Abstract: A microelectronic assembly including a dielectric region, a plurality of electrically conductive elements, an encapsulant, and a microelectronic element are provided. The encapsulant may have a coefficient of thermal expansion (CTE) no greater than twice a CTE associated with at least one of the dielectric region or the microelectronic element.

Abstract: Systems and methods for generating electrical power using a solar power system comprising pressurized pipes for transporting liquid water. The pressurized pipes flow through solar collectors which concentrate sunlight on the water flowing through the pipes. The pressurization in the pipes allows the water flowing through the pipes to absorb large quantities of energy. The pressurized and heated water is then pumped to a heat exchanger coil where the thermal energy is released to produce steam for powering a steam turbine electrical generator. Thereafter, the water is returned to the solar collectors in a closed loop to repeat the process.

Abstract: Systems and methods for generating electrical power using a solar power system that comprises a pressurized closed loop pipe containing a transfer liquid extending between a solar collector and a heat exchanger. The transfer liquid is heated by the solar collector and gives up its thermal energy at the heat exchange to produce steam. The system also includes a source of geothermal energy and a source of natural gas. The geothermal energy in the form of heat separates the natural gas from the ground water in a separation tank. At the resulting heated ground water from the separation tank is connected to the heat exchanger to supplement thermal energy from the solar collector.

Abstract: A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.

Abstract: First metadata for a first version of a computer program product and a first metadata schema is converted into second metadata for a second version of the computer program product and/or a second metadata schema. The converting may be performed by recursively processing an object class structure representing the second metadata, to construct objects and their contents pursuant to a set of ID references for the second metadata. The recursive processing may be performed by repeatedly calling methods of an object in the object class structure to populate the content of the object using the set of ID references. The repeatedly calling may be performed using object reflection. Related methods, systems and computer programs are described.

Abstract: Microelectronic assemblies and methods for making the same are disclosed herein. In one embodiment, a method of forming a microelectronic assembly comprises assembling first and second components to have first major surfaces of the first and second components facing one another and spaced apart from one another by a predetermined spacing, the first component having first and second oppositely-facing major surfaces, a first thickness extending in a first direction between the first and second major surfaces, and a plurality of first metal connection elements at the first major surface, the second component having a plurality of second metal connection elements at the first major surface of the second component; and plating a plurality of metal connector regions each connecting and extending continuously between a respective first connection element and a corresponding second connection element opposite the respective first connection element in the first direction.

Abstract: Systems and methods for generating electrical power using a solar power system comprising pressurized pipes for transporting liquid water. The pressurized pipes flow through solar collectors which concentrate sunlight on the water flowing through the pipes. The pressurization in the pipes allows for the water flowing therethrough to absorb large quantities of energy. The pressurized and heated water is then pumped to a heat exchanger where the thermal energy is released to produce steam for powering a steam turbine electrical generator. Thereafter, the water is returned to the solar collectors in a closed loop to repeat the process.

Abstract: A method and apparatus are disclosed for localizing a vehicle along a route. The method comprises initially surveying the route to be traversed by the vehicle by creating a plurality of orthographic images of the route, at a plurality of locations along the route and subsequently passing the vehicle along the route while obtaining a current view of the route. The method further comprises resolving a pose of the vehicle relative to a survey trajectory by maximizing a relation between the orthographic images and the current view.

Abstract: Microelectronic assemblies and methods for making the same are disclosed herein. In one embodiment, a method of forming a microelectronic assembly comprises assembling first and second components to have first major surfaces of the first and second components facing one another and spaced apart from one another by a predetermined spacing, the first component having first and second oppositely-facing major surfaces, a first thickness extending in a first direction between the first and second major surfaces, and a plurality of first metal connection elements at the first major surface, the second component having a plurality of second metal connection elements at the first major surface of the second component; and plating a plurality of metal connector regions each connecting and extending continuously between a respective first connection element and a corresponding second connection element opposite the respective first connection element in the first direction.

Abstract: Structures and methods of forming the same are disclosed herein. In one embodiment, a structure can comprise a region having first and second oppositely facing surfaces. A barrier region can overlie the region. An alloy region can overlie the barrier region. The alloy region can include a first metal and one or more elements selected from the group consisting of silicon (Si), germanium (Ge), indium (Id), boron (B), arsenic (As), antimony (Sb), tellurium (Te), or cadmium (Cd).

Abstract: Methods of forming a microelectronic assembly and the resulting structures and devices are disclosed herein. In one embodiment, a method of forming a microelectronic assembly includes removing material exposed at portions of a surface of a substrate to form a processed substrate having a plurality of thinned portions separated by integral supporting portions of the processed substrate having a thickness greater than a thickness of the thinned portions, at least some of the thinned portions including a plurality of electrically conductive interconnects extending in a direction of the thicknesses of the thinned portions and exposed at the surface; and removing the supporting portions of the substrate to sever the substrate into a plurality of individual thinned portions, at least some individual thinned portions including the interconnects.

Abstract: Microelectronic elements and methods of their manufacture are disclosed. A microelectronic element may include a substrate including an opening extending through a semiconductor region of the substrate, a dielectric layer cover a wall of the opening within at least a first portion of the opening, a first metal disposed within the first portion of the opening, a second metal disposed within a second portion of the opening. The second metal may form at least part of a contact of the microelectronic element.

Abstract: A method of determining extrinsic calibration parameters for at least one sensor (102, 104, 106) mounted on transportable apparatus (100). The method includes receiving (202) data representing pose history of the transportable apparatus and receiving (202) sensor data from at least one sensor mounted on transportable apparatus. The method generates (204) at least one point cloud data using the sensor data received from the at least one sensor, each point in a said point cloud having a point covariance derived from the pose history data. The method then maximizes (206) a value of a quality function for the at least one point cloud, and uses (208) the maximized quality function to determine extrinsic calibration parameters for the at least one sensor.

Abstract: An interposer has conductive elements at a first side and terminals at a second side opposite therefrom, for connecting with a microelectronic element and a second component, respectively. The component includes a first element having a thermal expansion coefficient less than 10 ppm/° C., and an insulating second element, with a plurality of openings extending from the second side through the second element towards the first element. A conductive structure extending through the openings in the second element and through the first element electrically connects the terminals with the conductive elements.

Abstract: A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.

Abstract: A mounting system for mounting photovoltaic panels on a support structure. The mounting system comprises photovoltaic panel frames in which the photovoltaic panels are mounted, panel support rails, and mounting brackets or cross beams for supporting the panel support rails. The panel frames have inwardly extending panel frame extensions on their back side. The panel support rails are mounted on the support structure with either pivoting brackets or cross beams. In either case, the support rails have pairs of stationary clamps and movable clamps with clamp lips that engage the panel frame extensions of the panel frames.

Abstract: A method for use in a simplified login system, involving operating a computer to identify user name, password and submit fields on a remote website. The method comprises identifying a password field on a webpage, defining a first area around the password field for a user name field and a second area around the password field for a submit field, locating a field for user text entry in the first area and locating a field for a user click entry in the second field. There is also described a computer programmed to carry out the method, a data carrier containing program data by which a computer may be programmed to carry out the method, and a secure password storage and login system comprising a central server and a number of user computers, and which operates using the method.

Abstract: An interposer has conductive elements at a first side and terminals at a second side opposite therefrom, for connecting with a microelectronic element and a second component, respectively. The component includes a first element having a thermal expansion coefficient less than 10 ppm/° C., and an insulating second element, with a plurality of openings extending from the second side through the second element towards the first element. A conductive structure extending through the openings in the second element and through the first element electrically connects the terminals with the conductive elements.

Abstract: Generating a 3D reconstruction of an environment around a monitoring-unit as that monitoring-unit is moved through the environment: a) providing at least a camera and a LIDAR sensor, each being controlled by independent clocks; b) using the camera to determine the trajectory of the monitoring-unit and determining a first time series using the clock of the camera, where the first time series details when the monitoring-unit was at predetermined points of the trajectory; c) recording the returns from the LIDAR sensor and determining a second time series using the clock of the LIDAR sensor, where the second time series details when each scan from the LIDAR was taken; d) using a timer to relate the first and second series in order to match the return from the LIDAR sensor to the point on the trajectory at which the return was received; and e) creating the 3D reconstruction based upon the LIDAR returns using information from the two time series.

Abstract: A method of detecting the structural elements within a scene sensed by at least one sensor within a locale, the method comprising: a) capturing data from the sensor, which data provides a first representation of the sensed scene at the current time; b) generating a second representation of the sensed scene where the second representation is generated from a prior model of the locale; and c) comparing the first and second representations with one another to determine which parts of the first representation represent structural elements of the locale.