Patents by Inventor Michael W. Cumbie

Michael W. Cumbie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LIQUID LEVEL INDICATING
    Publication number: 20200348163
    Abstract: In some examples, a liquid container comprises a chamber forming a volume containing a liquid, an elongated strip extending into the volume containing the liquid, a plurality of heaters supported by the strip along the strip, and a plurality of temperature sensors supported by the strip along the strip. The temperature sensors output signals indicative of dissipation of heat from the heaters to indicate a level of the liquid in the volume.
    Type: Application
    Filed: July 15, 2020
    Publication date: November 5, 2020
    Inventors: Michael W. Cumbie, Robert N.K. Browning
  • Transfer molded fluid flow structure
    Patent number: 10821729
    Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding, a fluid feed hole formed through the micro device, and a transfer molded fluid channel in the molding that fluidically couples the fluid feed hole with the channel.
    Type: Grant
    Filed: July 29, 2013
    Date of Patent: November 3, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • TWO-STEP MOLDING FOR A LEAD FRAME
    Publication number: 20200343153
    Abstract: Examples for a two-step insert molding process to encapsulate a pre-molded lead frame (104, 304, 504, 704) are described herein. In some examples, a first circuit component (106, 306, 506) and a first portion of a trace array (110, 310, 510) of the pre-molded lead frame for an integrated circuit (1C) assembly are encapsulated by a first insert molding component (112, 312, 512a, 512b, 712). The trace array connects the first circuit component to a second circuit component (108, 308, 508) of the pre-molded lead frame. A second portion of the trace array is encapsulated by a second insert molding component (114, 314, 514, 714).
    Type: Application
    Filed: November 16, 2018
    Publication date: October 29, 2020
    Inventors: Michael W. Cumbie, Chien-Hua Chen
  • Composite wafers
    Patent number: 10815121
    Abstract: A composite wafer includes a first silicon die with a first top surface; and a polymer substrate with a top surface and a bottom surface. The silicon die is embedded in the polymer substrate such that the top surface of the substrate and the first top surface of the first silicon die are coplanar and the bottom surface of the polymer substrate is planar.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: October 27, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Si-lam J. Choy, Chien-Hua Chen, Michael W. Cumbie, Devin Alexander Mourey
  • FLUID EJECTION DEVICE INCLUDING FLUID OUTPUT CHANNEL
    Publication number: 20200331264
    Abstract: A fluid ejection die includes an ejection nozzle and an ejection chamber fluidly connected to the ejection nozzle. The die includes a fluid input hole fluidly connected to the ejection chamber, a fluid output hole, and a fluid output channel fluidly connected to the ejection chamber and the fluid output hole. The die includes a fluid circulation rib positioned between the fluid input hole and the fluid output hole.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Michael W Cumbie, Chien-Hua Chen
  • COMPLEX IMPEDANCE DETECTION
    Publication number: 20200331259
    Abstract: A printhead may include a nozzle, a firing chamber fluidly coupled to the nozzle, a printing fluid slot fluidly coupled to the firing chamber, and a sensor to detect a plurality of complex impedance values of a printing fluid at the printhead over a plurality of frequencies and create a printing fluid signature of the printing fluid. A method of determining at least one characteristic of a printing fluid provided to a printhead ma include, with a number of sensors, applying an alternating current at a plurality of frequencies over time to the printing fluid to receive a plurality of complex impedance values and comparing the plurality of complex impedance signals to a number of stored signals.
    Type: Application
    Filed: July 21, 2016
    Publication date: October 22, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua CHEN, Michael W. CUMBIE, Devin Alexander Mourey
  • Inverted TIJ
    Patent number: 10780698
    Abstract: A fluid ejection die includes a substrate including an array of nozzles.
    Type: Grant
    Filed: June 29, 2016
    Date of Patent: September 22, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, Jr., Chien-Hua Chen, Erik D. Torniainen
  • Printbars and methods of forming printbars
    Patent number: 10780696
    Abstract: A method of forming a printbar module may include providing a printed circuit board (PCB) having a recess extending partially through the PCB and a dam surrounding the recess. An adhesive material may be applied to the recess and a printhead die sliver may be positioned in the recess. The printhead die sliver may be bonded with the PCB and the printhead die sliver and the PCB may be encapsulated with a molding compound. In response to encapsulating, a slot, extending through the PCB and the adhesive material may be formed, wherein the slot is in fluidic communication with fluid feed holes of the printhead die sliver to provide direct fluidic communication without fan-out.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: September 22, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Fluid ejection dies
    Patent number: 10780697
    Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, and a number of heat exchangers thermally coupled to an ejection side of the fluid ejection die. Further, the fluid ejection device may include a number of cooling channels defined in the moldable material thermally coupled to the heat exchangers.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: September 22, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, James R Przybyla
  • FLUID CIRCULATION AND EJECTION
    Publication number: 20200290365
    Abstract: A fluid circulation and ejection system may include a microfluidic die, a single orifice fluid ejector having a drive chamber in the microfluidic die and a pressurized fluid source remote from the microfluidic die to create a pressure gradient across the drive chamber to circulate fluid across the drive chamber.
    Type: Application
    Filed: December 2, 2017
    Publication date: September 17, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Si-lam Choy, Michael W. Cumbie, Chien-Hua Chen
  • CROSS-DIE RECIRCULATION CHANNELS AND CHAMBER RECIRCULATION CHANNELS
    Publication number: 20200282738
    Abstract: A die may, in an example, include at least one cross-die recirculation channel formed into the die to recirculate an amount of printing fluid therethrough, the cross-die recirculation channel including a first-sized inlet port and a first-sized outlet port formed on a first side of the die, at least one chamber recirculation channel formed into the die and fluidically coupled to the cross-die recirculation channel to recirculate an amount of printing fluid therethrough, the chamber recirculation channel including a second-sized inlet port and a second-sized outlet port, at least one pump formed within the chamber recirculation channel to recirculate the amount of printing fluid therethrough.
    Type: Application
    Filed: November 27, 2017
    Publication date: September 10, 2020
    Inventors: Chien-Hua Chen, Jeffrey R. Pollard, Michael W. Cumbie, Si-La in Choy
  • PLANARIZATION LAYERS OVER SILICON DIES
    Publication number: 20200282394
    Abstract: A microfluidic apparatus may include, in an example, a substrate, at least one silicon die embedded into the substrate, and a planarization layer layered over, at least, a portion of the substrate that interfaces with the silicon die to prevent a fluid from contacting an edge of the silicon die.
    Type: Application
    Filed: October 12, 2017
    Publication date: September 10, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Michael W. Cumbie, Chien-Hua Chen
  • Flexible carrier for fluid flow structure
    Patent number: 10751997
    Abstract: In some examples, a method of making a printhead flow structure includes bonding a flex circuit to a flexible carrier with a thermal release tape, placing a printhead die on the flexible carrier, and debonding the printhead flow structure including the flex circuit and the printhead die from the flexible carrier at a temperature below a release temperature of the thermal release tape by flexing the flexible carrier.
    Type: Grant
    Filed: July 2, 2018
    Date of Patent: August 25, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael G. Groh, Michael W. Cumbie
  • Relative pressure sensor
    Patent number: 10753815
    Abstract: Examples provide an apparatus including a relative pressure sensor that includes a substrate and a cavity in a face of the substrate. The cavity has a floor in the substrate. A passage extends from the cavity. A membrane supports a pressure sensing device and is mounted to the substrate opposite the floor.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: August 25, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Chien-Hua Chen
  • Liquid level indicating
    Patent number: 10739181
    Abstract: In some examples, a liquid container comprises a chamber forming a volume containing a liquid, an elongated strip extending into the volume containing the liquid, the strip supported along a side of the volume such that a face of the strip adjacent the side of the volume is not opposed by the liquid, a plurality of heaters supported by the strip along the strip, and a plurality of temperature sensors supported by the strip along the strip.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: August 11, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Robert N. K. Browning
  • MICROFLUIDIC DEVICES
    Publication number: 20200246799
    Abstract: In an example implementation, a reagent storage system for a microfluidic device includes a microfluidic chamber formed in a microfluidic device. A blister pack to store a reagent includes an electrically conductive membrane barrier adjacent to the chamber. A thinned region is formed in the membrane barrier, and a conductive trace is to supply electric current to heat and melt the thinned region. Melting the thinned region is to cause the membrane barrier to open and release the reagent into the chamber.
    Type: Application
    Filed: October 30, 2017
    Publication date: August 6, 2020
    Inventors: Viktor Shkolnikov, Michael W Cumbie, Chien-Hua Chen
  • FLUID EJECTION DIE MOLDED INTO MOLDED BODY
    Publication number: 20200247123
    Abstract: A fluid ejection device includes a molded body having a first molded surface and a second molded surface opposite the first molded surface, and a fluid ejection die molded into the molded body, with the fluid ejection die having a first surface substantially coplanar with the first molded surface of the molded body and a second surface substantially coplanar with the second molded surface of the molded body, with the first surface of the fluid ejection die having a plurality of fluid ejection orifices formed therein and the second surface of the fluid ejection die having at least one fluid feed slot formed therein.
    Type: Application
    Filed: April 24, 2017
    Publication date: August 6, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, Tony Fuller
  • FLUID EJECTION DIE HEAT EXCHANGERS
    Publication number: 20200238695
    Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, a number of fluid recirculation pumps within the fluid ejection die to recirculate fluid within a number of firing chambers of the fluid ejection die, and a number of heat exchangers thermally coupled to a fluid channel side of the fluid ejection die.
    Type: Application
    Filed: April 5, 2017
    Publication date: July 30, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, James R Przybyla
  • FLUIDIC DIES
    Publication number: 20200238699
    Abstract: A fluidic die includes a fluid channel layer including at least one fluid channel defined along a length of the fluid ejection device. The fluidic die also includes an interposer layer coupled to the fluid channel layer. The interposer layer includes a number of inlet ports defined in the interposer layer to fluidically couple the at least one channel layer to a fluid source, and a number of outlet ports defined in the interposer layer to fluidically couple the at least one channel layer to the fluid source.
    Type: Application
    Filed: September 20, 2017
    Publication date: July 30, 2020
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Si-lam Choy, Chien-Hua Chen, Michael W Cumbie
  • Fluid ejection device including fluid output channel
    Patent number: 10723128
    Abstract: Examples include a fluid ejection die. Examples comprise an ejection nozzle and an ejection chamber fluidly connected to the ejection nozzle. A fluid input hole is fluidly connected to the ejection chamber. A fluid output channel is also fluidly connected to the ejection chamber, and a fluid output hole is fluidly connected to the fluid output channel. Examples further comprise a fluid pump disposed in the fluid output channel to pump fluid from the ejection chamber out of the fluid output hole.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: July 28, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, Chien-Hua Chen