Patents by Inventor Michael Yang

Michael Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260141006
    Abstract: Various systems and methods for aggregating data from disparate sources to determine an optimal package of data items are disclosed. For example, the system described herein can obtain data items from various sources, aggregate and/or organize the data items into an optimal package based on various criteria, and present, via an interactive user interface, the optimal package. Furthermore, the interactive user interface may enable a user to adjust the criteria used to aggregate and/or organize the data items. The system may interactively re-aggregate and re-organize the data items using the adjusted criteria as the user interacts with the package via the user interface. The system and user interface may thus enable the user to optimize the packages of data items based on multiple factors quickly and efficiently.
    Type: Application
    Filed: January 12, 2026
    Publication date: May 21, 2026
    Inventors: Xiangnong Wang, Yifei Huang, Michael Yang, Francis Chen, Andy Chen, Andre Frederico Cavalheiro Menck, Christopher Yu, Grace Garde, Mark Cinali, James Winchester, Peter Wang, Nitish Kulkarni
  • Publication number: 20260118062
    Abstract: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.
    Type: Application
    Filed: December 15, 2025
    Publication date: April 30, 2026
    Inventors: Manuel Sohn, Alex Wansidler, Dieter Hezler, Joseph Cibere, Rolf Bremensdorfer, Martin Zucker, Pete Lembesis, Michael Yang
  • Patent number: 12554781
    Abstract: Various systems and methods for aggregating data from disparate sources to determine an optimal package of data items are disclosed. For example, the system described herein can obtain data items from various sources, aggregate and/or organize the data items into an optimal package based on various criteria, and present, via an interactive user interface, the optimal package. Furthermore, the interactive user interface may enable a user to adjust the criteria used to aggregate and/or organize the data items. The system may interactively re-aggregate and re-organize the data items using the adjusted criteria as the user interacts with the package via the user interface. The system and user interface may thus enable the user to optimize the packages of data items based on multiple factors quickly and efficiently.
    Type: Grant
    Filed: January 6, 2022
    Date of Patent: February 17, 2026
    Assignee: Palantir Technologies Inc.
    Inventors: Xiangnong Wang, Yifei Huang, Michael Yang, Francis Chen, Andy Chen, Andre Frederico Cavalheiro Menck, Christopher Yu, Grace Garde, Mark Cinali, James Winchester, Peter Wang, Nitish Kulkarni
  • Patent number: 12535273
    Abstract: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a rotation system configured to rotate the workpiece support, a gas delivery system configured to flow one or more process gases into the processing chamber from the a first side of the processing chamber, one or more gas exhaust ports for removing gas from the processing chamber such that a vacuum pressure can be maintained, one or more radiative heating sources disposed on the second side of the processing chamber, one or more dielectric windows disposed between the workpiece support and the one or more radiative heating sources, and a workpiece temperature measurement system configured at a temperature measurement wavelength range to obtain a measurement indicative of a temperature of a back side of the workpiece.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: January 27, 2026
    Assignees: Beijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.
    Inventors: Manuel Sohn, Alex Wansidler, Dieter Hezler, Joseph Cibere, Rolf Bremensdorfer, Martin Zucker, Pete Lembesis, Michael Yang
  • Publication number: 20260015722
    Abstract: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a gas delivery system, and radiative heat sources for heating the workpiece. The gas delivery system includes a gas showerhead assembly that is transparent to electromagnetic radiation emitted from the one or more radiative heat sources. The gas showerhead assembly includes one or more gas diffusion mechanisms to distribute gas within the enclosure.
    Type: Application
    Filed: September 17, 2025
    Publication date: January 15, 2026
    Inventors: Michael Yang, Yun Yang, Manuel Sohn, Silke Hamm, Alex Wansidler, Dieter Hezler, Rolf Bremensdorfer
  • Patent number: 12442078
    Abstract: A processing apparatus for a thermal treatment of a workpiece is presented. The processing apparatus includes a processing chamber, a workpiece support disposed within the processing chamber, a gas delivery system, and radiative heat sources for heating the workpiece. The gas delivery system includes a gas showerhead assembly that is transparent to electromagnetic radiation emitted from the one or more radiative heat sources. The gas showerhead assembly includes one or more gas diffusion mechanisms to distribute gas within the enclosure.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: October 14, 2025
    Assignees: Beijing E-Town Semiconductor Technology Co., Ltd, Mattson Technology, Inc.
    Inventors: Michael Yang, Yun Yang, Manuel Sohn, Silke Hamm, Alex Wansidler, Dieter Hezler, Rolf Bremensdorfer
  • Patent number: 12400916
    Abstract: A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors.
    Type: Grant
    Filed: March 6, 2024
    Date of Patent: August 26, 2025
    Assignees: Beijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.
    Inventors: Michael Storek, Rolf Bremensdorfer, Markus Lieberer, Michael Yang
  • Publication number: 20250173781
    Abstract: Aspects of the subject technology include receiving a selection of a trigger event, a set of workflows associated with the trigger event, wherein each workflow is assigned a respective priority attribute, and a set of custom expressions, wherein each custom expression corresponds to a respective workflow and specifies one or more conditions associated with the trigger event. Aspects also include receiving an occurrence of the trigger event and, in response to a determination that the trigger event matches a custom expression for at least one workflow, performing a workflow of the set of workflows having a greatest priority and for which the associated respective custom expression is satisfied, wherein performing a workflow includes performing a set of recovery actions. Aspects also include, in response to a determination that the trigger event does not match any of the respective sets of custom expressions, performing a default workflow.
    Type: Application
    Filed: November 28, 2023
    Publication date: May 29, 2025
    Inventors: Graham RHODES, Michael YANG, Henry FUZ, Fried FILLER, Chihhung LIN
  • Patent number: 12183558
    Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.
    Type: Grant
    Filed: October 25, 2023
    Date of Patent: December 31, 2024
    Assignees: Beijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.
    Inventors: Dixit Desai, Alex Wansidler, Dieter Hezler, Joseph Cibere, Rolf Bremensdorfer, Pete Lembesis, Michael Yang
  • Publication number: 20240290664
    Abstract: A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors.
    Type: Application
    Filed: March 6, 2024
    Publication date: August 29, 2024
    Inventors: Michael Storek, Rolf Bremensdorfer, Markus Lieberer, Michael Yang
  • Patent number: 11955388
    Abstract: A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors.
    Type: Grant
    Filed: March 17, 2023
    Date of Patent: April 9, 2024
    Assignees: Beijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.
    Inventors: Michael Storek, Rolf Bremensdorfer, Markus Lieberer, Michael Yang
  • Patent number: 11923215
    Abstract: A processing system for processing a plurality of workpieces includes a transfer chamber in process flow communication with a first processing chamber and a second processing chamber, the transfer chamber having a first straight side, wherein the first process chamber includes at least one first processing station, and wherein the first processing chamber is disposed along the first straight side, wherein the second process chamber includes at least two second processing stations, wherein the second processing chamber is disposed along the first straight side, and wherein the second process chamber disposed in linear arrangement with the first process chamber along the first straight side, and wherein the transfer chamber includes at least one workpiece handling robot configured to transfer at least one workpiece to the at least one first processing station and the at least two second processing stations.
    Type: Grant
    Filed: October 19, 2022
    Date of Patent: March 5, 2024
    Assignees: Beijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.
    Inventor: Michael Yang
  • Publication number: 20240055242
    Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.
    Type: Application
    Filed: October 25, 2023
    Publication date: February 15, 2024
    Inventors: Dixit Desai, Alex Wansidler, Dieter Hezler, Joseph Cibere, Rolf Bremensdorfer, Pete Lembesis, Michael Yang
  • Patent number: 11837447
    Abstract: An apparatus for combining plasma processing and thermal processing of a workpiece is presented. The apparatus includes a processing chamber, a plasma chamber separated from the processing chamber disposed on a first side of the processing chamber, and a plasma source configured to generate a plasma in the plasma chamber. A quartz workpiece support is disposed within the processing chamber, the workpiece support configured to support a workpiece. One or more radiative heat sources configured to heat the workpiece are disposed on a second and opposite side of the first side of the processing chamber. A dielectric window is disposed between the workpiece support and the one or more heat sources. In addition, the apparatus includes a temperature measurement system configured to obtain a temperature measurement indicative of a temperature of the workpiece.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: December 5, 2023
    Assignees: Beijing E-Town Semiconductor Technology Co., Ltd., Mattson Technology, Inc.
    Inventors: Dixit Desai, Alex Wansidler, Dieter Hezler, Joseph Cibere, Rolf Bremensdorfer, Pete Lembesis, Michael Yang
  • Publication number: 20230230887
    Abstract: A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors.
    Type: Application
    Filed: March 17, 2023
    Publication date: July 20, 2023
    Inventors: Michael Storek, Rolf Bremensdorfer, Markus Lieberer, Michael Yang
  • Patent number: 11610079
    Abstract: There is provided computer implemented method for detecting and reducing or removing bias for generating a machine learning model, comprising: prior to generating the machine learning model: receiving a training dataset, comprising target inputs, each comprising parameters and labelled with a corresponding target output, wherein at least one of the parameters of at least of the target inputs comprises a sensitive parameter indicative of the corresponding target input assigned to a sensitive group that is potentially biased against other target inputs that are excluded from the sensitive group, analyzing the training dataset to identify target inputs affected by label bias when a statistically significant difference is detected between target inputs assigned to the sensitive group and target inputs excluded from the sensitive group, correcting labels of the target inputs affected by label bias, and generating the machine learning model using the corrected labels.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: March 21, 2023
    Assignee: salesforce.com, inc.
    Inventor: Michael Yang
  • Patent number: 11610824
    Abstract: A thermal processing system for performing thermal processing can include a workpiece support plate configured to support a workpiece and heat source(s) configured to heat the workpiece. The thermal processing system can include window(s) having transparent region(s) that are transparent to electromagnetic radiation within a measurement wavelength range and opaque region(s) that are opaque to electromagnetic radiation within a portion of the measurement wavelength range. A temperature measurement system can include a plurality of infrared emitters configured to emit infrared radiation and a plurality of infrared sensors configured to measure infrared radiation within the measurement wavelength range where the transparent region(s) are at least partially within a field of view the infrared sensors.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: March 21, 2023
    Assignees: BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY CO., LTD, MATTSON TECHNOLOGY, INC.
    Inventors: Michael Storek, Rolf Bremensdorfer, Markus Lieberer, Michael Yang
  • Publication number: 20230055997
    Abstract: A processor assembly including: an exposure station operable to expose a sample on a slide; a print station operable to apply a reagent to the exposed sample through a thermal inkjet process; and a robotic transfer mechanism to transfer the slide from the exposure station to the print station. Also, a reagent cartridge including: a body defining a container having a volume therein; a nonmetallic bag in the container operable to contain a reagent; and a printhead at a base of the body, the printhead coupled to an outlet of the bag. Further, a method including exposing a sample on a slide in a processor assembly; robotically transferring the slide to a printing station of the processor assembly; and applying a reagent to the exposed sample at the printing station by a thermal inkjet printing process.
    Type: Application
    Filed: December 31, 2020
    Publication date: February 23, 2023
    Applicant: Sakura Finetek U.S.A., Inc.
    Inventors: Amit D. SHAH, Scott WEBSTER, Cristina R. FLORES, Chen Yu CHENG, Chia Hsien LIN, Chih Shun CHUANG, Nicholas John BOOKER, Andrew Douglas WATKINS, Rebecca Jean BARTEL, Chester John HENDERSON, Erico VON BUEREN, Michael YANG
  • Publication number: 20230041905
    Abstract: A processing system for processing a plurality of workpieces includes a transfer chamber in process flow communication with a first processing chamber and a second processing chamber, the transfer chamber having a first straight side, wherein the first process chamber includes at least one first processing station, and wherein the first processing chamber is disposed along the first straight side, wherein the second process chamber includes at least two second processing stations, wherein the second processing chamber is disposed along the first straight side, and wherein the second process chamber disposed in linear arrangement with the first process chamber along the first straight side, and wherein the transfer chamber includes at least one workpiece handling robot configured to transfer at least one workpiece to the at least one first processing station and the at least two second processing stations.
    Type: Application
    Filed: October 19, 2022
    Publication date: February 9, 2023
    Inventor: Michael Yang
  • Publication number: 20230031492
    Abstract: A processor assembly including a core module operable to expose a sample on a slide; a staining module operable to apply a stain to the exposed sample; and a robotic transfer mechanism to transfer the slide from the core module to the staining module. Also, an apparatus including a rectangular body having an open rear end and an opposite front end; a flange having a first side and a second side, wherein the first side of the flange is coupled to the front end of the body; and a pair of legs extending from second side of the flange, wherein the pair of legs are operable to engage opposite side edges of a slide.
    Type: Application
    Filed: December 31, 2020
    Publication date: February 2, 2023
    Applicant: Sakura Finetek U.S.A., Inc.
    Inventors: Amit D. Shah, Scott WEBSTER, Nicholas John BOOKER, Andrew WATKINS, Chester HENDERSON, Rebecca J. BARTEL, Erico VON BUEREN, Michael YANG