Abstract: In one aspect, a capacitor or network of capacitors is/are provided for vertical power delivery in a package where the capacitor(s) is/are embedded in or forms the entirety of the package substrate core. In a second aspect, a plurality of thin-film capacitor structures are provided for implementing vertical power delivery in a package. In a third aspect a method is provided for fabricating hermetically sealed thin-film capacitors.

Abstract: In one aspect, a capacitor or network of capacitors is/are provided for vertical power delivery in a package where the capacitor(s) is/are embedded in or forms the entirety of the package substrate core. In a second aspect, a plurality of thin-film capacitor structures are provided for implementing vertical power delivery in a package. In a third aspect a method is provided for fabricating hermetically sealed thin-film capacitors.

Abstract: The present disclosure relates generally to inhibitors of ectonucleotide pyrophosphatase/phosphodiesterase 1 (ENPP1), compositions thereof, and methods of using said compounds and compositions thereof. More specifically, the present disclosure relates to triazolopyrimidine and imidazolopyrimidine inhibitors of ENPP1 and methods of their use for treating disease mediated by ENPP1.

Abstract: A method and apparatus are provided for manufacturing an integrated circuit package assembly which includes a multichip package substrate having active and/or passive circuit devices embedded in one or more substrate core layers, a plurality of encapsulated integrated circuit devices attached to the multichip package substrate, and an optical waveguide fiber connected to a photonic integrated circuit device that is located in either the multichip package substrate or the encapsulated plurality of integrated circuit devices, where the optical waveguide fiber is optically coupled to an exposed fiber coupling region of the photonic integrated circuit device.

Abstract: The present disclosure relates generally to inhibitors of ectonucleotide pyrophosphatase/phosphodiesterase 1 (ENPP1), compositions thereof, and methods of using said compounds and compositions thereof. More specifically, the present disclosure relates to triazolopyrimidine and imidazolopyrimidine inhibitors of ENPP1 and methods of their use for treating disease mediated by ENPP1.

Abstract: Embodiments of the present application relate to functionalized N-acetylgalactosamine-analogs, methods of making, and uses of the same. In particular, mono or trivalent N-acetylgalactosamine analogs may be prepared by utilizing a wide variety of linkers containing functional groups. These functionalized N-acetylgalactosamine-analogs may be used in the preparation of targeted delivery of oligonucleotide-based therapeutics.

Abstract: Described herein are methods for using compounds that activate pyruvate kinase.

Abstract: Structures and methods of forming a thin-film electrolytic capacitor without the conductive polymer, thus improving the ESR performance as well as the reliability of the capacitor. Thin-film electrolytic capacitor structures include sintered anode, oxide deposition, conductive polymer, conductive metal inks, and metal cathodes.

Abstract: Embodiments of the present application relate to functionalized N-acetylgalactosamine-analogs, methods of making, and uses of the same. In particular, mono or trivalent N-acetylgalactosamine analogs may be prepared by utilizing a wide variety of linkers containing functional groups. These functionalized N-acetylgalactosamine-analogs may be used in the preparation of targeted delivery of oligonucleotide-based therapeutics.

Abstract: A semiconductor package substrate with embedded crack cessation structures and methods of forming the same is provided. Crack cessation structures include blind vias structures, through vias structures, and methods of forming the same are provided. Crack cessation structures may be formed by trenching of one or more structures, and deposition of metallic or insulative materials to form a crack cessation structures in the semiconductor package substrate core.

Abstract: Methods of treating and evaluating subjects having neoactive mutants are described herein.

Abstract: A method and apparatus are provided for manufacturing a packaged assembly by attaching a plurality of multi-height integrated circuit components to an carrier or package substrate with embedded active and/or passive circuit elements and then forming an encapsulating molding compound to cover the multi-height integrated circuit components and then etching or grinding the encapsulating molding compound to expose each of the integrated circuit components at a planar heat dissipation surface so that a heat sink lid/cover can be formed with one or more thermal conductive layers to contact each of the exposed integrated circuit components, thereby enabling removal of heat from the integrated circuit components and the embedded active and/or passive circuit elements of the package substrate.

Abstract: A semiconductor package substrate with embedded passive devices and methods of forming the same is provided. Embedded passive devices include inductors and inductor modules and methods of forming the same are provided. Embedded inductors may be formed by deposition of magnetic core material, trenching of one or more channels, and placement of conductive wires to form an module embeddable in the semiconductor package substrate core. Provided are methods and apparatus for formation of embeddable pot-core, toroidal, and helical inductors.

Abstract: In integrated circuit packages, a coaxial pair of signals are routed through a plated through hole between circuitry on one face of the core substrate material with circuitry on an opposing face of the core substrate material. Provided are methods and apparatuses where signals are routed within a concentric reference conductor within traditional package substrates. Methods for forming a hole in the core substrate material through which the coaxial pair of signals is passed on a fine pitch.

Abstract: Described herein are methods for using compounds that activate pyruvate kinase.

Abstract: The present disclosure relates generally to inhibitors of ectonucleotide pyrophosphatase/phosphodiesterase 1 (ENPP1), compositions thereof, and methods of using said compounds and compositions thereof. More specifically, the present disclosure relates to sulfoximine-based inhibitors of ENPP1 and methods of their use for treating disease mediated by ENPP1.

Abstract: In one aspect, a capacitor or network of capacitors is/are provided for vertical power delivery in a package where the capacitor(s) is/are embedded in or forms the entirety of the package substrate core. In a second aspect, a plurality of thin-film capacitor structures are provided for implementing vertical power delivery in a package. In a third aspect a method is provided for fabricating hermetically sealed thin-film capacitors.

Abstract: Embodiments of the present application relate to functionalized N-acetylgalactosamine-analogs, methods of making, and uses of the same. In particular, mono or trivalent N-acetylgalactosamine analogs may be prepared by utilizing a wide variety of linkers containing functional groups. These functionalized N-acetylgalactosamine-analogs may be used in the preparation of targeted delivery of oligonucleotide-based therapeutics.

Abstract: The present disclosure relates generally to inhibitors of ectonucleotide pyrophosphatase/phosphodiesterase 1 (ENPP1), compositions thereof, and methods of using said compounds and compositions thereof. More specifically, the present disclosure relates to triazolopyrimidine and imidazolopyrimidine inhibitors of ENPP1 and methods of their use for treating disease mediated by ENPP1.

Abstract: The present disclosure relates generally to inhibitors of ectonucleotide pyrophosphatase/phosphodiesterase 1 (ENPP1), compositions thereof, and methods of using said compounds and compositions thereof. More specifically, the present disclosure relates to sulfoximine-based inhibitors of ENPP1 and methods of their use for treating disease mediated by ENPP1.