Abstract: Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. At least one heat transfer element is coupled to, or integrated with, the thermally conductive cover and resides between a main surface of the cover and at least one respective electronic component of the plurality of electronic components. A thermal interface material is disposed between the heat transfer element(s) and the respective electronic component(s), and facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises one or more rotatable latches, the one or more rotatable latches each including a respective screw mechanism housed within the one or more rotatable latches. The apparatus further comprises one or more spring assemblies, the one or more spring assemblies each including a respective thread assembly housed within the one or more spring assemblies. The respective thread assemblies comprise threading that is capable of receiving a corresponding screw mechanism of the one or more rotatable latches.

Abstract: A gasket assembly structure including a frame which includes a front half and a back half joined together with a plurality of interlocking tabs located around a perimeter of the frame, defining a window, and an electromagnetic gasket, constrained between the front half and the back half of the frame; where the electromagnetic gasket lines an interior perimeter of the window and partially extends from the frame into the window, and a passageway through the window of the frame with boarders defined by the constrained electromagnetic gasket. A housing structure including a receptacle recessed within an opening on a front side of the housing, the receptacle is rigidly attached to the housing, and a gasket assembly recessed within the opening and located between the front side of the housing and the receptacle, where the gasket assembly is directly secured to the housing.

Abstract: A latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a pivotable latch coupled to the field-replaceable unit via a pivot, at a first side of the unit, and a spring member associated with the enclosure. The spring member is engaged by the latch and deflects with rotating of the latch from an open position to a latched position. The pivotable latch includes the first end and a second end, with the pivot being disposed closer to the first end than the second. The deflecting spring member facilitates provision of positive pressure on the unit directed towards a second side of the unit opposite to the first side to facilitate, for example, fixedly coupling a first connector at the second side to a second connector associated with the enclosure when the unit is latched within the enclosure.

Abstract: Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. At least one heat transfer element is coupled to, or integrated with, the thermally conductive cover and resides between a main surface of the cover and at least one respective electronic component of the plurality of electronic components. A thermal interface material is disposed between the heat transfer element(s) and the respective electronic component(s), and facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.

Abstract: Electronic packages are provided with enhanced heat dissipation capabilities. The electronic package includes a plurality of electronic components, and an enclosure in which the electronic components reside. The enclosure includes a thermally conductive cover overlying the electronic components. At least one heat transfer element is coupled to, or integrated with, the thermally conductive cover and resides between a main surface of the cover and at least one respective electronic component of the plurality of electronic components. A thermal interface material is disposed between the heat transfer element(s) and the respective electronic component(s), and facilitates conductive transfer of heat from the electronic component(s) to the thermally conductive cover through the heat transfer element(s). The thermally conductive cover facilitates spreading and dissipating of the transferred heat outwards, for instance, through a surrounding tamper-respondent sensor and/or a surrounding encapsulant.

Abstract: A latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a pivotable latch coupled to the field-replaceable unit via a pivot, at a first side of the unit, and a spring member associated with the enclosure. The spring member is engaged by the latch and deflects with rotating of the latch from an open position to a latched position. The pivotable latch includes the first end and a second end, with the pivot being disposed closer to the first end than the second. The deflecting spring member facilitates provision of positive pressure on the unit directed towards a second side of the unit opposite to the first side to facilitate, for example, fixedly coupling a first connector at the second side to a second connector associated with the enclosure when the unit is latched within the enclosure.

Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises one or more rotatable latches, the one or more rotatable latches each including a respective screw mechanism housed within the one or more rotatable latches. The apparatus further comprises one or more spring assemblies, the one or more spring assemblies each including a respective thread assembly housed within the one or more spring assemblies. The respective thread assemblies comprise threading that is capable of receiving a corresponding screw mechanism of the one or more rotatable latches.

Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises one or more rotatable latches, the one or more rotatable latches each including a respective screw mechanism housed within the one or more rotatable latches. The apparatus further comprises one or more spring assemblies, the one or more spring assemblies each including a respective thread assembly housed within the one or more spring assemblies. The respective thread assemblies comprise threading that is capable of receiving a corresponding screw mechanism of the one or more rotatable latches.

Abstract: An interconnection assembly for a motherboard uses right-angle edge connectors attached to a bottom side of the motherboard, and vertical header connectors attached to the top side. The header connectors mate with a transition card assembly which includes a transition card having plated through holes that receive pins of the header connectors. Right-angle mezzanine connectors mounted on the transition card have pins that extend into the plated through holes from the top side. The edge connectors and mezzanine connectors both face forward in a common direction. The transition card has holes along a rear edge to retain pressed-in nuts for mounting to a stabilizing bezel. Instead of pins being part of the header connectors, connector caps may be provided with pins having first ends that extend into sockets of the header connectors and second ends that extend into the plated through holes of the transition card.

Abstract: An interconnection assembly for a motherboard uses right-angle edge connectors attached to a bottom side of the motherboard, and vertical header connectors attached to the top side. The header connectors mate with a transition card assembly which includes a transition card having plated through holes that receive pins of the header connectors. Right-angle mezzanine connectors mounted on the transition card have pins that extend into the plated through holes from the top side. The edge connectors and mezzanine connectors both face forward in a common direction. The transition card has holes along a rear edge to retain pressed-in nuts for mounting to a stabilizing bezel. Instead of pins being part of the header connectors, connector caps may be provided with pins having first ends that extend into sockets of the header connectors and second ends that extend into the plated through holes of the transition card.

Abstract: A latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a pivotable latch coupled to the field-replaceable unit via a pivot, at a first side of the unit, and a spring member associated with the enclosure. The spring member is engaged by the latch and deflects with rotating of the latch from an open position to a latched position. The pivotable latch includes the first end and a second end, with the pivot being disposed closer to the first end than the second. The deflecting spring member facilitates provision of positive pressure on the unit directed towards a second side of the unit opposite to the first side to facilitate, for example, fixedly coupling a first connector at the second side to a second connector associated with the enclosure when the unit is latched within the enclosure.

Abstract: Fabrication of a latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a pivotable latch coupled to the field-replaceable unit via a pivot, at a first side of the unit, and a spring member associated with the enclosure. The spring member is engaged by the latch and deflects with rotating of the latch from an open position to a latched position. The pivotable latch includes the first end and a second end, with the pivot being disposed closer to the first end than the second. The deflecting spring member facilitates provision of positive pressure on the unit directed towards a second side of the unit opposite to the first side to facilitate, for example, fixedly coupling a first connector at the second side to a second connector associated with the enclosure when the unit is latched within the enclosure.

Abstract: A latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a rotatable latch coupled to the field-replaceable unit, via a pivot, at a first side of the field-replaceable unit, and a compliant spring member disposed to act on the pivot. The compliant spring member acts on the pivot and compresses with rotating of the latch from an open position to a latched position during latching of the field-replaceable unit within the enclosure. The compressing facilitates provision of a positive pressure on or across the field-replaceable unit directed towards a second side of the field-replaceable unit opposite to the first side. This positive pressure facilitates, for example, fixed coupling of a first connector at the second side of the field-replaceable unit to a second connector associated with the enclosure when the field-replaceable unit is latched within the enclosure.

Abstract: A connector apparatus is provided which includes a connector and a mechanical connect-assist mechanism associated, at least in part, with the connector. The connector is configured to operatively plug into a socket structure, and the mechanical connect-assist mechanism includes a cam shaft rotatably coupled to the connector and a connect-assist element projecting from the rotatable cam shaft. The connect-assist element is configured to engage at least one element-receiving opening associated with the socket structure with insertion of the connector within the socket structure. Rotating of the rotatable cam shaft moves the connect-assist element within the at least one element-receiving opening to facilitate secure seating and retention of the connector within the socket structure.

Abstract: A connector apparatus is provided which includes a connector and a mechanical connect-assist mechanism associated, at least in part, with the connector. The connector is configured to operatively plug into a socket structure, and the mechanical connect-assist mechanism includes a cam shaft rotatably coupled to the connector and a connect-assist element projecting from the rotatable cam shaft. The connect-assist element is configured to engage at least one element-receiving opening associated with the socket structure with insertion of the connector within the socket structure. Rotating of the rotatable cam shaft moves the connect-assist element within the at least one element-receiving opening to facilitate secure seating and retention of the connector within the socket structure.

Abstract: A latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a rotatable latch coupled to the field-replaceable unit, via a pivot, at a first side of the field-replaceable unit, and a compliant spring member disposed to act on the pivot. The compliant spring member acts on the pivot and compresses with rotating of the latch from an open position to a latched position during latching of the field-replaceable unit within the enclosure. The compressing facilitates provision of a positive pressure on or across the field-replaceable unit directed towards a second side of the field-replaceable unit opposite to the first side. This positive pressure facilitates, for example, fixed coupling of a first connector at the second side of the field-replaceable unit to a second connector associated with the enclosure when the field-replaceable unit is latched within the enclosure.

Abstract: A multi-chip electronic module includes a circuit board having a first end portion, a second end portion, a first surface portion and an opposing second surface portion. A plurality of electronic components is mounted to the first surface portion of the circuit board. A heat spreader member is supported at the first surface portion of the circuit board. The heat spreader includes a body having a first end, a second end, a first surface and a second surface. The first end portion and first end define a fluid inlet, and the second end portion and second end define a fluid outlet. The second surface is in thermal contact with the plurality of electronic components. The heat spreader member and circuit board define an enclosed fluid duct having a plurality of substantially parallel flow paths.

Abstract: An electromagnetic compatibility (“EMC”) gasket includes a first conductive portion moveable to a plurality of positions. A secondary conductive portion is connected to the first conductive portion at an adjacent edge. A third conductive portion is opposite the secondary conductive portion such that the first portion is between the second and third portions. The third conductive portion is connected to the first conductive portion at an adjacent edge. The third conductive portion is curved creating a hook structure such that when in a housing the third conductive portion engages a portion of the housing. This engagement causes the first conductive portion of the EMC gasket to fold and/or flex as an electronic card is moved within the housing in a lateral direction while the housing is disposed stationary in a chassis to mate a connector on the electronic card with a connector in the chassis.