Abstract: A method of increasing the radiation hardness of a semiconductor device using a modified high density plasma oxide (MHDPDX) film is described. In the method a high density plasma (HDP) process is used to deposit the MHDPDX film. During the HDP process, the silicon source gas to oxygen source gas ratio is chosen so as to deposit an excess silicon content within the MHDPDX film. The MHDPDX film is then annealed to cause the excess silicon to migrate and amalgamate, creating silicon nanoclusters having an average size of about 3-5 nm. The rad-hard properties of conventional BPSG films and various MHDPDX films are then compared.

Abstract: Non-planar SOI devices that include an “area-efficient” body tie are disclosed. The device includes a bulk substrate, an insulator layer formed on a surface of the bulk substrate, and a silicon body formed on a surface of the insulator layer. The silicon body preferably includes (i) a non-planar channel connecting a source region and a drain region, and (ii) a body tie that is adjacent to the channel and couples the channel to a voltage potential. The device further includes a gate dielectric formed on the channel and a gate material formed on the gate dielectric.

Abstract: A method and apparatus for regulating photocurrents is described. A photocurrent regulator may include a transistor having an associated cross-sectional area. The photocurrent regulator is coupled between an integrated circuit and a voltage source. When a dose rate event occurs within the integrated circuit, the photocurrent regulator, via the cross-sectional area, regulates a recombination path to the voltage source. Consequently, photocurrents within the integrated circuit are regulated, preventing permanent damage within the integrated circuit.

Abstract: Non-planar SOI devices that include an “area-efficient” body tie are disclosed. The device includes a bulk substrate, an insulator layer formed on a surface of the bulk substrate, and a silicon body formed on a surface of the insulator layer. The silicon body preferably includes (i) a non-planar channel connecting a source region and a drain region, and (ii) a body tie that is adjacent to the channel and couples the channel to a voltage potential. The device further includes a gate dielectric formed on the channel and a gate material formed on the gate dielectric.

Abstract: A method and apparatus for regulating photocurrents is described. A photocurrent regulator may include a transistor having an associated cross-sectional area. The photocurrent regulator is coupled between an integrated circuit and a voltage source. When a dose rate event occurs within the integrated circuit, the photocurrent regulator, via the cross-sectional area, regulates a recombination path to the voltage source. Consequently, photocurrents within the integrated circuit are regulated, preventing permanent damage within the integrated circuit.

Abstract: Behaviors of a transistor during a dose rate event can be modeled using a circuit simulation software package. A subcircuit model replaces a transistor in a circuit design to be simulated. The subcircuit model can be in the form of a schematic-based representation or a netlist. The subcircuit model provides a model of a source junction and a drain junction in the transistor during the dose rate event. The subcircuit model also includes the size of the transistor being replaced and the dose rate of the dose rate event. Once the transistor is replaced with the subcircuit model, a dose rate simulation may be performed to determine the dose rate hardness of the circuit design.

Abstract: A device is connected in parallel with an MTJ structure of an MRAM bit to shunt photocurrent away from and/or limit voltage across the MTJ structure during a dose rate event. The device may include at least one transistor and/or at least one diode. One device may be used to protect an entire row and/or column of MRAM bits. As a result, the MRAM bits are protected during a dose rate event.

Abstract: A random access memory cell has first and second inverters each having an input and an output. The input of the first inverter is coupled to the output of the second inverter by a Schottky-diode-free MOSFET. The input of the second inverter is coupled to the output of the first inverter.

Abstract: A random access memory cell has first and second inverters each having an input and an output. The input of the first inverter is coupled to the output of the second inverter by a Schottky-diode-free MOSFET. The input of the second inverter is coupled to the output of the first inverter.

Abstract: An SOI GAA device is created by etching a buried oxide layer of an SOI wafer structure that is provided over a silicon substrate. A portion of the buried oxide layer remains over the silicon substrate after etching. A plurality of silicon fingers is formed so that the silicon fingers extend over the remaining buried oxide layer. A gate oxide is formed all around each of the silicon fingers, and a common silicon gate is formed all around all of the gate oxides. A common source and a common drain are formed by suitably doping opposite ends of the silicon fingers leaving a channel therebetween.

Abstract: A pair of complementary MOSFET's having regions of a common conductivity type separating the source and drain regions thereof which are provided on a support structure formed of an electrical insulating layer on a semiconductor material base. MOSFET's has a gate oxide layer on which is provided a gate semiconductor structure, with these structures each being of a common conductivity type and located across the gate oxide layers from the corresponding common conductivity type region.

Abstract: A back-etch silicon-on-insulator SOI process that has a silicon handle wafer with an oxide layer bonded at room temperature to a silicon device wafer with an etch stop and silicon device layer. The surfaces that are bonded at room temperature are first conditioned to be hydrophilic. After bonding, the edges of the layers are sealed. The silicon device wafer, the etch-stop layer and the device layer are boron doped. Most of the silicon device wafer is ground away. Then, the remaining portion of the silicon device wafer and the etch stop layer are chemically etched away, thereby leaving a uniform layer of silicon device layer on the oxide layer of the silicon handle wafer.

Abstract: A transistor panel used for active matrix display devices includes islands of single crystal silicon formed on a transparent quartz substrate and arranged in rows and columns, with an NMOS transistor formed in each island. Each transistor includes source, drain and channel regions and an isolated pixel reference voltage region. A silicon body tie connects the channel region to the pixel reference voltage region and acts as a current sink for unwanted carriers thereby greatly increasing the snapback voltage. A metallization extends to each transistor and is in contact with each reference voltage region to form a body tie buss. The portion of the body tie that overlaps the pixel electrode may be sized to provide a storage capacitor for improved display performance. The unique body tie design obviates the need for a separate light shield layer, provides a dramatically increased aperture ratio and is compatible with normal high temperature silicon processes.

Abstract: A rapid method for determining electrical characteristics of SOI wafers whereby the silicon substrate acts as a gate and tungsten probes make a source and drain connection at the top silicon surface to form a point contact transistor. Drain current is measured as a function of gate voltage as gate voltage is swept from negative to positive values. The subthreshold voltage current characteristic exhibits a minimum drain current occurring close to zero gate voltage. The tungsten probe point contacts apparently are responding to both electron and hole conduction or simply intrinsic CMOS behavior. Using current voltage characteristics, estimates may be made of interface state density and oxide charge density. Analysis of the gate voltage shift for minimum drain current allows determination of threshold voltage shift due to radiation.

Abstract: A method for making a voltage linear capacitor for use with a metal oxide semiconductor field transistor wherein a capacitor portion of an SOI substrate is heavily doped with phosphorus. The thin oxide layer used for the transistor gate oxide also serves as the capacitor dielectric and the thickness of the dielectric relative to the gate oxide is controlled.

Abstract: A back-etch silicon-on-insulator SOI process that has a silicon handle wafer with an oxide layer bonded at room temperature to a silicon device wafer with an etch stop and silicon device layer. The surfaces that are bonded at room temperature are first conditioned to be hydrophilic. After bonding, the edges of the layers are sealed. The silicon device wafer, the etch-stop layer and the device layer are boron doped. Most of the silicon device wafer is ground away. Then, the remaining portion of the silicon device wafer and the etch stop layer are chemically etched away, thereby leaving a uniform layer of silicon device layer on the oxide layer of the silicon handle wafer.

Abstract: A method for fabricating an integrated infrared sensitive bolometer having a polycrystalline element whereby an oxide region deposited on silicon nitride covered with a first polysilicon layer which is etched to provide a location for a bolometer element. A second polysilicon layer is deposited and doped to achieve a desired temperature coefficient of resistivity of 1 to 2%/.degree.C. The second polysilicon layer forms an IR sensitive element over the oxide region. Openings are etched in the IR sensitive element to permit an etchant to remove the oxide region resulting in the sensitive element being suspended over a cavity.

Abstract: An isolation structure as well as a method for using and fabricating an isolation structure in an active layer deposited on a substrate the method of fabrication including the steps of forming a buried oxide layer in the active layer adjacent the substrate, forming an isolation trench in the active layer by etching at least up to and optionally into the substrate, forming a dielectric isolation layer on the exposed surfaces of the trench, removing the dielectric isolation layer from the bottom of the trench, and forming an isolation structure by epitaxially growing monocrystalline silicon in the trench.

Abstract: A method for fabricating polysilicon resistors of intermediate high value for use as cross-coupling or =ingle event upset (SEU) resistors in memory cells. A thin polysilicon film is implanted with arsenic ions to produce a predetermined resistivity. The thin film is then implanted with fluorine ions to stabilize the grain boundaries and thereby the barrier height. Reducing the variation in barrier height from run to run of wafers allows the fabrication of reproducible SEU resistors.

Abstract: An isolation structure as well as a method for using and fabricating an isolation structure in an active layer deposited on a substrate the method of fabrication including the steps of forming a buried oxide layer in the active layer adjacent the substrate, forming an isolation trench in the active layer by etching at least up to and optionally into the substrate, forming a dielectric isolation layer on the exposed surfaces of the trench, removing the dielectric isolation layer from the bottom of the trench, and forming an isolation structure by epitaxially growing monocrystalline silicon in the trench.