Patents by Inventor Michael R. Rice

Michael R. Rice has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12211714
    Abstract: A mainframe of a device fabrication system comprises a base and a plurality of facets on the base. Each facet of the plurality of facets comprises a frame. The mainframe further comprises a plurality of replaceable interface plates. Each replaceable interface plate of the plurality of replaceable interface plates is attached to a respective facet such that at most one replaceable interface plate is attached to each facet. At least one replaceable interface plate comprises one or more access ports. The mainframe further comprises a lid over the plurality of facets. The base, the lid and the plurality of facets with the attached plurality of replaceable interface plates together define an interior volume of the mainframe. The mainframe further comprises a robot arm in the interior volume.
    Type: Grant
    Filed: May 17, 2021
    Date of Patent: January 28, 2025
    Assignee: Applied Materials, Inc.
    Inventor: Michael R. Rice
  • Patent number: 12209307
    Abstract: Disclosed herein is a rare-earth oxide coating on a surface of an article with one or more interruption layers to control crystal growth and methods of its formation. The coating may be deposited by atomic layer deposition and/or by chemical vapor deposition. The rare-earth oxides in the coatings disclosed herein may have an atomic crystalline phase that is different from the atomic crystalline phase or the amorphous phase of the one or more interruption layers.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: January 28, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Xiaowei Wu, Jennifer Y. Sun, Michael R. Rice
  • Patent number: 12205843
    Abstract: Disclosed herein is a substrate support assembly having a ground electrode mesh disposed therein along a side surface of the substrate support assembly. The substrate support assembly has a body. The body has an outer top surface, an outer side surface and an outer bottom surface enclosing an interior of the body. The body has a ground electrode mesh disposed in the interior of the body and adjacent the outer side surface, wherein the ground electrode does not extend through to the outer top surface or the outer side surface.
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: January 21, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Michael R. Rice, Vijay D. Parkhe
  • Publication number: 20240429088
    Abstract: Apparatuses including a height-adjustable edge ring, and methods for use thereof are described herein. In one example, a process kit for processing a substrate is provided. The process kit has a support ring comprising an upper surface having an inner edge disposed at a first height and an outward edge disposed at a second height less than the first height, the inner edge having a greater thickness than the outward edge. An edge ring is disposed on the support ring, an inner surface of the edge ring interfaced with the inner edge of the support ring. A cover ring is disposed outward of the edge ring, the edge ring independently moveable relative to the support ring and the cover ring. Push pins are disposed inward of the cover ring, the push pins operable to elevate the edge ring while constraining radial movement of the support ring.
    Type: Application
    Filed: September 3, 2024
    Publication date: December 26, 2024
    Inventors: Michael R. RICE, Yogananda SARODE VISHWANATH, Sunil SRINIVASAN, Rajinder DHINDSA, Steven E. BABAYAN, Olivier LUERE, Denis Martin KOOSAU, Imad YOUSIF
  • Publication number: 20240420926
    Abstract: Methods and apparatus for coating processing reactor component parts are provided herein. In some embodiments, a method for coating a part via atomic layer deposition includes: fastening a workpiece to be coated to an interior volume facing portion of a part coating reactor; and performing an ALD process on the fastened workpiece within the part coating reactor.
    Type: Application
    Filed: August 26, 2024
    Publication date: December 19, 2024
    Inventors: Michael R. RICE, Hanish Kumar PANAVALAPPIL KUMARANKUTTY, Steven D. MARCUS, Kirubanandan Naina SHANMUGAM, Sriharsha DHARMAPURA SATHYANARAYANAMURTHY, Madhukar KRISHNA, Shivaprakash Padadayya HIREMATH, Senthil Kumar NATTAMAI SUBRAMANIAN, Sankar Menon CHERUBALA PATHAYAPURA
  • Publication number: 20240401197
    Abstract: Embodiments of the present disclosure relate to articles, coated articles and methods of coating such articles with a rare earth metal containing fluoride coating. The coating can contain at least a first metal (e.g., a rare earth metal, tantalum, zirconium, etc.) and a second metal that have been co-deposited onto a surface of the article. The coating can include a homogenous mixture of the first metal and the second metal and does not contain mechanical segregation between layers in the coating.
    Type: Application
    Filed: August 13, 2024
    Publication date: December 5, 2024
    Inventors: Xiaowei WU, Jennifer Y. Sun, Michael R. Rice
  • Patent number: 12159796
    Abstract: Devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a load lock disposed within the interior volume of the factory interface, and a factory interface robot disposed within the interior volume of the factory interface, wherein the factory interface robot is configured to transfer substrates between a set of substrate carriers and the load lock.
    Type: Grant
    Filed: February 9, 2023
    Date of Patent: December 3, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Jacob Newman, Andrew J. Constant, Michael R. Rice, Paul B. Reuter, Shay Assaf, Sushant S. Koshti
  • Patent number: 12142500
    Abstract: A platform is of a side storage pod. The platform includes an upper surface and kinematic pins extending from the upper surface within a chamber of the side storage pod to engage a lower surface of a side storage container in the chamber to level the side storage container in the chamber.
    Type: Grant
    Filed: March 2, 2023
    Date of Patent: November 12, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Devendra Channappa Holeyannavar, Sandesh Doddamane Ramappa, Dean C. Hruzek, Michael R. Rice, Jeffrey A. Brodine
  • Patent number: 12142508
    Abstract: A factory interface for an electronic device manufacturing system can include a load lock disposed within the interior volume of a factory interface and a factory interface robot disposed within the interior volume of the factory interface. The factory interface robot can be configured to transfer substrates between a first set of substrate carriers and the first load lock. The factory interface robot can comprise a vertical tower, a plurality of links, and an end effector.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: November 12, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Sushant S. Koshti, Paul B. Reuter, David Phillips, Jacob Newman, Andrew J. Constant, Michael R. Rice, Shay Assaf, Srinivas Poshatrahalli Gopalakrishna, Devendra Channappa Holeyannavar, Douglas B. Baumgarten, Arunkumar Ramachandraiah, Narayanan Ramachandran
  • Publication number: 20240337020
    Abstract: The present disclosure generally relates to gas inject apparatus for a process chamber for processing of semiconductor substrates. The gas inject apparatus include one or more gas injectors which are configured to be coupled to the process chamber. Each of the gas injectors are configured to receive a process gas and distribute the process gas across one or more gas outlets. The gas injectors include a plurality of pathways, a fin array, and a baffle array. The gas injectors are individually heated. A gas mixture assembly is also utilized to control the concentration of process gases flown into a process volume from each of the gas injectors. The gas mixture assembly enables the concentration as well as the flow rate of the process gases to be controlled.
    Type: Application
    Filed: June 19, 2024
    Publication date: October 10, 2024
    Inventors: Tetsuya ISHIKAWA, Swaminathan T. SRINIVASAN, Matthias BAUER, Ala MORADIAN, Manjunath SUBBANNA, Kartik Bhupendra SHAH, Errol Antonio C. SANCHEZ, Sohrab ZOKAEI, Michael R. RICE, Peter REIMER
  • Patent number: 12094752
    Abstract: Apparatuses including a height-adjustable edge ring, and methods for use thereof are described herein. In one example, a process kit for processing a substrate is provided. The process kit has a support ring comprising an upper surface having an inner edge disposed at a first height and an outward edge disposed at a second height less than the first height, the inner edge having a greater thickness than the outward edge. An edge ring is disposed on the support ring, an inner surface of the edge ring interfaced with the inner edge of the support ring. A cover ring is disposed outward of the edge ring, the edge ring independently moveable relative to the support ring and the cover ring. Push pins are disposed inward of the cover ring, the push pins operable to elevate the edge ring while constraining radial movement of the support ring.
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: September 17, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Michael R. Rice, Yogananda Sarode Vishwanath, Sunil Srinivasan, Rajinder Dhindsa, Steven E. Babayan, Olivier Luere, Denis M. Koosau, Imad Yousif
  • Patent number: 12091749
    Abstract: Embodiments described herein include processes and apparatuses relate to epitaxial deposition. A method for epitaxially depositing a material is provided and includes positioning a substrate on a substrate support surface of a susceptor within a process volume of a chamber body, where the process volume contains upper and lower chamber regions. The method includes flowing a process gas containing one or more chemical precursors from an upper gas inlet on a first side of the chamber body, across the substrate, and to an upper gas outlet on a second side of the chamber body, flowing a purge gas from a lower gas inlet on the first side of the chamber body, across the lower surface of the susceptor, and to a lower gas outlet on the second side of the chamber body, and maintaining a pressure of the lower chamber region greater than a pressure of the upper chamber region.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: September 17, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Tetsuya Ishikawa, Swaminathan T. Srinivasan, Matthias Bauer, Manjunath Subbanna, Ala Moradian, Kartik Bhupendra Shah, Errol Antonio C Sanchez, Michael R. Rice, Peter Reimer, Marc Shull
  • Patent number: 12074010
    Abstract: Methods and apparatus for coating processing reactor component parts are provided herein. In some embodiments, a part coating reactor includes: a lower body and a lid assembly that together define and enclose an interior volume; one or more heaters disposed in the lid assembly; one or more coolant channels disposed in the lid assembly to flow a heat transfer medium therethrough; a plurality of gas passages disposed through the lid assembly to facilitate providing one or more gases to the interior volume, wherein the plurality of gas passages include a plurality of fluidly independent plenums disposed in the lid assembly; and one or more mounting brackets to facilitate coupling a workpiece to the lid assembly.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: August 27, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Michael R. Rice, Hanish Kumar Panavalappil Kumarankutty, Steven D. Marcus, Kirubanandan Naina Shanmugam, Sriharsha Dharmapura Sathyanarayanamurthy, Madhukar Krishna, Shivaprakash Padadayya Hiremath, Senthil Kumar Nattamai Subramanian, Sankar Menon Cherubala Pathayapura
  • Patent number: 12060651
    Abstract: The present disclosure generally relates to a process chamber for processing of semiconductor substrates. The process chamber includes an upper lamp assembly, a lower lamp assembly, a substrate support, an upper window disposed between the substrate support and the upper lamp assembly, a lower window disposed between the lower lamp assembly and the substrate support, an inject ring, and a base ring. Each of the upper lamp assembly and the lower lamp assembly include vertically oriented lamp apertures for the placement of heating lamps therein. The inject ring includes gas injectors disposed therethrough and the base ring includes a substrate transfer passage, a lower chamber exhaust passage, and one or more upper chamber exhaust passages. The gas injectors are disposed over the substrate transfer passage and across from the lower chamber exhaust passage and the one or more upper chamber exhaust passages.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: August 13, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Tetsuya Ishikawa, Swaminathan T. Srinivasan, Kartik Bhupendra Shah, Ala Moradian, Manjunath Subbanna, Matthias Bauer, Peter Reimer, Michael R. Rice
  • Publication number: 20240254655
    Abstract: A method and apparatus for processing substrates suitable for use in semiconductor manufacturing. The method includes heating a substrate positioned on a substrate support. The method includes flowing a purge gas over an isolation plate disposed above the substrate, the flowing the purge gas including diverting a portion of the purge gas below the isolation plate through a plurality of perforations in the isolation plate. The method includes flowing one or more process gases over the substrate to deposit a material on the substrate, the flowing of the one or more process gases over the substrate comprising guiding the one or more process gases through one or more flow paths defined at least in part by a space between the isolation plate and the substrate.
    Type: Application
    Filed: April 27, 2023
    Publication date: August 1, 2024
    Applicant: Applied Materials, Inc.
    Inventors: Zhepeng CONG, Tao SHENG, Errol Antonio C. SANCHEZ, Michael R. RICE, Nimrod SMITH, Ashur J. ATANOS
  • Patent number: 12049696
    Abstract: A lid or other chamber component for a process chamber comprises a) at least one surface comprising a first ceramic material, wherein the first ceramic material comprises Y3Al5O12 and b) an internal region beneath the at least one surface comprising a second ceramic material, wherein the second ceramic material comprises a combination of Al2O3 and ZrO2.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: July 30, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Xiaowei Wu, Jennifer Y. Sun, Michael R. Rice
  • Publication number: 20240209544
    Abstract: The present disclosure generally relates to a process chamber for processing of semiconductor substrates. The process chamber includes an upper lamp assembly, a lower lamp assembly, a susceptor, an upper window disposed between the substrate support and the upper lamp assembly, a lower window disposed between the lower lamp assembly and the substrate support, an inject ring, and a base ring. The susceptor includes a movement assembly. The movement assembly includes a bearing feedthrough assembly. The bearing feedthrough assembly is a ferrofluidic feedthrough assembly and functions as a ferrofluidic bearing. The bearing feedthrough assembly includes a shaft coupled to the support shaft. The shaft is rotated within the bearing feedthrough assembly. The bearing feedthrough assembly is combined with a first linear spline and a second linear spline.
    Type: Application
    Filed: March 12, 2024
    Publication date: June 27, 2024
    Inventors: Tetsuya ISHIKAWA, Swaminathan T. Srinivasan, Katik Bhupendra Shah, Ala Moradian, Manjunath Subbanna, Matthias Bauer, Peter Reimer, Michael R. Rice
  • Patent number: 12018372
    Abstract: The present disclosure generally relates to gas inject apparatus for a process chamber for processing of semiconductor substrates. The gas inject apparatus include one or more gas injectors which are configured to be coupled to the process chamber. Each of the gas injectors are configured to receive a process gas and distribute the process gas across one or more gas outlets. The gas injectors include a plurality of pathways, a fin array, and a baffle array. The gas injectors are individually heated. A gas mixture assembly is also utilized to control the concentration of process gases flown into a process volume from each of the gas injectors. The gas mixture assembly enables the concentration as well as the flow rate of the process gases to be controlled.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: June 25, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Tetsuya Ishikawa, Swaminathan T. Srinivasan, Matthias Bauer, Ala Moradian, Manjunath Subbanna, Kartik Bhupendra Shah, Errol Antonio C. Sanchez, Sohrab Zokaei, Michael R. Rice, Peter Reimer
  • Patent number: 12001193
    Abstract: Apparatus for extending substrate queue time for hybrid bonding by preserving plasma activation. In some embodiments, the apparatus may include an environmentally controllable space with a support for holding a die or a substrate, a gas velocity accelerator that recirculates one or more gases laterally across the support, a filter, a humidifier apparatus that is fluidly connected to the environmentally controllable space, wherein the humidifier apparatus enables controllable humidity levels within the environmentally controllable space, a pressurizing apparatus fluidly connected to the humidifier apparatus on an output and fluidly connected to at least one gas supply on an input, a relative humidity (RH) sensor positioned within the environmentally controllable space, and an environment controller in communication with at least the humidifier apparatus and the RH sensor, wherein the environment controller is configured to maintain an RH level of approximately 80% to approximately 95%.
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: June 4, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Ying Wang, Xundong Dai, Guan Huei See, Ruiping Wang, Michael R. Rice, Hari Kishen Ponnekanti, Nirmalya Maity
  • Patent number: D1029066
    Type: Grant
    Filed: March 11, 2022
    Date of Patent: May 28, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Michael R. Rice, Michael C. Kuchar, Travis Morey, Adam J. Wyatt, Ofer Amir