Abstract: Example implementations relate to a retention assembly. One example retention assembly includes a support member extending from a printed circuit board. The support member includes a body region having a slot and a first flange extending from the body region. The retention assembly also includes a locking member slidably coupled to the support member via the slot. The locking member includes a second flange. The second flange includes a protruded region, and wherein the protruded region and the first flange are to secure a proximal end of expansion module.

Abstract: A nozzle deposits a filament of viscous, molten glass onto a print bed, while the print bed rotates about a vertical axis and translates in x, y, and z directions. The deposition is computer controlled, such that the resulting deposited filament forms a desired glass object that is solid after it anneals. One or more motors rotate the print bed such that the direction of deposition of the molten glass is constant relative to the nozzle, even though the print bed is translating in different directions relative to the nozzle. Keeping the direction of deposition constant relative to the nozzle tends to prevent the extruded filament of molten glass from experiencing large, changing, tensile and shear forces that would otherwise occur and that would otherwise damage the filament.

Abstract: In illustrative implementations of this invention, a crucible kiln heats glass such that the glass becomes or remains molten. A nozzle extrudes the molten glass while one or more actuators actuate movements of the nozzle, a build platform or both. A computer controls these movements such that the extruded molten glass is selectively deposited to form a 3D glass object. The selective deposition of molten glass occurs inside an annealing kiln. The annealing kiln anneals the glass after it is extruded. In some cases, the actuators actuate the crucible kiln and nozzle to move in horizontal x, y directions and actuate the build platform to move in a z-direction. In some cases, fluid flows through a cavity or tubes adjacent to the nozzle tip, in order to cool the nozzle tip and thereby reduce the amount of glass that sticks to the nozzle tip.

Abstract: A measuring bridge (1) provides a first matching pad (2), a second matching pad (3) and a third matching pad (4), wherein all matching pads (2, 3, 4) comprise at least three resistors (21, 22, 23, 31, 32, 33, 41, 42, 43) which are arranged in a T-structure. A second resistor (32) of the second matching pad (3) is connected to a second resistor (22) of the first matching pad (2), and a third resistor (43) of the third matching pad (4) is connected to a third resistor (23) of the first matching pad (2). A second resistor (42) of the third matching pad (4) can be connected to a device under test (7). A third resistor (33) of the second matching pad (3) can be connected to a calibration standard (5), and a first resistor (31, 41) of the second and the third matching pad (3, 4) are connected in each case to a signal input of an element (11) which suppresses a common-mode component on its two signal inputs.

Abstract: A nozzle deposits a filament of viscous, molten glass onto a print bed, while the print bed rotates about a vertical axis and translates in x, y, and z directions. The deposition is computer controlled, such that the resulting deposited filament forms a desired glass object that is solid after it anneals. One or more motors rotate the print bed such that the direction of deposition of the molten glass is constant relative to the nozzle, even though the print bed is translating in different directions relative to the nozzle. Keeping the direction of deposition constant relative to the nozzle tends to prevent the extruded filament of molten glass from experiencing large, changing, tensile and shear forces that would otherwise occur and that would otherwise damage the filament.

Abstract: Methods of image breathing correction. Implementations may include capturing and displaying a first image to a user using a lens, an image sensor, memory, and a display included in a camera unit, adjusting a position of the lens, capturing a second image and storing data of the second image collected by the image sensor in the memory. The method may include determining a second position of the lens using a lens position sensor included in the camera unit and calculating a change in magnification from the first image to the second image using a processor and a breathing correction model. The method may include rescaling the data of the second image to generate corrected second image data using the processor and displaying the corrected second image to a user. The corrected second image may be substantially free from breathing effects when compared with the first image.

Abstract: Example implementations relate to a retention assembly. One example retention assembly includes a support member extending from a printed circuit board. The support member includes a body region having a slot and a first flange extending from the body region. The retention assembly also includes a locking member slidably coupled to the support member via the slot. The locking member includes a second flange. The second flange includes a protruded region, and wherein the protruded region and the first flange are to secure a proximal end of expansion module.

Abstract: In illustrative implementations of this invention, a crucible kiln heats glass such that the glass becomes or remains molten. A nozzle extrudes the molten glass while one or more actuators actuate movements of the nozzle, a build platform or both. A computer controls these movements such that the extruded molten glass is selectively deposited to form a 3D glass object. The selective deposition of molten glass occurs inside an annealing kiln. The annealing kiln anneals the glass after it is extruded. In some cases, the actuators actuate the crucible kiln and nozzle to move in horizontal x, y directions and actuate the build platform to move in a z-direction. In some cases, fluid flows through a cavity or tubes adjacent to the nozzle tip, in order to cool the nozzle tip and thereby reduce the amount of glass that sticks to the nozzle tip.

Abstract: An image sensor die may include a pixel array formed in an image sensor substrate. The image sensor die may be mounted to a thin metal interconnect layer that has been deposited on a sacrificial carrier substrate. The thin metal interconnect layer may include one or more metal layers that are patterned to form metal traces that serve as contact pads, signal lines, and other interconnects in the interconnect layer. The image sensor die may be wire bonded, flip-chip mounted, or otherwise mechanically and electrically coupled to the metal interconnect layer. The sacrificial carrier substrate may be etched or otherwise removed to expose the metal interconnects on the metal interconnect layer. An array of solder balls may be formed on the exposed metal interconnects to form a ball grid array package, or the exposed contact pads may be plated to form a leadless chip carrier package.

Abstract: An imaging system may include a camera module with an image sensor having an array of image sensor pixels and one or more lenses that focus light onto the array of image sensor pixels. The array of image sensor pixels may include a corresponding array of color filter elements. The system may include circuitry configured to detect and mitigate flare artifacts in image data captured using the image sensor. Detecting the flare artifacts may include detecting color mismatches in the captured image data and performing edge-detection operations to determine whether the color mismatches are in an edge region of the image data. If the color mismatches are detected in an edge region, no flare-mitigation operations may be performed. If the color mismatches are in a flat region of the captured image, flare-mitigation operations may be performed.

Abstract: A method for forming curved image sensors may include applying positive pressure to the face of an image sensor, forcing the image sensor to adhere the curved surface of a substrate. The pressure may be applied to the face of the image sensor in a variety of ways, including using pneumatic pressure, hydraulic pressure, or pressure from an elastic or inelastic solid. Processing may occur on either a single image sensor die or an image sensor wafer. When an image sensor wafer is processed, a substrate may be used that has a number of cavities defined by respective curved surfaces with each cavity corresponding to a respective image sensor. When pressure is applied to the image sensor, the image sensor may deform until the curvature of the image sensor matches the curvature of the curved surface of the underlying substrate.

Abstract: An imaging system may include a camera module with an image sensor having an array of image sensor pixels and one or more lenses that focus light onto the array. The system may include processing circuitry configured to mitigate flare artifacts in image data captured using the array based on at least one image flare map. The image flare map may identify a portion of the captured image data on which to perform image flare mitigation operations. The processing circuitry may perform image flare mitigation operations such as pixel value desaturation on the identified portion of the captured image data without desaturating portions of the image data that do not include flare artifacts. The flare map may be generated using a calibration system that characterizes the location, intensity, and color of all possible image flare artifacts that may be generated by the imaging system during normal imaging operations.

Abstract: In illustrative implementations of this invention, a crucible kiln heats glass such that the glass becomes or remains molten. A nozzle extrudes the molten glass while one or more actuators actuate movements of the nozzle, a build platform or both. A computer controls these movements such that the extruded molten glass is selectively deposited to form a 3D glass object. The selective deposition of molten glass occurs inside an annealing kiln. The annealing kiln anneals the glass after it is extruded. In some cases, the actuators actuate the crucible kiln and nozzle to move in horizontal x, y directions and actuate the build platform to move in a z-direction. In some cases, fluid flows through a cavity or tubes adjacent to the nozzle tip, in order to cool the nozzle tip and thereby reduce the amount of glass that sticks to the nozzle tip.

Abstract: An imaging system may include a camera module with an image sensor having an array of image sensor pixels and one or more lenses that focus light onto the array. The system may include processing circuitry configured to mitigate flare artifacts in image data captured using the array based on at least one image flare map. The image flare map may identify a portion of the captured image data on which to perform image flare mitigation operations. The processing circuitry may perform image flare mitigation operations such as pixel value desaturation on the identified portion of the captured image data without desaturating portions of the image data that do not include flare artifacts. The flare map may be generated using a calibration system that characterizes the location, intensity, and color of all possible image flare artifacts that may be generated by the imaging system during normal imaging operations.

Abstract: A measuring bridge (1) provides a first matching pad (2), a second matching pad (3) and a third matching pad (4), wherein all matching pads (2, 3, 4) comprise at least three resistors (21, 22, 23, 31, 32, 33, 41, 42, 43) which are arranged in a T-structure. A second resistor (32) of the second matching pad (3) is connected to a second resistor (22) of the first matching pad (2), and a third resistor (43) of the third matching pad (4) is connected to a third resistor (23) of the first matching pad (2). A second resistor (42) of the third matching pad (4) can be connected to a device under test (7). A third resistor (33) of the second matching pad (3) can be connected to a calibration standard (5), and a first resistor (31, 41) of the second and the third matching pad (3, 4) are connected in each case to a signal input of an element (11) which suppresses a common-mode component on its two signal inputs.

Abstract: An image sensor die may include a pixel array formed in an image sensor substrate. The image sensor die may be mounted to a thin metal interconnect layer that has been deposited on a sacrificial carrier substrate. The thin metal interconnect layer may include one or more metal layers that are patterned to form metal traces that serve as contact pads, signal lines, and other interconnects in the interconnect layer. The image sensor die may be wire bonded, flip-chip mounted, or otherwise mechanically and electrically coupled to the metal interconnect layer. The sacrificial carrier substrate may be etched or otherwise removed to expose the metal interconnects on the metal interconnect layer. An array of solder balls may be formed on the exposed metal interconnects to form a ball grid array package, or the exposed contact pads may be plated to form a leadless chip carrier package.

Abstract: Image sensors may include image pixels and phase detection pixels. Phase detection pixels may he used during active lens alignment operations to accurately align camera module optics to the image sensor during camera module assembly. During active alignment operations, phase detection pixels may gather phase information from a target that is viewed through the camera module optics. Control circuitry may process the phase information to determine a distance and direction of lens movement needed to bring the target into focus and thereby align the camera module optics to the image sensor. A computer-controlled positioner may be used to adjust a position of the camera module optics relative to the image sensor based on information from the phase detection pixels. Once the camera module optics are accurately aligned relative to the image sensor, structures in the camera module assembly may be permanently attached to lock the alignment in place.

Abstract: An imaging system may include a camera module with an image sensor having an array of image sensor pixels and one or more lenses that focus light onto the array of image sensor pixels. The array of image sensor pixels may include a corresponding array of color filter elements. The system may include circuitry configured to detect and mitigate flare artifacts in image data captured using the image sensor. Detecting the flare artifacts may include detecting color mismatches in the captured image data and performing edge-detection operations to determine whether the color mismatches are in an edge region of the image data. If the color mismatches are detected in an edge region, no flare-mitigation operations may be performed. If the color mismatches are in a flat region of the captured image, flare-mitigation operations may be performed.

Abstract: In accordance with the teaching of the present invention, a system and method for securing a ball grid array to a printed wire board is provided. In a particular embodiment, a ball grid array comprises one or more balls configured to attach to a spring comprising one or more turns. In addition, there is a spacer plate configured to align and separate the springs, a soldering aid configured to align solder on the printed wire board and a printed wire board configured with conductive pads to attach to the ball grid array via the springs.

Abstract: A method, computer program product, and system is described. A patient condition associated with a patient record is identified based upon, at least in part, a first input associated with the patient record. A point-of-care prompt is provided based upon, at least in part, the patient condition and clinical authority information. A point-of-care input, associated with at least in part, one or more of education material, a condition assessment, co-morbidity information, a diagnosis protocol, a treatment protocol, medication information, clinical order information, visit order information, patient resource information, and care planning information, is received.