Patents by Inventor Michael S. WLADYKA

Michael S. WLADYKA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems And Methods Of Applying Materials to Components
    Publication number: 20210028142
    Abstract: A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply.
    Type: Application
    Filed: August 10, 2020
    Publication date: January 28, 2021
    Inventors: Jason L. STRADER, Michael S. WLADYKA, Keith David JOHNSON, Jingting YANG, Kevin Joel BOHRER, Mark D. KITTEL
  • Systems of applying materials to components
    Patent number: 10741519
    Abstract: A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and/or for imprinting the portion of the material for release and transfer from the supply.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: August 11, 2020
    Assignee: Laird Technologies, Inc.
    Inventors: Jason L. Strader, Michael S. Wladyka, Keith David Johnson, Jingting Yang, Kevin Joel Bohrer, Mark D. Kittel
  • Systems And Methods Of Applying Thermal Interface Materials
    Publication number: 20190013291
    Abstract: Disclosed are exemplary embodiments of systems and methods of applying materials to components. The materials may be applied to a wide range of substrates and components, such as lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields, heat sources (e.g., a central processing unit (CPU), etc.), heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc.), etc.
    Type: Application
    Filed: August 28, 2018
    Publication date: January 10, 2019
    Inventors: Jason L. STRADER, Michael S. WLADYKA, Keith David JOHNSON, Jingting YANG, Kevin Joel BOHRER, Mark D. KITTEL
  • Material having edging
    Patent number: D879046
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: March 24, 2020
    Inventors: Michael S. Wladyka, Keith David Johnson, Jason L. Strader, Mark D. Kittel, Jingting Yang
  • Material having an edge shape
    Patent number: D881822
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: April 21, 2020
    Assignee: Laird Technologies, Inc.
    Inventors: Michael S. Wladyka, Keith David Johnson, Jason L. Strader, Mark D. Kittel, Jingting Yang
  • Material having edge shape
    Patent number: D998827
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: September 12, 2023
    Assignee: Laird Technologies, Inc.
    Inventors: Michael S. Wladyka, Keith David Johnson, Jason L. Strader, Mark D. Kittel, Jingting Yang
  • Material having edging
    Patent number: D999405
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: September 19, 2023
    Assignee: Laird Technologies, Inc.
    Inventors: Michael S. Wladyka, Keith David Johnson, Jason L. Strader, Mark D. Kittel, Jingting Yang