Abstract: Heat dissipation systems may include a base, a vapor chamber, and a plurality of cooling fins. The base may contact a top surface of a chip on a printed circuit board to be cooled. The vapor chamber may be planar and be coupled to and extend from the base so that the planar vapor chamber is perpendicular relative to the top surface of the chip. The vapor chamber is coupled to the base so that a first portion of the vapor chamber extends along the base in a first direction, and a second portion of the vapor chamber, adjacent to the first portion of the vapor chamber, extends in the first direction past an edge of the base in order to overhang the printed circuit board. Both the first portion and the second portion of the vapor chamber include the plurality of cooling fins.

Abstract: Heat dissipation systems may include a base, a vapor chamber, and a plurality of cooling fins. The base may contact a top surface of a chip on a printed circuit board to be cooled. The vapor chamber may be planar and be coupled to and extend from the base so that the planar vapor chamber is perpendicular relative to the top surface of the chip. The vapor chamber is coupled to the base so that a first portion of the vapor chamber extends along the base in a first direction, and a second portion of the vapor chamber, adjacent to the first portion of the vapor chamber, extends in the first direction past an edge of the base in order to overhang the printed circuit board. Both the first portion and the second portion of the vapor chamber include the plurality of cooling fins.

Abstract: The present technology relates to heat dissipation systems which may include vapor chambers. Vapor chambers may include top body portions and bottom body portions. A bottom body portion may include a first bottom side and a first perimeter wall extending from a perimeter of the first bottom side. The top body portion may be coupled to the first perimeter wall, and the bottom body portion may define an opening extending between a first inner surface and a first outer surface of the bottom side. Vapor chambers may also include an insert body formed separately from the bottom body portion. The insert body extends through the opening and is coupled to the bottom body portion. A sealed interior volume of the vapor chamber may comprise a first portion defined by the top body portion and the first bottom side; and a second portion defined by the opening and the insert body.

Abstract: Disclosed is a method of forming a combined vapor chamber and heat pipe assembly. A top plate of a vapor chamber may have one or more apertures, through which specially-shaped connectors can be inserted. Each connector may have a collar and flange, with the collar configured to be inserted into an aperture in the top plate. Once inserted, an open end of a heat pipe can be aligned and connected with the protruding portion of the collar. The connector joins the open end of the heat pipe with the top plate, and the heat pipe, connector, and top plate can be joined together to form a single unit. Afterwards, the top plate can be joined with the bottom plate in order to form the characteristic enclosure of a vapor chamber.

Abstract: Disclosed is a modular, floating core heatsink assembly used to transfer heat away from electronic components, such as computer chips. In particular, the floating core heatsink assembly may include a frame that can be fastened to a circuit board. The frame may have one or more apertures positioned over components of the circuit board. The assembly may also include one or more floating core heatsinks, which are configured to be dropped into the one or more apertures in the frame. The floating core heatsinks dissipate heat from the components of the circuit board without being thermally coupled to the frame.

Abstract: Disclosed is a method of forming a combined vapor chamber and heat pipe assembly. A top plate of a vapor chamber may have one or more apertures, through which specially-shaped connectors can be inserted. Each connector may have a collar and flange, with the collar configured to be inserted into an aperture in the top plate. Once inserted, an open end of a heat pipe can be aligned and connected with the protruding portion of the collar. The connector joins the open end of the heat pipe with the top plate, and the heat pipe, connector, and top plate can be joined together to form a single unit. Afterwards, the top plate can be joined with the bottom plate in order to form the characteristic enclosure of a vapor chamber.

Abstract: Various embodiments of the disclosure are directed to vapor chambers with a structure that permits configurable mounting holes. Such vapor chambers may have a top plate with apertures and a bottom plate with apertures. Spacers are inserted into the apertures and disposed between the top plate and the bottom plate. Each spacer may have their own aperture that extends throughout the spacer which acts as the mounting hole in the assembled vapor chamber. The various dimensions of the spacers can be configured and selected in order to accommodate varying dimensions of the apertures in the top plate and the bottom plate. These spacers can be used to provide mounting holes of a desired size and provide additional structure support to the vapor chamber. The spacers also lie flush with the top and bottom plates which increases the surface area of the vapor chamber and improves the mounting of the vapor chamber to other structures.

Abstract: Various embodiments of the disclosure are directed to vapor chambers with a structure that permits configurable mounting holes. Such vapor chambers may have a top plate with apertures and a bottom plate with apertures. Spacers are inserted into the apertures and disposed between the top plate and the bottom plate. Each spacer may have their own aperture that extends throughout the spacer which acts as the mounting hole in the assembled vapor chamber. The various dimensions of the spacers can be configured and selected in order to accommodate varying dimensions of the apertures in the top plate and the bottom plate. These spacers can be used to provide mounting holes of a desired size and provide additional structure support to the vapor chamber. The spacers also lie flush with the top and bottom plates which increases the surface area of the vapor chamber and improves the mounting of the vapor chamber to other structures.

Abstract: Disclosed are vapor chamber heatsinks for conducting heat away from electronic components, such as computer chips, in particular, the vapor chamber heatsink that includes a heatsink with cooling fins, a vapor chamber base having a vapor chamber, a thermal interface disposed on the vapor chamber base, and an internal frame. The interior of the vapor chamber is reinforced by a plurality of sleeved pillars disposed throughout the vapor chamber, which resist compressive forces exerted on the vapor chamber from mounting and prevent the vapor chamber from being crushed, even in the presence of compressive forces large enough to significantly reduce a thickness of the thermal interface. These sleeve pillars do not compromise the high thermal conductivity of the vapor chamber, which results is a vapor chamber heatsink that is capable of dissipating high thermal loads while withstanding high compressive forces.