of: i) introducing 30-90 wt % of a polymer component as defined above and 0-8 wt % additives in a mixer device and mixing the polymer component and additives at elevated temperature such that a polymer melt is obtained; ii) adding 10-70 wt % of a carbon black as defined above to the polymer melt and further mixing of the polymer melt.

Abstract: For a component operating with acoustic waves, it is proposed to provide a compensation layer on the component for compensating for a negative temperature coefficient of the frequency, which includes a material based on a chemical compound made up of at least two elements, which has a negative thermal expansion coefficient.

Abstract: The present invention relates to a filter chip (1), comprising an interconnection of at least one first and one second resonator (2, 3) operating with bulk acoustic waves, wherein the first resonator (2) operating with bulk acoustic waves comprises a first piezoelectric layer (4) that is structured in such a way that the first resonator (2) has a lower resonant frequency than the second resonator (3).

Abstract: An improved electroacoustic transducer with an improved mode profile is provided. The transducer comprises a transversal velocity profile with a periodic structure and an edge structure flanking the periodic structure. The velocity profile also allows to suppress the SH wave mode. A dielectric material with a periodic structure contributes to the formation of the periodic structure of the velocity profile.

Abstract: The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt %) of a polymer blend, 2 to 50 wt % of a conductive filler and 0.05 to 2 wt % of an antioxidant; wherein said polymer blend comprises 10 to 99 wt % of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m3 and a melt flow rate (MFR2@190° C.) according to ISO 1133 (190° C., 2.16 kg) which is less than 1.6 g/10 min, and 1 to 90 wt % of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.

Abstract: The present invention relates to a filter chip (1), comprising an interconnection of at least one first and one second resonator (2, 3) operating with bulk acoustic waves, wherein the first resonator (2) operating with bulk acoustic waves comprises a first piezoelectric layer (4) that is structured in such a way that the first resonator (2) has a lower resonant frequency than the second resonator (3).

Abstract: For a component operating with acoustic waves, it is proposed to provide a compensation layer on the component for compensating for a negative temperature coefficient of the frequency, which includes a material based on a chemical compound made up of at least two elements, which has a negative thermal expansion coefficient.

Abstract: An electroacoustic component is disclosed. In an embodiment, the electroacoustic component includes a piezoelectric substrate comprising a rare earth metal and calcium oxoborates (RE-COB) and component structures arranged on the substrate, the component structures being suitable for converting between RF signals and acoustic waves, wherein the waves are capable of propagation in a direction x??, and wherein the direction x?? is determined by Euler angles (?, ?, ?), the Euler angles being selected from angle ranges (20 . . . 90, 95 . . . 160, 15 . . . 55), (20 . . . 85, 95 . . . 160, 95 . . . 125) and (15 . . . 25, 85 . . . 100, 0 . . . 175).

Abstract: An electroacoustic transducer has a piezoelectric layer, which is structured in such a way that, in the case of an alternating electric field applied in one spatial direction, an oscillation mode with oscillations in three spatial directions is excited.

Abstract: The invention provides a novel semiconductive polymer composition with improved smoothness and dispersibility of carbon black when compounding the polymer composition and feasible balance with other properties such as volume resistivity. The semiconductive polymer composition comprises (a) from 30 to 90 wt % of a polymer component, (b) from 10 to 70 wt % of carbon black and the carbon black (b) has a mass pellet strength (MPS) according to ASTM D1937-13 of from 50 to 250 N. The invention further relates to a process for preparing the semiconductive polymer composition comprising the steps of: i) introducing 30-90 wt % of a polymer component as defined above and 0-8 wt % additives in a mixer device and mixing the polymer component and additives at elevated temperature such that a polymer melt is obtained; ii) adding 10-70 wt % of a carbon black as defined above to the polymer melt and further mixing of the polymer melt.

Abstract: An explanation is given of, inter alia, a method for editing data (BD), comprising: storing (26, 28) at least one rule (R1, R2) in which at least one data editing function is specified and/or which concerns at least one data editing function, transmitting at least one message (30) from a first data processing system (12) to a second data processing system (14), depending on the message (30) using the stored rule (R1, R2), determining (38) at least one data editing function, performing (46) the data editing function for at least one data set specified in the message (30) or for at least one data set determined when the data editing function is called.

Abstract: An electroacoustic transducer has a piezoelectric layer, which is structured in such a way that, in the case of an alternating electric field applied in one spatial direction, an oscillation mode with oscillations in three spatial directions is excited.

Abstract: The present invention relates to a new semiconductive composition, which comprises 50 to 98 weight percentage (wt %) of a polymer blend, 2 to 50 wt % of a conductive filler and 0.05 to 2 wt % of an antioxidant; wherein said polymer blend comprises 10 to 99 wt % of a multimodal high density polyolefin, which high density polyolefin has a density which is from 930 to 970 kg/m3 and a melt flow rate (MFR2@190° C.) according to ISO 1133 (190° C., 2.16 kg) which is less than 1.6 g/10 min, and 1 to 90 wt % of a thermoplastic elastomer, a process for producing a semiconductive composition, and a semiconductive jacket comprising the semiconductive composition, and a power cable comprising the semiconductive jacket or comprising the semiconductive composition, or use of a semiconductive jacket or a semiconductive composition in, for example, a power cable.

Abstract: The embodiments relate to a method for the dynamic load management of computational capacities in a cloud, the method including determining a currently-available computational capacity of the cloud, a currently-required computational load of the cloud, and an expected computational load of the cloud. The method further includes calculating a load threshold value for a connectible computational capacity for the cloud as a function of the available computational capacity, the currently-required computational load, and the expected computational load. The method further includes calculating a load parameter corresponding to an achieved data-processing performance of the cloud. The method further includes requesting the connectible computational capacity for the cloud on the basis of the calculated load threshold value and the load parameter of the cloud, in order to dynamically manage the load of the computational capacities in the cloud.

Abstract: A method for providing resources in a cloud includes interrogating current location-based data relating to potential users of the cloud, and calculating a future resource requirement in local computing centers of the cloud based at least on the current location-based data relating to the potential users. The method also includes automatically providing resources in the local computing centers of the cloud according to the calculated future resource requirement of the local computing centers.