Abstract: A microelectromechanical system (MEMS) includes a diaphragm with a first surface and a second surface. The first surface is exposed to an environmental pressure. The second surface comprises a plurality of fingers extending from the second surface. The MEMS also includes a backplate comprising a plurality of voids. Each of the plurality of fingers extends into a respective one of the plurality of voids. The MEMS further includes an insulator between a portion of the diaphragm and a portion of the backplate. The diaphragm is configured to move with respect to the backplate in response to changes in the environmental pressure.

Abstract: The present invention is directed to a method for the fabrication of electron field emitter devices, including carbon nanotube (CNT) field emission devices. The method of the present invention involves depositing one or more electrically conductive thin-film layers onto a electrically conductive substrate and performing lithography and etching on these thin film layers to pattern them into the desired shapes. The top-most layer may be of a material type that acts as a catalyst for the growth of single- or multiple-walled carbon nanotubes (CNTs). Subsequently, the substrate is etched to form a high-aspect ratio post or pillar structure onto which the previously patterned thin film layers are positioned. Carbon nanotubes may be grown on the catalyst material layer. The present invention also described methods by which the individual field emission devices may be singulated into individual die from a substrate.

Abstract: A water filtration system may include a first receptacle configured to store source water, a second receptacle configured to store supply water, an RO filter disposed between the first receptacle and the second receptacle, and a bypass line configured to provide water from the RO filter back to the first receptacle for an initial predetermined amount of time, after which the bypass line is closed and the filtered water is provided to the second receptacle.

Abstract: The present invention is directed to a method for the fabrication of electron field emitter devices, including carbon nanotube (CNT) field emission devices. The method of the present invention involves depositing one or more electrically conductive thin-film layers onto a electrically conductive substrate and performing lithography and etching on these thin film layers to pattern them into the desired shapes. The top-most layer may be of a material type that acts as a catalyst for the growth of single- or multiple-walled carbon nanotubes (CNTs). Subsequently, the substrate is etched to form a high-aspect ratio post or pillar structure onto which the previously patterned thin film layers are positioned. Carbon nanotubes may be grown on the catalyst material layer. The present invention also described methods by which the individual field emission devices may be singulated into individual die from a substrate.

Abstract: The invention is directed to point of use devices and appliances for alkalizing and/or adjusting the oxidation/reduction potential of water that is to be ingested. The devices comprise straws, carafes, countertop units, water bottle units and any other devices that will treat the water at the point of use. The water will flow through the point of use devices or appliances longitudinally or radially. The point of use device or appliance will contain an alkalizing formulation that will increase the pH of the water to preferably above about 8 and the oxidation/reduction potential to about ?100 and ?700. The amount of water that can be treated will depend on the amount of the oxidation/reduction potential and alkalizing formulations used and the size and capacity of the device or appliance for the alkalizing and oxidation/reduction potential formulations. The alkalizing formulation will supply to the water being treated one or more of potassium, calcium and magnesium ions.

Abstract: Methods, systems, and apparatuses for preventing corrosion between dissimilar bonded metals. The method includes providing a wafer having a plurality of circuits, each of the plurality of circuits having a plurality of bond pads including a first metal; applying a coating onto at least the plurality of bond pads; etching a hole in the coating on each of the plurality of bond pads to provide an exposed portion of the plurality of bond pads; dicing the wafer to separate each of the plurality of circuits; die bonding each of the plurality of circuits to a respective packaging substrate; and performing a bonding process to bond a second, dissimilar metal to the exposed portion of each of the plurality of bond pads such that the second, dissimilar metal encloses the hole in the coating of each of the plurality of bond pads, thereby enclosing the exposed portion.

Abstract: An orthotic device for insertion into footwear for correcting over pronation or supination of a foot is disclosed herein. The orthotic device may include an insole comprising an upper surface and a lower surface. The upper surface of the insole may receive and support at least a portion of the foot. The orthotic device also may include a removable angle insert attachable to the lower surface of the insole. The removable angle insert may increase an angle about a side of the insole to correct over pronation or supination of the foot.

Abstract: An orthotic device for insertion into footwear for correcting over pronation or supination of a foot is disclosed herein. The orthotic device may include an insole comprising an upper surface and a lower surface. The upper surface of the insole may receive and support at least a portion of the foot. The orthotic device also may include a removable angle insert attachable to the lower surface of the insole. The removable angle insert may increase an angle about a side of the insole to correct over pronation or supination of the foot.

Abstract: A method or process is disclosed for etching deep, high-aspect ratio features into silicon dioxide material layers and substrates, including glass, fused silica, quartz, or similar materials, using a plasma etch technology. The method has application in the fabrication and manufacturing of MEMS, microelectronic, micro-mechanical, photonic and nanotechnology devices in which silicon dioxide material layers or substrates are used and must be patterned and etched. Devices that benefit from the method described in this invention include the fabrication of MEMS gyroscopes, resonators, oscillators, microbalances, accelerometers, for example. The etch method or process allows etch depths ranging from below 10 microns to over 1 millimeter and aspect ratios from less than 1 to 1 to over 10 to 1 with etched feature sidewalls having vertical or near vertical angles. Additionally, the disclosed method provides requirements of the etched substrates to reduce or eliminate undesired effects of an etch.

Abstract: A water filtration systems may comprise an under the sink RO water filtration system that is plumed into a building's water supply. For example, the water filtration systems may include an RO device at least partially installed underneath a sink, with the tap water connection plumbed directly to the sink cold water supply line, and a waste water drain line connected directly to the sink drain, such as the p-trap.

Abstract: A water filtration systems may comprise an under the sink RO water filtration system that is plumed into a building's water supply. For example, the water filtration systems may include an RO device at least partially installed underneath a sink, with the tap water connection plumbed directly to the sink cold water supply line, and a waste water drain line connected directly to the sink drain, such as the p-trap.

Abstract: A water filtration systems may comprise an under the sink RO water filtration system that is plumed into a building's water supply. For example; the water filtration systems may include an RO device at least partially installed underneath a sink, with the tap water connection plumbed directly to the sink cold water supply line, and a waste water drain line connected directly to the sink drain, such as the p-trap.

Abstract: There is disclosed a unique water treatment system which incorporates a unique primary valve. The primary valve comprises an interconnected first part and second part. The first part attaches to a water source and provides untreated water to water treatment units which are controlled by the second part of the primary valve. Untreated water flows to a first water treatment unit and subsequently through a valve to the second part of the primary valve and to use or to a second water treatment unit. From the second water treatment unit the water flows to the second part of the primary valve and to use. The second part of the primary valve has a unique bore and slideable shaft valve structure. The water treatment units can purify the water and/or add substances to the water.

Abstract: An orthotic device for insertion into footwear for correcting over pronation or supination of a foot is disclosed herein. The orthotic device may include an insole comprising an upper surface and a lower surface. The upper surface of the insole may receive and support at least a portion of the foot. The orthotic device also may include a removable angle insert attachable to the lower surface of the insole. The removable angle insert may increase an angle about a side of the insole to correct over pronation or supination of the foot.

Abstract: A dynamic pattern generator (DPG) device and method of making a DPG device are disclosed. The DPG device is used in semiconductor processing tools that require multiple electron-beams, such as direct-write lithography. The device is a self-aligned DPG device that enormously reduces the required tolerances for aligning the various electrode layers, as compared to other design configurations including the non-self-aligned approach and also greatly simplifies the process complexity and cost. A process sequence for both integrated and non-integrated versions of the self-aligned DPG device is described. Additionally, an advanced self-aligned DPG device that eliminates the need for a charge dissipating coating or layer to be used on the device is described. Finally, a fabrication process for the implementation of both integrated and non-integrated versions of the advanced self-aligned DPG device is described.

Abstract: The water filtration system may include a support base. A first receptacle may be detachably disposed on the support base and configured to store source water. A second receptacle may be detachably disposed on the support base and configured to store supply water. A filter system may be disposed between the first receptacle and the second receptacle.

Abstract: The water filtration system may include a support base. A first receptacle may be detachably disposed on the support base and configured to store source water. A second receptacle may be detachably disposed on the support base and configured to store supply water. A filter system may be disposed between the first receptacle and the second receptacle.

Abstract: An acoustic sensing apparatus includes a diaphragm; a support structure surrounding the diaphragm and a gap disposed there between, the diaphragm and support structure separating a front volume and a back volume; one or more cantilevers disposed in the gap and between the diaphragm and the support structure, a first end of each of the cantilevers coupled to the support structure and being non-moving, and a second end of each of the cantilevers being free to move; a sealing material covering at least the gap between the diaphragm and the support structure, the sealing material creating an acoustic seal between the front volume and the back volume; and a sensor that converts a diaphragm movement into an electrical signal. The second end of each of the cantilevers is coupled to the sealing material.