Patents by Inventor Michael Lekas

Michael Lekas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11064610
    Abstract: An inductor includes a planar laminated magnetic core and a conductive winding. The planar magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The non-magnetic layer includes an insulating layer that is disposed between first and second interface layers. The conductive winding turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The inductor can be integrated into a multilevel wiring network in a semiconductor integrated circuit to form a microelectronic device, such as a transformer, a power converter, or a microprocessor.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: July 13, 2021
    Assignee: Ferric Inc.
    Inventors: Noah Sturcken, Ryan Davies, Michael Lekas
  • Patent number: 11058001
    Abstract: A structure comprises a semiconductor integrated circuit, an inductor, and a magnetic flux closure layer. The inductor is integrated into a multilevel wiring network in the semiconductor integrated circuit. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic flux closure layer is disposed within about 100 ?m of a face of the planar laminated magnetic core, the face of the planar magnetic core parallel to a principal plane of the planar laminated magnetic core. A second magnetic flux closure layer can be disposed within about 100 ?m of an opposing face of the planar laminated magnetic core.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: July 6, 2021
    Assignee: Ferric Inc.
    Inventors: Noah Sturcken, Ryan Davies, Michael Lekas
  • Publication number: 20210065959
    Abstract: A method for manufacturing a vertically-laminated ferromagnetic core includes (a) depositing a conductive seed layer on or over a first side of a substrate; (b) depositing a masking layer on or over a second side of the substrate, the first and second sides on opposite sides of the substrate; (c) forming a pattern in the masking layer; (d) dry etching the substrate, based on the pattern in the masking layer, from the second side to the first side to expose portions of the conductive seed layer; and (e) depositing a ferromagnetic material onto the exposed portions of the conductive seed layer to form vertically-oriented ferromagnetic layers.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 4, 2021
    Inventors: Noah Sturcken, Denis Shishkov, Matthew Cavallaro, Michael Lekas, Ryan Davies
  • Patent number: 10893609
    Abstract: A structure includes a semiconductor integrated circuit comprising a multilevel wiring network and an inductor integrated into the multilevel wiring network. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic layer comprises a ferromagnetic alloy having an iron composition of about 10 atomic percent to about 90 atomic percent.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: January 12, 2021
    Assignee: Ferric Inc.
    Inventors: Noah Sturcken, Ryan Davies, Michael Lekas
  • Patent number: 10878996
    Abstract: Power and/or data are transmitted through variable magnetic fields between a first transceiver coil on a transceiver apparatus and a second transceiver coil in an inductor integrated into a multilevel wiring structure on a semiconductor integrated circuit chip. The first transceiver apparatus generates magnetic fields and can transmit data by varying a characteristic of the magnetic fields. The second transceiver coil receives the power from and/or detects data in the magnetic fields from the first transceiver apparatus. The inductor can include a ferromagnetic core that concentrates magnetic flux to improve data or power transmission efficiency to miniaturize the second transceiver coil while maintaining adequate inductive coupling between the coils. The second transceiver coil can transmit data by varying the impedance of the inductor and/or the integrated circuit. The semiconductor integrated circuit chip can be coupled to an object and the second transceiver coil can transmit data relating to the object.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: December 29, 2020
    Assignee: Ferric Inc.
    Inventors: Michael Lekas, Noah Sturcken
  • Publication number: 20200168394
    Abstract: Power and/or data are transmitted through variable magnetic fields between a first transceiver coil on a transceiver apparatus and a second transceiver coil in an inductor integrated into a multilevel wiring structure on a semiconductor integrated circuit chip. The first transceiver apparatus generates magnetic fields and can transmit data by varying a characteristic of the magnetic fields. The second transceiver coil receives the power from and/or detects data in the magnetic fields from the first transceiver apparatus. The inductor can include a ferromagnetic core that concentrates magnetic flux to improve data or power transmission efficiency to miniaturize the second transceiver coil while maintaining adequate inductive coupling between the coils. The second transceiver coil can transmit data by varying the impedance of the inductor and/or the integrated circuit. The semiconductor integrated circuit chip can be coupled to an object and the second transceiver coil can transmit data relating to the object.
    Type: Application
    Filed: January 31, 2020
    Publication date: May 28, 2020
    Inventors: Michael Lekas, Noah Sturcken
  • Patent number: 10658331
    Abstract: A power management module comprises one or more power converter chips that are mounted on a power management package substrate. First and second electrical contacts are disposed on opposing first and second sides of the power management package substrate. The power management module can be mounted on a processor module to supply power to one or more processor chips in the processor module. In one example, the processor chip(s) are mounted on a first side of a processor package substrate and the power management module is mounted on an opposing second side of the processor package substrate. The power management module and the processor module can be centered and aligned with respect to each other or they can be offset laterally from each other. In another embodiment, the processor chip(s) are embedded in the processor package substrate.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: May 19, 2020
    Assignee: Ferric Inc.
    Inventors: Noah Sturcken, Ehsan Kalami, Joseph Meyer, Michael Lekas
  • Publication number: 20200152364
    Abstract: A ferromagnetic actuator is disposed between first and second semiconductor devices that include first and second inductors. Each inductor is disposed on top of a multilevel wiring structure. Current flows through the first inductor to generate a first magnetic field that attracts the ferromagnetic actuator towards the first inductor causing the ferromagnetic actuator to transition from a first state to a second state. In the second state, a portion of the ferromagnetic actuator is disposed closer to the first inductor than it is in the first state. Current flows through the second inductor to generate a second magnetic field that attracts the ferromagnetic actuator towards the second inductor causing the ferromagnetic actuator to transition from the first or second state to a third state. In the third state, a portion of the ferromagnetic actuator is disposed closer to the first inductor than it is in the first state.
    Type: Application
    Filed: November 8, 2018
    Publication date: May 14, 2020
    Inventors: Noah Sturcken, Ryan Davies, Michael Lekas
  • Patent number: 10593470
    Abstract: Power and/or data are transmitted through variable magnetic fields between a first transceiver coil on a transceiver apparatus and a second transceiver coil in an inductor integrated into a multilevel wiring structure on a semiconductor integrated circuit chip. The first transceiver apparatus generates magnetic fields and can transmit data by varying a characteristic of the magnetic fields. The second transceiver coil receives the power from and/or detects data in the magnetic fields from the first transceiver apparatus. The inductor can include a ferromagnetic core that concentrates magnetic flux to improve data or power transmission efficiency to miniaturize the second transceiver coil while maintaining adequate inductive coupling between the coils. The second transceiver coil can transmit data by varying the impedance of the inductor and/or the integrated circuit. The semiconductor integrated circuit chip can be coupled to an object and the second transceiver coil can transmit data relating to the object.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: March 17, 2020
    Assignee: Ferric Inc.
    Inventors: Michael Lekas, Noah Sturcken
  • Publication number: 20200075233
    Abstract: Power and/or data are transmitted through variable magnetic fields between a first transceiver coil on a transceiver apparatus and a second transceiver coil in an inductor integrated into a multilevel wiring structure on a semiconductor integrated circuit chip. The first transceiver apparatus generates magnetic fields and can transmit data by varying a characteristic of the magnetic fields. The second transceiver coil receives the power from and/or detects data in the magnetic fields from the first transceiver apparatus. The inductor can include a ferromagnetic core that concentrates magnetic flux to improve data or power transmission efficiency to miniaturize the second transceiver coil while maintaining adequate inductive coupling between the coils. The second transceiver coil can transmit data by varying the impedance of the inductor and/or the integrated circuit. The semiconductor integrated circuit chip can be coupled to an object and the second transceiver coil can transmit data relating to the object.
    Type: Application
    Filed: August 30, 2018
    Publication date: March 5, 2020
    Inventors: Michael Lekas, Noah Sturcken
  • Publication number: 20200075541
    Abstract: A power management module comprises one or more power converter chips that are mounted on a power management package substrate. First and second electrical contacts are disposed on opposing first and second sides of the power management package substrate. The power management module can be mounted on a processor module to supply power to one or more processor chips in the processor module. In one example, the processor chip(s) are mounted on a first side of a processor package substrate and the power management module is mounted on an opposing second side of the processor package substrate. The power management module and the processor module can be centered and aligned with respect to each other or they can be offset laterally from each other. In another embodiment, the processor chip(s) are embedded in the processor package substrate.
    Type: Application
    Filed: September 12, 2018
    Publication date: March 5, 2020
    Inventors: Noah Sturcken, Ehsan Kalami, Joseph Meyer, Michael Lekas
  • Patent number: 10367415
    Abstract: A power management module comprises one or more power converter chips that are mounted on a power management package substrate. First and second electrical contacts are disposed on opposing first and second sides of the power management package substrate. The power management module can be mounted on a processor module to supply power to one or more processor chips in the processor module. In one example, the processor chip(s) are mounted on a first side of a processor package substrate and the power management module is mounted on an opposing second side of the processor package substrate. The power management module and the processor module can be centered and aligned with respect to each other or they can be offset laterally from each other. In another embodiment, the power management module and the processor chip(s) are mounted on the same side of the processor package substrate.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: July 30, 2019
    Assignee: Ferric Inc.
    Inventors: Noah Sturcken, Ehsan Kalami, Joseph Meyer, Michael Lekas
  • Patent number: 10347709
    Abstract: Methods of manufacturing are disclosed for an inductor that includes a magnetic core lying in a core plane. The magnetic core includes a vertical laminated structure with respect to the core plane of alternating ferromagnetic vertical layers and insulator vertical layers. An easy axis of magnetization can be permanently or semi-permanently fixed in the ferromagnetic vertical layers along a first axis orthogonal to the core plane. A hard axis of magnetization can be permanently or semi-permanently induced in the ferromagnetic vertical layers, the hard axis of magnetization lying in a plane that is orthogonal to the first axis.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: July 9, 2019
    Assignee: Ferric Inc.
    Inventors: Noah Sturcken, Ryan Davies, Hao Wu, Michael Lekas
  • Publication number: 20190182957
    Abstract: A switched inductor DC-DC power converter chiplet includes a CMOS power switch, an LC filter, regulation circuitry, feedback control circuitry, and interface control circuitry integrated on a common substrate. The inductor for the LC filter can be formed on the same surface or on opposing surfaces of the substrate as the electrical terminations for the substrate. Another embodiment includes a switched inductor DC-DC power converter chiplet having a first powertrain phase and multiple second powertrain phases. When the load current is less than or equal to a threshold load current, the power conversion efficiency can be improved by only operating the first powertrain phase. When the load current is greater than the threshold load current, the power conversion efficiency can be improved by operating one or more second powertrain phases.
    Type: Application
    Filed: February 19, 2019
    Publication date: June 13, 2019
    Inventors: Noah Sturcken, Joseph Meyer, Michael Lekas, Ryan Davies, David Jew, William Lee
  • Publication number: 20190172624
    Abstract: Inductive elements comprising anisotropic media and a bias coil for magnetically biasing thereof and methods of manufacture and operation for use in applications such as microelectronics. The bias coil generates a magnetic field that biases a magnetic core material during deposition thereof such that a desirable orientation of anisotropy is achieved throughout the magnetic core and enables modulation of the inductive response of the device. The bias coil can generate the magnetic field by application of electrical current therethrough. Alternatively, the bias coil can include or can be replaced with a permanent magnet that can generate the magnetic field without application of electrical current therethrough.
    Type: Application
    Filed: January 25, 2019
    Publication date: June 6, 2019
    Inventors: Noah Sturcken, Ryan Davies, Michael Lekas
  • Patent number: 10244633
    Abstract: A switched inductor DC-DC power converter chiplet includes a CMOS power switch, an LC filter, regulation circuitry, feedback control circuitry, and interface control circuitry integrated on a common substrate. The inductor for the LC filter can be formed on the same surface or on opposing surfaces of the substrate as the electrical terminations for the substrate.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: March 26, 2019
    Assignee: Ferric Inc.
    Inventors: Noah Sturcken, David Jew, Joseph Meyer, Ryan Davies, Michael Lekas
  • Patent number: 10210986
    Abstract: An inductor includes a magnetic core lying in a core plane. The magnetic core includes a vertical laminated structure with respect to the core plane of alternating ferromagnetic vertical layers and insulator vertical layers. An easy axis of magnetization can be permanently or semi-permanently fixed in the ferromagnetic vertical layers along an axis orthogonal to the core plane. Methods of manufacturing same are also disclosed.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: February 19, 2019
    Assignee: Ferric, Inc.
    Inventors: Noah Sturcken, Ryan Davies, Hao Wu, Michael Lekas
  • Publication number: 20180302986
    Abstract: An inductor comprises a planar laminated magnetic core and a conductive winding. The core includes an alternating sequence of (a) a magnetic layer having a thickness of about 100 angstroms to about 10,000 angstroms and (b) a non-magnetic layer having a thickness of about 10 angstroms to about 2,000 angstroms. Magnetic flux passes through a first magnetic layer parallel to a first easy axis of magnetization of the first magnetic layer and the magnetic flux passes through a second magnetic layer, disposed adjacent to the first magnetic layer, parallel to a second easy axis of magnetization of the second magnetic layer. The magnetic flux path extends through the first and second magnetic layers parallel to the first and second easy axes of magnetization, respectively. At least one orthogonal magnetic layer can be disposed laterally from the core such that the magnetic flux path extends through the orthogonal magnetic layer(s).
    Type: Application
    Filed: June 13, 2018
    Publication date: October 18, 2018
    Inventors: Noah Sturcken, Ryan Davies, Michael Lekas
  • Publication number: 20180295726
    Abstract: A structure comprises a semiconductor integrated circuit, an inductor, and a magnetic flux closure layer. The inductor is integrated into a multilevel wiring network in the semiconductor integrated circuit. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic flux closure layer is disposed within about 100 ?m of a face of the planar laminated magnetic core, the face of the planar magnetic core parallel to a principal plane of the planar laminated magnetic core. A second magnetic flux closure layer can be disposed within about 100 ?m of an opposing face of the planar laminated magnetic core.
    Type: Application
    Filed: June 13, 2018
    Publication date: October 11, 2018
    Inventors: Noah Sturcken, Ryan Davies, Michael Lekas
  • Publication number: 20180295725
    Abstract: A structure includes a semiconductor integrated circuit comprising a multilevel wiring network and an inductor integrated into the multilevel wiring network. The inductor includes a planar laminated magnetic core and a conductive winding that turns around in a generally spiral manner on the outside of the planar laminated magnetic core. The planar laminated magnetic core includes an alternating sequence of a magnetic layer and a non-magnetic layer. The magnetic layer comprises a ferromagnetic alloy having an iron composition of about 10 atomic percent to about 90 atomic percent.
    Type: Application
    Filed: June 13, 2018
    Publication date: October 11, 2018
    Inventors: Noah Sturcken, Ryan Davies, Michael Lekas