Abstract: A cable assembly is used to connect elements of a computing system. The cable assembly may include a first cable and a connector. The first cable includes an external portion having a first conductor, an electromagnetic (EMC) shielding jacket for the first conductor and a connector disposed at an end of the first conductor. Further, the first cable includes an internal portion comprising a second conductor and a connector disposed on an end of the second conductor. However, the internal portion lacks an EMC shielding jacket for the second conductor. The external portion of the first cable and the internal portion of the first cable form a continuous cable. The connector device comprises a shield area configured to electrically couple with a chassis of a node of a computer system and a retainer configured to physically couple the cable assembly with the chassis.

Abstract: A cassette for insertion and removal of an edge-connected printed circuit card connectable to a server chassis is disclosed. The cassette includes a housing comprising a bottom wall having at least one elongated slot and a catch formed thereon. The cassette further includes a connector sub-assembly overlying the bottom wall having an edge connector socket formed thereon and configured to receive the edge-connected printed circuit card. The cassette further includes a guide sub-assembly underlying the bottom wall having a spring latch formed thereon. The spring latch is operable in a first state to engage the catch to prevent movement of the connector sub-assembly and the guide sub-assembly relative to the housing. The spring latch is operable in a second state to clear the catch to permit the connector sub-assembly and the guide sub-assembly to slide in unison in the at least one elongated slot.

Abstract: A cable assembly is used to connect elements of a computing system. The cable assembly may include a first cable and a connector. The first cable includes an external portion having a first conductor, an electromagnetic (EMC) shielding jacket for the first conductor and a connector disposed at an end of the first conductor. Further, the first cable includes an internal portion comprising a second conductor and a connector disposed on an end of the second conductor. However, the internal portion lacks an EMC shielding jacket for the second conductor. The external portion of the first cable and the internal portion of the first cable form a continuous cable. The connector device comprises a shield area configured to electrically couple with a chassis of a node of a computer system and a retainer configured to physically couple the cable assembly with the chassis.

Abstract: A cable assembly is used to connect elements of a computing system. The cable assembly may include a first cable and a connector. The first cable includes an external portion having a first conductor, an electromagnetic (EMC) shielding jacket for the first conductor and a connector disposed at an end of the first conductor. Further, the first cable includes an internal portion comprising a second conductor and a connector disposed on an end of the second conductor. However, the internal portion lacks an EMC shielding jacket for the second conductor. The external portion of the first cable and the internal portion of the first cable form a continuous cable. The connector device comprises a shield area configured to electrically couple with a chassis of a node of a computer system and a retainer configured to physically couple the cable assembly with the chassis.

Abstract: Managing of battery pack cell capacity is provided. The managing includes monitoring temperature of one or more cells within the battery pack, and based on temperature of a cell of the one or more cells being at or below a low temperature threshold, initiating discharging of cells with the battery pack at a specified discharge power level to heat the cells within the battery pack. The managing also includes, based on temperature of a cell of the one or more cells rising to or above an upper temperature threshold after initiating discharging of the cells within the battery pack, discontinuing the discharging of cells within the battery pack.

Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.

Abstract: A cassette for insertion and removal of an edge-connected printed circuit card connectable to a server chassis is disclosed. The cassette includes a housing comprising a bottom wall having at least one elongated slot and a catch formed thereon. The cassette further includes a connector sub-assembly overlying the bottom wall having an edge connector socket formed thereon and configured to receive the edge-connected printed circuit card. The cassette further includes a guide sub-assembly underlying the bottom wall having a spring latch formed thereon. The spring latch is operable in a first state to engage the catch to prevent movement of the connector sub-assembly and the guide sub-assembly relative to the housing. The spring latch is operable in a second state to clear the catch to permit the connector sub-assembly and the guide sub-assembly to slide in unison in the at least one elongated slot.

Abstract: A cable assembly is used to connect elements of a computing system. The cable assembly may include a first cable and a connector. The first cable includes an external portion having a first conductor, an electromagnetic (EMC) shielding jacket for the first conductor and a connector disposed at an end of the first conductor. Further, the first cable includes an internal portion comprising a second conductor and a connector disposed on an end of the second conductor. However, the internal portion lacks an EMC shielding jacket for the second conductor. The external portion of the first cable and the internal portion of the first cable form a continuous cable. The connector device comprises a shield area configured to electrically couple with a chassis of a node of a computer system and a retainer configured to physically couple the cable assembly with the chassis.

Abstract: A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.

Abstract: A method and structures are provided for implementing a latching mechanism with a variable spring preload feature. The latching mechanism includes a latch housing and a latch slide. The latching mechanism includes a variable spring preload internal within the latch housing. The latch housing and latch slide have a standardized outer configuration to be incorporated in various products and configurations of hardware. The spring preload feature being varied to ensure latching mechanism remains latched during use.

Abstract: Managing of battery pack cell capacity is provided. The managing includes monitoring temperature of one or more cells within the battery pack, and based on temperature of a cell of the one or more cells being at or below a low temperature threshold, initiating discharging of cells with the battery pack at a specified discharge power level to heat the cells within the battery pack. The managing also includes, based on temperature of a cell of the one or more cells rising to or above an upper temperature threshold after initiating discharging of the cells within the battery pack, discontinuing the discharging of cells within the battery pack.

Abstract: A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.

Abstract: A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.

Abstract: Methods of fabricating tamper-respondent assemblies and electronic assembly packages are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.

Abstract: Electronic circuits, electronic packages, and methods of fabrication are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board.

Abstract: Methods of fabricating electronic circuits and electronic packages are provided. The electronic circuit includes a multilayer circuit board, and a tamper-respondent sensor embedded within the circuit board. The tamper-respondent sensor defines, at least in part, a secure volume associated with the multilayer circuit board. In certain implementations, the tamper-respondent sensor includes multiple tamper-respondent layers embedded within the circuit board including, for instance, one or more tamper-respondent frames and one or more tamper-respondent mat layers, with the tamper-respondent frame(s) being disposed, at least in part, above the tamper-respondent mat layer(s), which together define the secure volume where extending into the multilayer circuit board.

Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.

Abstract: Tamper-respondent assemblies, electronic assembly packages, and methods of fabrication are provided which include multiple, discrete tamper-respondent sensors that overlap, at least in part, and facilitate defining a secure volume about one or more electronic components to be protected, such as an electronic assembly. The tamper-respondent sensors include a first tamper-respondent sensor and a second tamper-respondent sensor, which may be similarly constructed or differently constructed. In certain embodiments, the tamper-respondent sensors wrap, at least in part, over an electronic enclosure, and in other embodiments, the tamper-respondent sensors cover, at least in part, an inner surface of an electronic enclosure to facilitate defining a secure volume in association with a multilayer circuit board to which the electronic enclosure is mounted.

Abstract: Methods of fabricating tamper-respondent assemblies provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming, at least in part, at least one tamper-detect network, such as one or more resistive networks. The circuit lines are disposed on at least one of the first side or the second side of the at least one flexible layer. At least one region of the tamper-respondent sensor is fabricated with increased susceptibility to damage from mechanical stress associated with a tamper event. The at least one region of increased susceptibility to damage facilitates detection of the tamper event by the tamper-respondent sensor.

Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.