Patents by Inventor Michael W. Cumbie

Michael W. Cumbie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mixing chamber for laundry supplies
    Patent number: 11136703
    Abstract: Example implementations relate to a mixing chamber for laundry supplies. For example, an appliance may include a mixing chamber to receive at least one laundry supply and a processor coupled to the mixing chamber. The processor is to identify a user-specified setting associated with a laundry load, determine a characteristic of the laundry load, calculate an amount of the at least one laundry supply to apply to the laundry load based on the user-specified setting and the characteristic, and provide the amount of the at least one laundry supply to the mixing chamber, where the mixing chamber is to mix the amount of the at least one laundry supply.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: October 5, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, David Olsen, Diane R Hammerstad, Eric M Laplante
  • Die contact formations
    Patent number: 11135839
    Abstract: Examples include a fluid die embedded in a molded panel. The fluid die includes a substrate, and the substrate includes a first surface. The molded panel surrounding sides of the fluid die such that the first surface is disposed below a top surface of the molded panel. A raised contact formation is disposed on the substrate to extend at least up to the top surface of the molded panel.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: October 5, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, Anthony Fuller, Chien-Hua Chen, Zhen Yi Li
  • MICROFLUIDIC DEVICES
    Publication number: 20210299662
    Abstract: In an example implementation, a microfluidic device includes a first layer with a first microfluidic channel and a second layer with a second microfluidic channel. The first and second channels are adjacent to one another at a channel intersection, and a conductive membrane valve extends across and covers the channel intersection to separate the first and second channels. The microfluidic device includes a conductive trace to open the membrane valve and join the first and second channels by supplying an electric current to heat and melt a thinned region of the membrane valve.
    Type: Application
    Filed: October 30, 2017
    Publication date: September 30, 2021
    Inventors: Viktor Shkolnikov, Chien-Hua Chen, Michael W Cumbie
  • Molded fluid flow structure
    Patent number: 11130339
    Abstract: In one example, a fluid flow structure includes a micro device embedded in a monolithic molding having a channel therein through which fluid may flow directly to the device.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: September 28, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Silam J. Choy
  • VERTICAL INTERFACE FOR FLUID SUPPLY CARTRIDGE HAVING DIGITAL FLUID LEVEL SENSOR
    Publication number: 20210291540
    Abstract: A vertical interface for a fluid supply cartridge is to connect the fluid supply cartridge to a fluid-ejection device. The vertical interface includes one or more fluidic interconnect septums to vertically fluidically interconnect a supply of fluid of the fluid supply cartridge to the fluid-ejection device. The vertical interface includes an electrical interface to vertically conductively connect a digital fluid level sensor of the fluid supply cartridge to a corresponding electrical interface of the fluid-ejection device.
    Type: Application
    Filed: July 27, 2016
    Publication date: September 23, 2021
    Inventors: Anthony D. Studer, David C. Harvey, Michael W. Cumbie
  • FLUIDIC EJECTION DIES WITH ENCLOSED CROSS-CHANNELS
    Publication number: 20210291547
    Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.
    Type: Application
    Filed: June 7, 2021
    Publication date: September 23, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Si-Iam Choy, Michael W. Cumbie, Chien-Hua Chen, Jeffrey R. Pollard
  • NOZZLE ARRANGEMENTS
    Publication number: 20210291520
    Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.
    Type: Application
    Filed: June 3, 2021
    Publication date: September 23, 2021
    Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
  • INK CONTAINER
    Publication number: 20210283920
    Abstract: Aspects relating to an ink container for an image reproduction device are described herein. The ink container includes a body and an electrical connection. The body is formed by molding a polymer material having a metal seed layer. The electrical connection is formed by metallizing a plurality of traces in the metal seed layer. The electrical connection extends from an inside wall of the ink container to an outer wall. A width of the electrical connection on the inside wall of the ink container gradually varies from a bottom of the ink container to a rim.
    Type: Application
    Filed: September 30, 2016
    Publication date: September 16, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Boon Bing Ng, Michael W. Cumbie, Yee Kiat Ng
  • THERMAL CONTACT DIES
    Publication number: 20210283926
    Abstract: A thermal contact device may include a thermal contact die embedded in a moldable material. The thermal contact die may include a number of resistors integrated into the thermal contact die, and a number of heater drivers integrated into the thermal contact die and electronically coupled to the resistors. The moldable material is coplanar with a thermal contact side of the thermal contact device. Further, the moldable material includes at least one gradient edge along a medium feed path.
    Type: Application
    Filed: March 15, 2017
    Publication date: September 16, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Michael W Cumbie, Reynaldo V Villavelez, Chien-Hua Chen
  • IMAGING MEDIA
    Publication number: 20210283936
    Abstract: The present disclosure is drawn to imaging media. In one example, an imaging medium includes a substrate, a color layer on the substrate, and an opaque porous concealing layer over the color layer. The color layer includes a pattern of color regions, wherein individual color regions include multiple adjacently-applied colors. The opaque porous concealing layer has a coat weight from 2 gsm to 10 gsm. The opaque porous concealing layer includes transparent inorganic particles having a refractive index from 1.3 to 3, and void spaces between the transparent inorganic particles are occupied by air.
    Type: Application
    Filed: December 6, 2018
    Publication date: September 16, 2021
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Christopher Toles, Michael W. Cumbie, Jayprakash C. Bhatt, Juan Carlos Vives
  • HORIZONTAL INTERFACE FOR FLUID SUPPLY CARTRIDGE HAVING DIGITAL FLUID LEVEL SENSOR
    Publication number: 20210276337
    Abstract: A horizontal interface for a fluid supply cartridge is to connect the fluid supply cartridge to a fluid-ejection device. The horizontal interface includes one or more fluidic interconnect septums to horizontally fluidically interconnect a supply of fluid of the fluid supply cartridge to the fluid-ejection device. The horizontal interface includes an electrical interface to horizontally conductively connect a digital fluid level sensor of the fluid supply cartridge to a corresponding electrical interface of the fluid-ejection device.
    Type: Application
    Filed: July 27, 2016
    Publication date: September 9, 2021
    Inventors: Anthony D. Studer, David C. Harvey, Michael W. Cumbie
  • Preloaded storage container and print head to dispense fluid
    Patent number: 11110714
    Abstract: An apparatus includes a print head coupled to a substrate to dispense fluid from the substrate in response to a command. A reservoir coupled to the substrate transports the fluid to the print head. A preloaded storage container mounted on the reservoir stores the fluid and provides the fluid to the reservoir in response to pressure applied to the container.
    Type: Grant
    Filed: August 28, 2017
    Date of Patent: September 7, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jeffrey A. Nielsen, Michael W. Cumbie, Chien-Hua Chen
  • FLUID EJECTION DEVICES INCLUDING ELECTRICAL INTERCONNECT ELEMENTS FOR FLUID EJECTION DIES
    Publication number: 20210260872
    Abstract: A device includes a plurality of fluid ejection dies, wherein each of the fluid ejection dies includes a contact pad and a plurality of fluid actuation devices. The device includes an electrical interconnect element in contact with the contact pad of each of the fluid ejection dies to electrically interconnect the plurality of fluid ejection dies.
    Type: Application
    Filed: February 6, 2019
    Publication date: August 26, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Anthony M. FULLER, Daren L. FORREST, Michael W. CUMBIE, Michael GROOM, Conrad JENSSEN
  • Fluid ejection die molded into molded body
    Patent number: 11097537
    Abstract: A fluid ejection device includes a molded body having a first molded surface and a second molded surface opposite the first molded surface, and a fluid ejection die molded into the molded body, with the fluid ejection die having a first surface substantially coplanar with the first molded surface of the molded body and a second surface substantially coplanar with the second molded surface of the molded body, with the first surface of the fluid ejection die having a plurality of fluid ejection orifices formed therein and the second surface of the fluid ejection die having at least one fluid feed slot formed therein.
    Type: Grant
    Filed: April 24, 2017
    Date of Patent: August 24, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, Anthony M Fuller
  • CONDUCTIVE ELEMENTS ELECTRICALLY COUPLED TO FLUIDIC DIES
    Publication number: 20210252860
    Abstract: An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and separated from the fluidic die. A conductive lead may provide an electrical coupling between a ground of the fluidic die and the conductive element.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 19, 2021
    Inventors: Chien-Hua Chen, Michael W Cumbie
  • CONDUCTIVE ELEMENTS ELECTRICALLY COUPLED TO FLUIDIC DIES
    Publication number: 20210252858
    Abstract: An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and be coupled to a ground of the fluidic die. A material and size of the conductive element may be selected to engender galvanic effect at an approximately zero potential.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 19, 2021
    Inventors: Michael W Cumbie, Chien-Hua Chen, Randy Hoffman
  • FLUID PROPERTY SENSOR
    Publication number: 20210252871
    Abstract: This disclosure discusses a fluid property sensor, comprising an electrical circuit assembly (ECA) including an external interface coupled to a common interface bus; a fluid level sensor coupled to the common interface bus to indicate a fluid level and/or a pressure sensor coupled to the common interface bus to indicate a pressure event; and/or a driver circuit coupled to the common interface bus, configured to communicate characteristics of the fluid level sensor and the pressure sensor.
    Type: Application
    Filed: April 5, 2019
    Publication date: August 19, 2021
    Inventors: Anthony D. STUDER, David N. OLSEN, Michael W. CUMBIE, Chien-Hua CHEN, James Michael GARDNER, Scott A. LINN
  • Complex impedance detection
    Patent number: 11090929
    Abstract: A printhead may include a nozzle, a firing chamber fluidly coupled to the nozzle, a printing fluid slot fluidly coupled to the firing chamber, and a sensor to detect a plurality of complex impedance values of a printing fluid at the printhead over a plurality of frequencies and create a printing fluid signature of the printing fluid. A method of determining at least one characteristic of a printing fluid provided to a printhead ma include, with a number of sensors, applying an alternating current at a plurality of frequencies over time to the printing fluid to receive a plurality of complex impedance values and comparing the plurality of complex impedance signals to a number of stored signals.
    Type: Grant
    Filed: July 21, 2016
    Date of Patent: August 17, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Devin Alexander Mourey
  • DUAL DIRECTION DISPENSERS
    Publication number: 20210245151
    Abstract: A dual direction dispenser may include a fluid channel, a first ejection orifice extending in a first direction from the fluid channel, a first fluid actuator to displace fluid through the first ejection orifice, a second ejection orifice extending in a second direction, different than the first direction, from the fluid channel and a second fluid actuator to displace fluid through the second ejection orifice.
    Type: Application
    Filed: August 10, 2018
    Publication date: August 12, 2021
    Inventors: Michael W. CUMBIE, Chien-Hua CHEN, Pavel KORNILOVICH
  • REPLACEABLE PRINT APPARATUS COMPONENT
    Publication number: 20210240400
    Abstract: A replaceable print apparatus component includes a print material reservoir, a print material within the reservoir and a sensing system including an integrated circuit configured to connect to and communicate over a digital bus. The sensing system includes at least one sensor, a digital controller, an analog to digital converter electrically coupled to the digital controller, and a memory array electrically coupled to the digital controller. The digital controller is configured to generate a clock signal for timing operations of the integrated circuit. The operations include initiating the at least one sensor based on values stored in the memory array and generating outputs of the at least one sensor via the analog to digital converter.
    Type: Application
    Filed: December 3, 2019
    Publication date: August 5, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Michael W. CUMBIE, Scott A. LINN, James Michael GARDNER