Abstract: A locking actuator arrangement may comprise an actuator housing defining a retaining cavity, an actuator piston comprising a piston head and a piston rod extending from the piston head, a receptacle body defining a receiving cavity, wherein the receiving cavity is configured to receive at least a portion of the piston rod, and the piston rod is configured to be received by the receiving cavity in response to alignment of at least two coupled links.

Abstract: A method of making a semiconductor device with an air gap for a terminal of a semiconductor device includes forming a sacrificial sidewall spacer and removing the spacer after the formation of contact structures for the semiconductor device. The air gap is located in portions of the wafer where the sacrificial air gap was removed. Since the contacts are formed prior to the removal of the sacrificial spacers, air gaps can advantageously be formed without electrically conductive contact material undesirably being deposited in locations of the desired air gap.

Abstract: A multigate transistor is formed on a wafer with a first material and a second material. Portions of the second material are selectively removed from the first material to form an opening in the first material. An epitaxially grown semiconductor material is grown from a seed layer into the opening. A portion of the first material is removed around the epitaxially grown semiconductor material in the opening and a gate material is formed in locations of the removed first material. The epitaxially grown semiconductor material in the opening serves as a channel region for a multigate transistor and the gate material serves as a gate for the multigate transistor.

Abstract: A multigate transistor is formed on a wafer with a first material and a second material. Portions of the second material are selectively removed from the first material to form an opening in the first material. An epitaxially grown semiconductor material is grown from a seed layer into the opening. A portion of the first material is removed around the epitaxially grown semiconductor material in the opening and a gate material is formed in locations of the removed first material. The epitaxially grown semiconductor material in the opening serves as a channel region for a multigate transistor and the gate material serves as a gate for the multigate transistor.

Abstract: In some embodiments, a substrate contact is formed by forming a first gate structure and a second gate structure. The first gate structure is formed in a first volume in a first area of the wafer and the second gate structure is formed in a second volume in a second area of the wafer. The gate dielectric is removed from the wafer in a first area of the wafer but remains in the second area. A first sidewall spacer formed for the gate structure and a second sidewall spacer is formed for the second gate structure. In some embodiments, the first gate structure can be utilized as a substrate contact and the second gate structure can be utilized as a gate of a transistor. In other embodiments, the first gate structure and the second gate structure can be removed and a metal gate material can be deposited in opening for forming a substrate contact and a metal gate, respectively.

Abstract: A locking actuator arrangement may comprise an actuator housing defining a retaining cavity, an actuator piston comprising a piston head and a piston rod extending from the piston head, a receptacle body defining a receiving cavity, wherein the receiving cavity is configured to receive at least a portion of the piston rod, and the piston rod is configured to be received by the receiving cavity in response to alignment of at least two coupled links.

Abstract: A vehicle is provided having a sensor for detecting a vehicle occupant's presence, and another sensor for detecting an owner's response with respect to automatically opening a vehicle closure panel. An actuator opens the closure panel when the occupant's presence and response are detected. A signal from an emitter outside the vehicle signals occupant presence. A photoelectric and/or optical device, audio receiver, and/or touch-sensitive sensor detects the response. The optical device projects a light beam, and breaking the beam with a gesture signals the response. An automatic closure panel opening apparatus has an RF receiver adapted to receive an RF signal to detect occupant presence, a sensor for detecting the occupant response, and an actuator for opening the closure panel when both the presence and occupant response are detected.

Abstract: A micro-mechanical part made of insulating material, such as a silicon balance spring (1) for a timepiece movement, tends to adhere to a neighboring part when it is in movement, such as the balance cock (9). This drawback is removed by carrying out, over all or part of the surface, a thin deposition of a layer of conductive material, such as a metal, which is preferably non-oxidizing and non-magnetic, such as gold, platinum, rhodium or silicon.

Abstract: A vehicle is provided having a sensor for detecting a vehicle occupant's presence, and another sensor for detecting an owner's response with respect to automatically opening a vehicle closure panel. An actuator opens the closure panel when the occupant's presence and response are detected. A signal from an emitter outside the vehicle signals occupant presence. A photoelectric and/or optical device, audio receiver, and/or touch-sensitive sensor detects the response. The optical device projects a light beam, and breaking the beam with a gesture signals the response. An automatic closure panel opening apparatus has an RF receiver adapted to receive an RF signal to detect occupant presence, a sensor for detecting the occupant response, and an actuator for opening the closure panel when both the presence and occupant response are detected.

Abstract: A micro-mechanical part made of insulating material, such as a silicon balance spring (1) for a timepiece movement, tends to adhere to a neighbouring part when it is in movement, such as the balance cock (9) as shown in the left part of the Figure. This drawback is removed, as shown in the right part of the Figure, by carrying out, over all or part of the surface, a thin deposition of a layer of conductive material, such as a metal, which is preferably non-oxidising and non-magnetic, such as gold, platinum, rhodium or silicon.

Abstract: An integrated coolant pump and transmission fluid heat exchanger comprises a single module bolted to the engine block. A primary liquid coolant circuit takes pressurized coolant from the pump, through the block, to the radiator and back. A small, separate heat exchanger sits within the module, within a parallel liquid coolant circuit that by passes the primary coolant circuit. Liquid coolant is picked off from the pump outlet by an inlet to the heat exchanger, and, after running through the heat exchanger, is returned to the main flow downstream of the radiator. Concurrently, transmission fluid is counter flowing through the same heat exchanger. Consequently, the parallel liquid flow through the heat exchanger does not interfere with the pressure in the main engine cooling flow. The direct, continual heat exchanger relationship between the two fluids in the heat exchanger allows the transmission to be either heated or cooled by the engine coolant, depending on the relative temperatures thereof.