Abstract: Systems and methods for providing identification patterns on substrates are described.

Abstract: Systems and methods for improving robust layer separation during the separation process of an imprint lithography process are described. Included are methods of matching strains between a substrate to be imprinted and the template, varying or modifying the forces applied to the template and/or the substrate during separation, or varying or modifying the kinetics of the separation process.

Abstract: The present application describes a template with feature profiles that have multiple sidewall angles. The multiple sidewall angles facilitate control over critical dimensions and reduce issues related to template release.

Abstract: An imprint lithography mold assembly includes a mold having a surface, a substrate having a surface, and a polymerizable composition disposed between the surface of the mold and the surface of the substrate. The polymerizable composition includes a bulk material and a non-ionic surfactant having a first end and a second end. The first end of the non-ionic surfactant has an affinity for the bulk material, and the second end of the non-ionic surfactant is fluorinated.

Abstract: Thickness of a residual layer may be altered to control critical dimension of features in a patterned layer provided by an imprint lithography process. The thickness of the residual layer may be directly proportional or inversely proportional to the critical dimension of features. Dispensing techniques and material selection may also provide control of the critical dimension of features in the patterned layer.

Abstract: Materials for forming an imprint lithography template may be etched at different rates based on physical properties of the layers. Additionally, reflectance of the materials may be monitored to provide substantially uniform erosion of the materials.

Abstract: A method of forming a lithographic template, the method including, inter alia, creating a multi-layered structure, by forming, on a body, a conducting layer, and forming on the conducting layer, a patterned layer having protrusions and recessions, the recessions exposing portions of the conducting layer; depositing a hard mask material anisotropically on the multi-layered structure covering a top surface of the patterned layer and the portions of the conducting layer; removing the patterned layer by a lift-off process, with the hard mask material remaining on the portions of the conducting layer; positioning a resist pattern on the multi-layered structure to define a region of the multi-layered structure; and selectively removing portions of the multi-layered structure in superimposition with the region using the hard mask material as an etching mask.

Abstract: Optical and optoelectronic articles incorporating an amorphous diamond-like film are disclosed. Specifically, the invention includes optical or optoelectronic articles containing an amorphous diamond-like film overlying two or more proximate substrates, and to methods of making optical and optoelectronic articles. In certain implementations, the film comprises at least about 30 atomic percent carbon, from about 0 to about 50 atomic percent silicon, and from about 0 to about 50 atomic percent oxygen on a hydrogen-free basis. Another embodiment includes optical or optoelectronic articles containing an amorphous diamond-like film that is further coated with a metallic or polymeric material for attachment to a device package.

Abstract: An imprint lithography template with an active area arranged to receive imprinting material during an imprint lithography process and a non-active area adjacent the active area is described. At least a portion of the non-active area is treated to inhibit flow of the imprinting material from the active area to the non-active area during the imprint lithography process.

Abstract: A molded plastic container, such as a five gallon pail, that includes a lid and main body that are selectively attachable to each other without a resilient gasket. The main body of the plastic container includes a flexible sealing finger formed along the top rim of the main body. The flexible sealing finger is received within a sealing chamber formed as part of the rim. The sealing chamber is defined by a gland seal such that when the lid is attached to the main body, both the flexible finger and the gland seal can deflect to create multiple sealing points between the flexible sealing finger and the sealing chamber. A latch ring is formed on the outer surface of the main body and engages a locking tab formed on the lid to hold the flexible finger in the sealing chamber.

Abstract: The present invention includes a composition for a silicon-containing material used as an etch mask for underlying layers. More specifically, the silicon-containing material may be used as an etch mask for a patterned imprinted layer comprising protrusions and recessions. To that end, in one embodiment of the present invention, the composition includes a hydroxyl-functional silicone component, a cross-linking component, a catalyst component, and a solvent. This composition allows the silicon-containing material to selectively etch the protrusions and the segments of the patterned imprinting layer in superimposition therewith, while minimizing the etching of the segments in superposition with the recessions, and therefore allowing an in-situ hardened mask to be created by the silicon-containing material, with the hardened mask and the patterned imprinting layer forming a substantially planarized profile.

Abstract: The present invention provides compositions that feature improved preferential adhesion and release characteristics with respect to a substrate and a mold having imprinting material disposed therebetween. To that end, the compositions facilitate bifurcation of the imprinting into a surfactant-component-rich sub-portion and a surfactant-component-depleted sub-portion located between said surfactant-component-rich sub-portion and said substrate. This surfactant-component-rich sub-portion attenuates the adhesion forces between the mold and the imprinting material, once solidified.

Abstract: The present invention features a method of patterning a substrate that includes forming, on the substrate, a multi-layer film with a surface, an etch rate interface and an etch-differential interface. The etch-differential interface is defined between the etch rate interface and the surface. A recorded pattern is transferred onto the substrate defined, in part, by the etch-differential interface.

Abstract: The present invention includes a composition for a silicon-containing material used as an etch mask for underlying layers. More specifically, the silicon-containing material may be used as an etch mask for a patterned imprinted layer comprising protrusions and recessions. To that end, in one embodiment of the present invention, the composition includes a hydroxyl-functional silicone component, a cross-linking component, a catalyst component, and a solvent. This composition allows the silicon-containing material to selectively etch the protrusions and the segments of the patterned imprinting layer in superimposition therewith, while minimizing the etching of the segments in superposition with the recessions, and therefore allowing an in-situ hardened mask to be created by the silicon-containing material, with the hardened mask and the patterned imprinting layer forming a substantially planarized profile.

Abstract: Optical and optoelectronic articles incorporating an amorphous diamond-like film are disclosed. Specifically, the invention includes optical or optoelectronic articles containing an amorphous diamond-like film overlying two or more proximate substrates, and to methods of making optical and optoelectronic articles. In certain implementations, the film comprises at least about 30 atomic percent carbon, from about 0 to about 50 atomic percent silicon, and from about 0 to about 50 atomic percent oxygen on a hydrogen-free basis. Another embodiment includes optical or optoelectronic articles containing an amorphous diamond-like film that is further coated with a metallic or polymeric material for attachment to a device package.

Abstract: The present invention features a method of patterning a substrate that includes forming, on the substrate, a multi-layer film defining an etch rate interface having a plurality of first portions that having a first etch rate associated therewith. The multi-layer film includes a second portion having a second etch rate associated therewith. Adjacent first portions are separated by the second portion. A pattern is transferred onto the substrate that is defined, in part, by the junction. The difference between the first and second etch rates is selected to minimize bowing of recessed features formed in the pattern.

Abstract: A method for making a fine electrically conductive grid embedded in a polymer substrate. The method includes the steps of providing a polymer substrate, forming a pattern of grooves in the substrate, filling the grooves with electrically conductive powder, and then applying heat and/or pressure to the substrate. The application of heat and/or pressure to the substrate causes the grooves to collapse inward against the conductive powder. Collapsing the grooves compacts the conductive powder within the groove, thereby establishing a continuously conductive grid line or circuit. The narrow grid lines that result allow more light to transmit through the substrate. The method allows grid lines to be made with higher aspect ratios (ratio of line depth to line width) than is possible by previous methods.

Abstract: A laser imageable article includes an imageable layer that comprises the reaction product of a metal precursor and a reactant. The imageable article also includes a first boundary layer on a first side of the imageable layer, the first boundary layer being substantially transparent to laser radiation, and a second boundary layer on a second side of the imageable layer. The imageable layer may be imaged with a laser through the first boundary layer while maintaining the continuity of the first boundary layer. In a preferred embodiment, the imageable layer comprises the reaction product of an ion of one or more metals selected from columns 8, 9, and 10 of the periodic table of elements and a reducing agent selected from hypophosphorus acid and salts thereof, sodium borohydride, and dimethylamine borane. One preferred embodiment of the imageable layer comprises from 1 to 30 mole percent phosphorus and up to 99 mole percent nickel.

Abstract: A method for making a fine electrically conductive grid embedded in a polymer substrate. The method includes the steps of providing a polymer substrate, forming a pattern of grooves in the substrate, filling the grooves with electrically conductive powder, and then applying heat and/or pressure to the substrate. The application of heat and/or pressure to the substrate causes the grooves to collapse inward against the conductive powder. Collapsing the grooves compacts the conductive powder within the groove, thereby establishing a continuously conductive grid line or circuit. The narrow grid lines that result allow more light to transmit through the substrate. The method allows grid lines to be made with higher aspect ratios (ratio of line depth to line width) than is possible by previous methods.

Abstract: A method for making a fine electrically conductive grid embedded in a polymer substrate. The method includes the steps of providing a polymer substrate, forming a pattern of grooves in the substrate, filling the grooves with electrically conductive powder, and then applying heat and/or pressure to the substrate. The application of heat and/or pressure to the substrate causes the grooves to collapse inward against the conductive powder. Collapsing the grooves compacts the conductive powder within the groove, thereby establishing a continuously conductive grid line or circuit. The narrow grid lines that result allow more light to transmit through the substrate. The method allows grid lines to be made with higher aspect ratios (ratio of line depth to line width) than is possible by previous methods.