Abstract: A method for producing input/output connections in a ceramic device is disclosed. The ceramic device can provide wraparound input/output connections. The method can include first providing first and second green ceramic layers, forming at least one via in each ceramic layer, the at least one via in the second layer being offset from and connecting to the via in the first ceramic layer, filling the vias with metallization, laminating the ceramic layers to form a laminate, scoring the laminate along at least one line extending through the first via and into a portion of the second ceramic layer such that the line does not intersect the at least one second via the ceramic laminate and metalization, and cleaving the laminate along the scored line. A ceramic device using this method can provide a wraparound connection extending partially up the side thereof, which can be advantageous in many multi-layer applications.