Abstract: A security device (100, 600, 700, 1000, 1050) includes arrangements of image icons (110a, 110b, 615, 715, 1020), arrangements of refractive image icon focusing elements (120, 605, 705, 1010) and a sealing layer (125, 600, 1005), wherein the arrangements of refractive image icon focusing elements is disposed above the arrangements of image icons such that a portion of the arrangements of refractive image icon focusing elements projects a synthetic image, such that the arrangements of refractive image icon focusing elements contact the sealing layer along a non-planar boundary. Further, at least one of the arrangements of refractive image icon focusing elements and the sealing layer comprises an organic resin mixture having a first refractive index, and at least one of the arrangements of refractive image icon focusing elements and the sealing layer comprises a low-refractive index material, the low-refractive index material having a second refractive index.

Abstract: A security device includes an arrangement of image icon focusing elements, wherein each image icon focusing element of the arrangement of image icon focusing elements is associated with a focal path. The device further includes an image icon layer with one or more image icons associated with a first characteristic color and one or more image icons associated with a second characteristic color and one or more regions between the image icons comprising a volume of substantially colorless material. At a first viewing angle, a color is visible through each image icon focusing element, and the color visible through each image icon focusing element at the first viewing angle is based on one or more of the first characteristic color, the second characteristic color, or the substantially colorless material.

Abstract: A security device made up of a security film (130) having (i) an array of image elements (103); (ii) an array of focusing elements (106); and (iii) at least one anti-viscid agent (115), is provided. The array of focusing elements and the array of image elements are disposed relative to each other such that a synthetic image is projected by the security film when at least a portion of the array of image elements are viewed through at least a portion of the array of focusing elements. The anti-viscid agent is coupled with the array of focusing elements.

Abstract: A security device (100, 600, 700, 1000, 1050) includes arrangements of image icons (110a, 110b, 615, 715, 1020), arrangements of refractive image icon focusing elements (120, 605, 705, 1010) and a sealing layer (125, 600, 1005), wherein the arrangements of refractive image icon focusing elements is disposed above the arrangements of image icons such that a portion of the arrangements of refractive image icon focusing elements projects a synthetic image, such that the arrangements of refractive image icon focusing elements contact the sealing layer along a non-planar boundary. Further, at least one of the arrangements of refractive image icon focusing elements and the sealing layer comprises an organic resin mixture having a first refractive index, and at least one of the arrangements of refractive image icon focusing elements and the sealing layer comprises a low-refractive index material, the low-refractive index material having a second refractive index.

Abstract: A security device (100, 900) includes an arrangement of image icon focusing elements (120, 605, 705), wherein each image icon focusing element of the arrangement of image icon focusing elements is associated with a focal path. The device further includes an image icon layer with one or more image icons (110a, 909) associated with a first characteristic color and one or more image icons (110b, 911) associated with a second characteristic color, and one or more regions between image icons comprising a volume of substantially colorless material. At a first viewing angle, a color is visible through each image icon focusing element, and the color visible through each image icon focusing element at the first viewing angle is based on one or more of the first characteristic color, the second characteristic color, or the substantially colorless material.

Abstract: A security device made up of a security film (130) having (i) an array of image elements (103); (ii) an array of focusing elements (106); and (iii) at least one anti-viscid agent (115), is provided. The array of focusing elements and the array of image elements are disposed relative to each other such that a synthetic image is projected by the security film when at least a portion of the array of image elements are viewed through at least a portion of the array of focusing elements. The anti-viscid agent is coupled with the array of focusing elements.

Abstract: An adhesive suitable for use in security documents (for example, currency, passports, tickets, etc.) includes a plurality of polymers, that collectively exhibit tackification, resistance to aqueous agents, and solvent resistance, and a cross-linker selected to be activated to chemically react with one or more polymers of the plurality of polymers, at a temperature in a predetermined range of temperatures.

Abstract: Comfort packs and methods are provided for the delivery of drugs, especially liquid anesthetics, to the conjunctival fornix of the eye, using perilimbal anesthesia.

Abstract: The object of the present invention is to provide a system and method to enable a person wishing to quit smoking to carry with him a smoking cessation device that will assist the user in behavior modification, and in particular curbing and dealing with nicotine cravings. The current invention makes use of widely available and familiar infrastructure of hand held devices such as cellular phones and cellular networks. Other mobile devices having digital displays may also be used such as mobile touchscreens (i.e. Ipad, Kindle, etc.) digital music players such as the iPod and other similar devices. Smoking cessation and craving reduction are achieved through coordinated messaging reinforcement coupled with craving reduction training including controlled deep breathing exercises prompted by the device.

Abstract: A method of providing signal, power and ground through a through-silicon-via (TSV), and an integrated circuit chip having a TSV that simultaneously provides signal, power and ground. In one embodiment, the method comprises forming a TSV through a semiconductor substrate, including forming a via in the substrate; and forming a multitude of conductive bars in the via. The multitude of conductive bars include at least one signal bar, at least one power bar, and at least one ground bar. The method further comprises connecting the at least one power bar to a power voltage source to apply power through the TSV; connecting the at least one ground bar to a ground voltage; and connecting the at least one signal bar to a source of an electronic signal to conduct the signal through the TSV and to form a hybrid power-ground-signal TSV in the substrate.

Abstract: A method of providing signal, power and ground through a through-silicon-via (TSV), and an integrated circuit chip having a TSV that simultaneously provides signal, power and ground. In one embodiment, the method comprises forming a TSV through a semiconductor substrate, including forming a via in the substrate; and forming a multitude of conductive bars in the via. The multitude of conductive bars include at least one signal bar, at least one power bar, and at least one ground bar. The method further comprises connecting the at least one power bar to a power voltage source to apply power through the TSV; connecting the at least one ground bar to a ground voltage; and connecting the at least one signal bar to a source of an electronic signal to conduct the signal through the TSV and to form a hybrid power-ground-signal TSV in the substrate.

Abstract: A method of providing signal, power and ground through a through-silicon-via (TSV), and an integrated circuit chip having a TSV that simultaneously provides signal, power and ground. In one embodiment, the method comprises forming a TSV through a semiconductor substrate, including forming a via in the substrate; and forming a multitude of conductive bars in the via. The multitude of conductive bars include at least one signal bar, at least one power bar, and at least one ground bar. The method further comprises connecting the at least one power bar to a power voltage source to apply power through the TSV; connecting the at least one ground bar to a ground voltage; and connecting the at least one signal bar to a source of an electronic signal to conduct the signal through the TSV and to form a hybrid power-ground-signal TSV in the substrate.

Abstract: Provided are high-aspect ratio printable thick film metal paste compositions that can be deposited onto a substrate using, for example, screening printing techniques; and methods of preparing and using thick film printable metal pastes; and methods of screen printing of the thick film metal paste compositions onto a substrate to produce printed circuits, conductive lines or features on the substrate and/or a conductive surface on a solar cell device. Also provided are printed substrates containing an electronic feature produced by the high-aspect ratio printable thick film metal paste compositions.

Abstract: Provided are aerosol jet uncoated and coated (e.g., glass-coated) metal conductive ink compositions that can be deposited onto a substrate using, for example, aerosol jet printing and direct-write methods such as Aerosol Jet (e.g., Optomec M 3D) deposition and methods of aerosol jet deposition of the aerosol jet uncoated and coated metal conductive ink compositions. Also provided are aerosol jet UV curable dielectric ink compositions that exhibit transparency, storage stability, and very good print quality and print stability, thereby enabling the formation of very fine dielectric features on a variety of substrates.

Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

Abstract: Embodiments of the present invention address deficiencies of the art in respect to privacy compliance assessment for computer software and provide a method, system and computer program product for a privacy model framework for software applications. In one embodiment, a privacy modeling data processing system can be provided. The privacy modeling data processing system can include a modeling framework configured for communicative coupling to a software application. The modeling framework can capture information flows from requests to and responses from a coupled software application, and can rules-based process the captured information flows for privacy rules to generate a privacy compliance report for the software application.

Abstract: Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.

Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.