Patents by Inventor Michael Laisne

Michael Laisne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7750660
    Abstract: An integrated circuit that supports testing of multiple pads via a subset of these pads includes at least two sections. Each section has multiple pads and multiple test access circuits coupled to these pads. For each section, one pad is designated as a primary pad and the remaining pads are designated as secondary pads. For each section, the test access circuits couple the secondary pads to the primary pad such that all of the pads in the section can be tested by probing just the primary pad. Each test access circuit may be implemented with a simple switch. A controller generates a set of control signals for the test access circuits in all sections. These control signals enable and disable the test access circuits such that all of the sections can be tested in parallel, and the pads in each section can be tested in a sequential order.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: July 6, 2010
    Assignee: QUALCOMM Incorporated
    Inventors: Srinivas Varadarajan, Michael Laisne, Raghunath R. Bhattagiri, Arvid G. Sammuli
  • Publication number: 20100141286
    Abstract: An integrated circuit that supports testing of multiple pads via a subset of these pads includes at least two sections. Each section has multiple pads and multiple test access circuits coupled to these pads. For each section, one pad is designated as a primary pad and the remaining pads are designated as secondary pads. For each section, the test access circuits couple the secondary pads to the primary pad such that all of the pads in the section can be tested by probing just the primary pad. Each test access circuit may be implemented with a simple switch. A controller generates a set of control signals for the test access circuits in all sections. These control signals enable and disable the test access circuits such that all of the sections can be tested in parallel, and the pads in each section can be tested in a sequential order.
    Type: Application
    Filed: February 12, 2010
    Publication date: June 10, 2010
    Applicant: QUALCOMM INCORPORATED
    Inventors: Srinivas Varadarajan, Michael Laisne, Raghunath R. Bhattagiri, Arvid G. Sammuli
  • Publication number: 20100060310
    Abstract: An integrated circuit, or combination of integrated circuits, has a primary interconnect, a redundant interconnect, and circuitry connecting the primary and redundant interconnects allowing selection of the redundant interconnect to bypass the primary interconnect.
    Type: Application
    Filed: June 9, 2009
    Publication date: March 11, 2010
    Applicant: QUALCOMM INCORPORATED
    Inventors: Michael Laisne, Karim Arabi, Tsvetomir Petrov
  • Publication number: 20090206868
    Abstract: Quiescent supply current (IDDQ) verification, prediction, and debugging of low power semiconductor devices are enhanced by IDDQ defect diagnosis. If all IDDQ patterns fail verification, per module analysis is performed to sort out potential module design issues or cell constraint issues. For issues of missing constraints, and cell design or implementation issues leading to extra leakage that could be avoided by adding constraints, there are usually IDDQ patterns that correlate with expectations, and patterns that do not, due to the random nature of unconstrained scan cell values as determined by the pattern generation tool. Differentiating good and bad IDDQ patterns can identify root causes of IDDQ issues and additional constraints to fix the bad IDDQ vectors. These verification procedures are achieving IDDQ test success and short time to market, as well as significantly faster time to volume and improved yields because of having a higher quality and better-controlled IDDQ test.
    Type: Application
    Filed: February 15, 2008
    Publication date: August 20, 2009
    Applicant: QUALCOMM INCORPORATED
    Inventors: Michael Laisne, Songlin Zuo, Hailong Cui, Xiangdong Pan, Triphuong Nguyen
  • Publication number: 20070236242
    Abstract: An integrated circuit that supports testing of multiple pads via a subset of these pads includes at least two sections. Each section has multiple pads and multiple test access circuits coupled to these pads. For each section, one pad is designated as a primary pad and the remaining pads are designated as secondary pads. For each section, the test access circuits couple the secondary pads to the primary pad such that all of the pads in the section can be tested by probing just the primary pad. Each test access circuit may be implemented with a simple switch. A controller generates a set of control signals for the test access circuits in all sections. These control signals enable and disable the test access circuits such that all of the sections can be tested in parallel, and the pads in each section can be tested in a sequential order.
    Type: Application
    Filed: March 30, 2006
    Publication date: October 11, 2007
    Inventors: Srinivas Varadarajan, Michael Laisne, Raghunath Bhattagiri, Arvid Sammuli