Patents by Inventor Michael Wozniak
Michael Wozniak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240130218Abstract: A compound comprising a first ligand LA of Formula I, is provided. In Formula I, moiety A and moiety B either a monocyclic ring or a polycyclic fused ring system; each of X1 to X4, Z1, and Z2 is C or N; K1 is a direct bond, O, S, N(R?), P(R?), B(R?), C(R?)(R?), or Si(R?)(R?); L1 is a direct bond or a linking group; each R?, R?, RA and RB is hydrogen or a General Substituent; and LA is coordinated to a metal M. In addition, RA or RB alone or in combination with a substituent of L1 form a 7-membered ring. Formulations, OLEDs, and consumer products containing the compound are also provided.Type: ApplicationFiled: August 7, 2023Publication date: April 18, 2024Applicant: Universal Display CorporationInventors: Alexey Borisovich Dyatkin, Elena Sheina, Zhiqiang Ji, Derek Ian Wozniak, Sean Michael Ryno, George Fitzgerald, Geza SZIGETHY, Hsiao-Fan CHEN
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Patent number: 11961193Abstract: Method for controlling a display of a mixed reality display device, wherein source and target point clouds representing a treatment objects surface are generated from image data and from medical imaging data of the treatment object. A number of segmentation masks are determined in the point clouds by applying semantic segmentation. A transformation between the source point cloud and the target point cloud is determined using the segmentation masks, and at least a part of the medical imaging data is superimposed on the treatment object using the determined transformation.Type: GrantFiled: September 9, 2020Date of Patent: April 16, 2024Assignee: APOQLAR GMBHInventors: Sirko Pelzl, Michael Wozniak
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Publication number: 20240106975Abstract: A system for collaborative video recording is described. The system may include a reference clock configured to track a reference time. The system may provide, to a plurality of recording devices, a synchronization code for a collaborative video recording session. The system may identify the plurality of recording devices as participants in the collaborative video recording session. The collaborative video recording session may include broadcasting one or more synchronization signals to synchronize the plurality of recording devices to the reference time tracked by the reference clock. The collaborative video recording session may include receiving a plurality of videos from the plurality of recording devices, wherein the plurality of videos comprise timestamps based on synchronization to the reference time. The collaborative video recording session may include generating a shared timeline for the plurality of videos, wherein the shared timeline synchronizes the timestamps between the plurality of videos.Type: ApplicationFiled: September 15, 2023Publication date: March 28, 2024Applicant: Apple Inc.Inventors: Robert K Molholm, Michael B Johnson, Michael C Tchao, Jeffrey A Wozniak, Vincent B Laforet, Pramod M Shantharam
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Publication number: 20240080594Abstract: A speaker can have a main body with a generally spheroidal shape, which can be supported standing on its end. The speaker can include a subwoofer that faces forward. A plurality of mid-range drivers can be distributed around the sub-woofer, facing generally forward and radially outward. A plurality of tweeters can be distributed around the sub-woofer, facing generally forward and generally outward. The outer housing portion of the speaker can be covered with a fabric material. A user interface ring 162 can be touch sensitive to receive input, and can have a plurality of lights that can be illuminated separately to convey information to the user.Type: ApplicationFiled: July 5, 2023Publication date: March 7, 2024Inventors: Timothy David Williamson, Peter Joseph Hamblin, Maximilian Vincent Wozniak, Robert James Wilson, Wilson E. Taylor, JR., Larry E. Hand, Mark Robert Westcott, Mark Edward Trainer, Ellie Rei Fukuda, Joel Robert Sietsema, Paul Michael Belanger, Matthew Patrick Lyons, Timothy Steven DeYoung, Werner Kirchmann, Ralph Wilhelm Hermann
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Patent number: 11918906Abstract: Embodiments are directed towards providing video game gameplay incorporating falling puzzle mechanics influenced by character movements within a puzzle space. In a preferred embodiment, a computer implemented method renders a game world that includes a puzzle space wherein a sequence of falling items aggregate in a puzzle formation. Players move characters within the puzzle space to remove items by colliding with them in an attempt to resolve the puzzle by clearing all items from the puzzle space. In one possible arrangement, the sequence of falling items is released according to character movements within the puzzle space. The relationship between character movements and falling puzzle items makes the game play more engaging by providing additional strategic and competitive elements to traditional falling puzzle games.Type: GrantFiled: August 27, 2021Date of Patent: March 5, 2024Assignee: YACHT CLUB GAMES, LLCInventors: David D'angelo, Alec Faulkner, Nickolas Wozniak, Sean Velasco, Ian Flood, Morgan Guyer, Michael Herbster, Russell Rafferty
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Publication number: 20220292786Abstract: Method for controlling a display of a mixed reality display device, wherein source and target point clouds representing a treatment objects surface are generated from image data and from medical imaging data of the treatment object. A number of segmentation masks are determined in the point clouds by applying semantic segmentation. A transformation between the source point cloud and the target point cloud is determined using the segmentation masks, and at least a part of the medical imaging data is superimposed on the treatment object using the determined transformation.Type: ApplicationFiled: September 9, 2020Publication date: September 15, 2022Inventors: Sirko Pelzl, Michael Wozniak
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Patent number: 8242376Abstract: A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided.Type: GrantFiled: August 11, 2010Date of Patent: August 14, 2012Assignee: Endicott Interconnect Technologies, Inc.Inventors: John M. Lauffer, Voya R. Markovich, Michael Wozniak
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Publication number: 20100328868Abstract: A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided.Type: ApplicationFiled: August 11, 2010Publication date: December 30, 2010Applicant: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.Inventors: John M. Lauffer, Voya R. Markovich, Michael Wozniak
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Patent number: 7838776Abstract: A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided.Type: GrantFiled: April 17, 2008Date of Patent: November 23, 2010Assignee: Endicott Interconnect Technologies, Inc.Inventors: John M. Lauffer, Voya R. Markovich, Michael Wozniak
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Publication number: 20080259581Abstract: A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided.Type: ApplicationFiled: April 17, 2008Publication date: October 23, 2008Inventors: John M. Lauffer, Voya R. Markovich, Michael Wozniak
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Patent number: 7383629Abstract: A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided, as is a method of making the substrate.Type: GrantFiled: November 19, 2004Date of Patent: June 10, 2008Assignee: Endicott Interconnect Technologies, Inc.Inventors: John M. Lauffer, Voya R. Markovich, Michael Wozniak
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Publication number: 20080111655Abstract: This disclosure discusses a means of generating a magnetic field around a device such that it can interact with the geomagnetic field of the earth in such a manner to develop a net lift against the pull of gravity. A flow of electric current is directed in a manner that exposes only a part of the magnetic field while the balance is sequestered within the device and shielded from exposure to the geomagnetic field. Hence an object can be lifted off the surface of the earth by electromagnetic means alone without the need for interacting with the atmosphere, as in airplanes, or the need for the expulsion of material as in chemical rockets. The magnetic flotation device can be likened to a gas-filled balloon except that the buoyancy is provided by the interaction of magnetic fields, not gas density.Type: ApplicationFiled: November 15, 2006Publication date: May 15, 2008Inventors: John Michael Wozniak, John Alexander Wozniak
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Publication number: 20080022867Abstract: Multicolor image, formed from at least two component images, are printed on non-planar surfaces of edible pieces by maintaining registration of the pieces from one printing station to another. The registration is maintained by firmly securing the pieces to the transporting surface by applying a pressure differential, by a combination of a pressure differential with a resilient surface, or by trapping the pieces between a retaining member and a recess portion.Type: ApplicationFiled: October 2, 2007Publication date: January 31, 2008Applicants: Ackley Machine Corporation, Mars IncorportedInventors: E. ACKLEY, Samuel Louden, James Suttle, Michael Webster, Neil Willcocks, Michael Wozniak
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Publication number: 20070062404Abstract: Multicolor image, formed from at least two component images, are printed on non-planar surfaces of edible pieces by maintaining registration of the pieces from one printing station to another. The registration is maintained by firmly securing the pieces to the transporting surface by applying a pressure differential, by a combination of a pressure differential with a resilient surface, or by trapping the pieces between a retaining member and a recess portion.Type: ApplicationFiled: November 17, 2006Publication date: March 22, 2007Applicants: Ackley Machine Corporation, Mars IncorportedInventors: E. Ackley, Samuel Louden, James Suttle, Michael Webster, Neil Willcocks, Michael Wozniak
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Patent number: 7169313Abstract: A method of plating a circuit pattern on a substrate to produce a circuitized substrate (e.g., a printed circuit board) in which a dual step metallurgy application process is used in combination with a dual step photo-resist removal process. Thru-holes are also possible, albeit not required.Type: GrantFiled: May 13, 2005Date of Patent: January 30, 2007Assignee: Endicott Interconnect Technologies, Inc.Inventors: Norman A. Card, Robert D. Edwards, John J. Konrad, Roy H. Magnuson, Timothy L. Wells, Michael Wozniak
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Publication number: 20060255009Abstract: A method of plating a circuit pattern on a substrate to produce a circuitized substrate (e.g., a printed circuit board) in which a dual step metallurgy application process is used in combination with a dual step photo-resist removal process. Thru-holes are also possible, albeit not required.Type: ApplicationFiled: May 13, 2005Publication date: November 16, 2006Applicant: Endicott Interconnect Technologies, Inc.Inventors: Norman Card, Robert Edwards, John Konrad, Roy Magnuson, Timothy Wells, Michael Wozniak
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Publication number: 20060110898Abstract: A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided, as is a method of making the substrate.Type: ApplicationFiled: November 19, 2004Publication date: May 25, 2006Applicant: Endicott Interconnect Technologies, Inc.Inventors: John Lauffer, Voya Markovich, Michael Wozniak
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Patent number: 6845557Abstract: A method for creating an impedance controlled printing wiring board, particularly the formation of a structure for high speed printed wiring boards incorporating multiple differential impedance controlled layers. Furthermore, disclosed is the provision of a method for producing an impedance controlled printed circuit wiring board. Also, there is the provision of a method for producing high speed printed wiring boards with multiple differential impedance controlled layers.Type: GrantFiled: August 22, 2002Date of Patent: January 25, 2005Assignee: International Business Machines CorporationInventors: Thomas R. Miller, William J. Rudik, Robert J. Testa, Kevin P. Unger, Michael Wozniak
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Patent number: 6776852Abstract: A process of removing excess holefill material from a surface of an electronic substrate in which the holefill residue is contacted with a swelling agent followed by planarizing of the surface in the presence of an agent no stronger than a liquid having a pH of about 6 to about 8.Type: GrantFiled: January 14, 2002Date of Patent: August 17, 2004Assignee: International Business Machines CorporationInventors: Christina M. Boyko, Brian E. Curcio, Donald S. Farquhar, Michael Wozniak
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Publication number: 20030209799Abstract: A circuitized semiconductor substrate comprising a layer of dielectric material having holes therethrough, a catalyst seed layer lining the walls of the holes along the surface of the dielectric material, and a nickel layer in the openings and a layer of copper above the nickel layer, along with a method for its fabrication. The invention also provides copper-nickel laminate PTH barrels and methods for their fabrication.Type: ApplicationFiled: June 16, 2003Publication date: November 13, 2003Applicant: International Business Machines CorporationInventors: Roy H. Magnuson, Voya R. Markovich, Thomas R. Miller, Michael Wozniak