Abstract: A process for the production of an olefin oxide, which process comprises reacting a feed comprising an olefin and oxygen in a reactor tube in the presence of a silver-containing catalyst, wherein the presence of water in the catalyst bed is controlled such that the ratio of the partial pressure of water (PPH2O) divided by the vapor pressure of water (VPH2O) is less than 0.006, preferably less than 0.004.

Abstract: The present invention relates to a process for improving the overall selectivity of an EO process for converting ethylene to ethylene oxide utilizing a highly selective EO silver catalyst containing a rhenium promoter wherein following normal operation a chloride strip of the chloride on the surface of the catalyst is conducted in order to remove a portion of the chlorides on the surface of the catalyst. The chloride strip involves the addition of certain saturated hydrocarbons to the feed. Following the chloride strip, the catalyst is optionally re-optimized.

Abstract: A process for the production of an olefin oxide, which process comprises reacting a feed comprising an olefin and oxygen in a reactor tube in the presence of a silver-containing catalyst, wherein the presence of water in the catalyst bed is controlled such that the ratio of the partial pressure of water (PPH2O) divided by the vapor pressure of water (VPH2O) is less than 0.006, preferably less than 0.004.

Abstract: A reactor system for the oxidation of ethylene to ethylene oxide. The reactor system includes a reactor tube that contains a packed bed of shaped support material that can include a catalytic component. The shaped support material has a hollow cylinder geometric configuration. The reactor system has specific combinations of reactor tube and catalyst system geometries.

Abstract: A process for selecting shaped particles for use in a tube which is capable of being packed with shaped particles to form a packed bed in the tube. A desired value of one or more properties of the packed bed is defined. The dimensions of the shaped particles are calculated such that a packed bed in the tube of the shaped particles having the calculated dimensions meets or substantially meets the desired value(s), and shaped particles are selected in accordance with the calculated dimensions. The properties of the packed bed may be the volume fraction which is occupied by shaped particles, the packing density, and the resistivity for a gas flowing through the packed bed.

Abstract: A process is provided for the start-up of an ethylene epoxidation process comprising: (a) contacting a catalyst bed comprising a high selectivity epoxidation catalyst with a feed comprising ethylene, oxygen and an organic chloride for a period of time until an increase of at least 1×10?5 mole-% of vinyl chloride (calculated as the moles of vinyl chloride relative to the total gas mixture), preferably 2×10?5 mole-% of vinyl chloride is detected in a reactor outlet gas or a recycle gas loop; and (b) subsequently adjusting the quantity of organic chloride in the feed to a value sufficient to produce ethylene oxide at a substantially optimum selectivity.

Abstract: A high activity and high selectivity silver catalyst comprising silver and, optionally, one or more promoters supported on a suitable support material having the form of a shaped agglomerate. The structure of the shaped agglomerate is that of a hollow cylinder having a relatively small inside (bore) diameter. The catalyst is made by providing the shaped material of a particular geometry and incorporating the catalytic components therein. The catalyst is useful in the epoxidation of ethylene.

Abstract: The present invention relates to an improved epoxidation process and an improved epoxidation reactor. The present invention makes use of a reactor which comprises a plurality of microchannels. Such process microchannels may be adapted such that the epoxidation and optionally other processes can take place in the microchannels and that they are in a heat exchange relation with channels adapted to contain a heat exchange fluid. A reactor comprising such process microchannels is referred to as a “microchannel reactor”. The invention also provides a method of installing an epoxidation catalyst in a microchannel reactor. The invention also provides a method of preparing an epoxidation catalyst. The invention also provides an epoxidation catalyst. The invention also provides a certain process for the epoxidation of an olefin and a process for the preparation of a chemical derivable from an olefin oxide. The invention also provides a microchannel reactor.

Abstract: The present invention relates to an improved epoxidation process and an improved epoxidation reactor. The present invention makes use of a reactor which comprises a plurality of microchannels. Such process microchannels may be adapted such that the epoxidation and optionally other processes can take place in the microchannels and that they are in a heat exchange relation with channels adapted to contain a heat exchange fluid. A reactor comprising such process microchannels is referred to as a “microchannel reactor”. The invention also provides a method of installing an epoxidation catalyst in a microchannel reactor. The invention also provides a method of preparing an epoxidation catalyst. The invention also provides an epoxidation catalyst. The invention also provides a certain process for the epoxidation of an olefin and a process for the preparation of a chemical derivable from an olefin oxide. The invention also provides a microchannel reactor.

Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

Abstract: Embodiments of the present invention address deficiencies of the art in respect to privacy compliance assessment for computer software and provide a method, system and computer program product for a privacy model framework for software applications. In one embodiment, a privacy modeling data processing system can be provided. The privacy modeling data processing system can include a modeling framework configured for communicative coupling to a software application. The modeling framework can capture information flows from requests to and responses from a coupled software application, and can rules-based process the captured information flows for privacy rules to generate a privacy compliance report for the software application.

Abstract: Apparatus and methods are provided for constructing electronic package structures using LGA (land grid array) module-to-board connectors that are designed to provide higher count I/O interconnections by expanding LGA area, but without having to increase chip module footprint or reduce the pitch of area array I/O contacts of an LGA interposer or circuit board beyond practical limits.

Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

Abstract: A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by a stiffening frame. Due to the nature of the manufacturing of the system board, there can be significant gaps formed in the mounting area of the MCM between the board and the stiffener. A method is described that not only fills the void, it also, in addition promotes thermo conduction of excess heat away from the MCM and at the same time promotes enhanced electrical properties of the LGA connections of the MCM to the system board.

Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both, using a removable and restorable engineering change plug.

Abstract: A reactor system for the oxidation of ethylene to ethylene oxide. The reactor system includes a reactor tube that contains a packed bed of shaped support material that can include a catalytic component. The shaped support material has a hollow cylinder geometric configuration. The reactor system has specific combinations of reactor tube and catalyst system geometries.

Abstract: A multi-layer thin film structure having defined repair lines thereon and a method for repairing interconnections in the multi-layer thin film structure (MLTF) and/or making engineering charges (EC) are provided. The method comprises determining any interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, using lithography, e.g., direct write expose technology, to define the top surface connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization and repair lines using additive or substractive metallization techniques.