Patents by Inventor Michael Lekas

Michael Lekas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated Passive Devices and Assemblies Including Same
    Publication number: 20170290156
    Abstract: An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed.
    Type: Application
    Filed: March 29, 2016
    Publication date: October 5, 2017
    Inventors: Noah Sturcken, Ryan Davies, Hao Wu, Michael Lekas
  • MAGNETICALLY-COUPLED INDUCTORS ON INTEGRATED PASSIVE DEVICES AND ASSEMBLIES INCLUDING SAME
    Publication number: 20170290157
    Abstract: An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed. An inductor on an integrated passive device can configured and arranged such that it is magnetically coupled to an inductor on a structure such as a processor chip or a system on a chip.
    Type: Application
    Filed: January 17, 2017
    Publication date: October 5, 2017
    Inventors: Noah Sturcken, Ryan Davies, Hao Wu, Michael Lekas
  • Magnetically-coupled inductors on integrated passive devices and assemblies including same
    Patent number: 9781834
    Abstract: An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed. An inductor on an integrated passive device can configured and arranged such that it is magnetically coupled to an inductor on a structure such as a processor chip or a system on a chip.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: October 3, 2017
    Assignee: Ferric Inc.
    Inventors: Noah Sturcken, Ryan Davies, Hao Wu, Michael Lekas