Abstract: A gain clamped optical device includes a semiconductor stack and a resonant cavity configured to emit stimulated light. A window created in the optical device is configured to emit the stimulated light in an LED mode.

Abstract: An optical sensor, sensing system and method of sensing employ a half-core hollow optical waveguide adjacent to a surface of an optical waveguide layer of a substrate. The half-core hollow optical waveguide and the adjacent optical waveguide layer cooperatively provide both an optical path that confines and guides an optical signal and an internal hollow channel. The optical path and channel extend longitudinally along a hollow core of the half-core hollow optical waveguide. The system further includes an optical source at an input of the optical path and an optical detector at an output of the optical path. A spectroscopic interaction between an analyte material that is introduced into the channel and an optical signal propagating along the optical path determines a characteristic of the analyte material.

Abstract: A method of aligning first and second mating surfaces includes: generating a random or pseudo-random function; convolving the random or pseudo-random function with a spread function to produce a correlated function; forming a pattern of bi-polar material on the first mating surface based on a quantization of the correlated function; and forming a complementary pattern of the bi-polar material on the second mating surface. The complementary patterns exert a force on each other toward a desired alignment of the first and second mating surfaces. A system includes a first member having a first correlated pattern of material disposed on a first mating surface; and a second member having a second correlated pattern of material disposed on a second mating surface, wherein the second correlated pattern is complementary to the first correlated pattern. The first and second correlated patterns interact to facilitate a desired alignment of the first and second members.

Abstract: A system and methods for dividing an optical beam in a hollow metallized waveguide are disclosed. The method includes directing an optical signal into a first section of a hollow metallized waveguide. The optical signal is adiabatically expanded in a second section of the hollow metallized waveguide coupled to the first section. The optical signal is split with an in-plane optical beam splitter located in a third section of the hollow metallized waveguide coupled to the second section.

Abstract: Data processing modules including a housing and connectors carried by the housing, and systems including the same.

Abstract: A photodetector includes a first layer, a second layer and a plurality of nanowires established between the first and second layers. At least some of the plurality of nanowires have a bandgap that is different from a bandgap of at least some other of the plurality of nanowires.

Abstract: Embodiments of the present invention relate to nanowire-based photovoltaic cells and to methods for fabricating the same. In one embodiment, a photovoltaic cell includes a first semiconductor layer doped with a first impurity and disposed on a portion of a first raised surface of a substrate and a second semiconductor layer doped with a second impurity and disposed on a second raised surface of the substrate. The first semiconductor layer has at least one negatively sloped surface, and the second semiconductor layer has at least one positively sloped surface neighboring the at least one negatively sloped surface of the first semiconductor layer. The photovoltaic cell includes at least one nanowire electronically coupled to the negatively sloped surface of the first semiconductor layer and electronically coupled to the positively sloped surface of the second semiconductor layer.

Abstract: A photonic connection includes a first fiber and a second fiber. The first fiber has a core with a first predetermined pattern defined on or in a facet thereof, and the second fiber has a core with a second predetermined pattern defined on or in a facet thereof. The second predetermined pattern is complementary to the first predetermined pattern such that the first fiber or the second fiber fits into another of the second fiber or the first fiber at a single orientation and position.

Abstract: Various embodiments of the present invention are directed to photonic switches and switch fabrics employing the photonic switches. In one embodiment of the present invention, a photonic switch comprises a first waveguide disposed on a surface of a substrate in proximity to an opening in the substrate, and a second waveguide crossing the first waveguide and positioned in proximity to the opening in the substrate. The photonic switch includes a tunable microring resonator disposed on the surface of the substrate adjacent to the first waveguide and the second waveguide and configured with an opening aligned with the opening in the substrate. The photonic switch also includes a wire having a first end and a second end and configured to pass through the opening in the microring and the opening in the substrate.

Abstract: For integrated circuits including circuit packaging and circuit communication technologies provision is made for a method of interconnecting or mapping a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array. Also provided is an arrangement for the interconnecting or mapping of a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array.

Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.

Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.

Abstract: For integrated circuits including circuit packaging and circuit communication technologies provision is made for a method of interconnecting or mapping a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array. Also provided is an arrangement for the interconnecting or mapping of a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array.

Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.

Abstract: Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.

Abstract: An InAsP active region for a long wavelength light emitting device and a method for growing the same are disclosed. In one embodiment, the method comprises placing a substrate in an organometallic vapor phase epitaxy (OMVPE) reactor, the substrate for supporting growth of an indium arsenide phosphide (InAsP) film, forming a quantum well layer of InAsP, and forming a barrier layer adjacent the quantum well layer, where the quantum well layer and the barrier layer are formed at a temperature of less than 520 degrees C. Forming the quantum well layer and the barrier layer at a temperature of less than 520 degrees C. results in fewer dislocations by suppressing relaxation of the layers. A long wavelength active region including InAsP quantum well layers and InGaP barrier layers is also disclosed.

Abstract: For integrated circuits including circuit packaging and circuit communication technologies provision is made for a method of interconnecting or mapping a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array. Also provided is an arrangement for the interconnecting or mapping of a two-dimensional optoelectronic (OE) device array to a one-dimensional waveguide array.

Abstract: A self-propulsion hovering vacuum cleaner for domestic or industrial application has air outlets predisposed symmetrically along the longitudinal axis of the underside of the casing for directing more air to the front and back directions of the vacuum cleaner to achieve even distribution of air underneath the vacuum cleaner, thereby reducing juddering or rocking effects. The underside of the casing has a curved surface predisposed symmetrically along the longitudinal axis of the underside of the casing for better retention of air to enhance the hovering effect. In another embodiment of the present invention, air distribution channels are predisposed symmetrically on both sides of the underside of the casing along the longitudinal axis. The air distribution channels are in communication with the air outlets for directing more air to the front and back of the vacuum cleaner. The improved hovering vacuum machine also has self-propulsion features and self-cooling features.

Abstract: A self-contained dispenser apparatus configured to dispense a continuous feed of plastic bag material wound in a coreless roll thereof. The dispenser apparatus includes a base portion defining an opening into a receiving bay thereof. A cover assembly is removably mountable to the base portion, and includes an end cover portion positioned over the opening to enclose the coreless roll therein. A dispensing slot extends through the end cover that enables one end of plastic bag material to continuously feed therethrough. The cover assembly further includes a cutting assembly positioned proximate the dispensing slot to enable severing of the plastic bag material.

Abstract: Vehicle-based lidar systems and methods are disclosed using multiple lasers to provide more compact and cost-effective lidar functionality. Each laser in an array of lasers can be sequentially activated so that a corresponding optical element mounted with respect to the array of lasers produces respective interrogation beams in substantially different directions. Light from these beams is reflected by objects in a vehicle's environment, and detected so as to provide information about the objects to vehicle operators and/or passengers.