Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.

Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.

Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.

Abstract: Embodiments herein describe a sub-micron 3D diffractive optics element and a method for forming the sub-micron 3D diffractive optics element. In a first embodiment, a method is provided for forming a sub-micron 3D diffractive optics element on a film stack disposed on a substrate without planarization. The method includes forming a hardmask on a top surface of a film stack. Forming a mask material on a portion of the top surface and a portion of the hardmask. Etching the top surface. Trimming the mask. Etching the top surface again. Trimming the mask a second time. Etching the top surface yet again and then stripping the mask material.

Abstract: Embodiments herein describe a sub-micron 3D diffractive optics element and a method for forming the sub-micron 3D diffractive optics element. In a first embodiment, a method is provided for forming a sub-micron 3D diffractive optics element on a substrate without planarization. The method includes depositing a material stack to be patterned on a substrate, depositing and patterning a thick mask material on a portion of the material stack, etching the material stack down one level, trimming a side portion of the thick mask material, etching the material stack down one more level, repeating trim and etch steps above ‘n’ times, and stripping the thick mask material from the material stack.

Abstract: Embodiments of the present disclosure generally relate to an optically transparent substrate, comprising a major surface having a peripheral edge region with an orientation feature formed therein, and a texture formed on the peripheral edge region, the texture having an opacity that is greater than an opacity of the major surface.

Abstract: Embodiments described herein relate to methods of fabricating waveguide structures with gratings having front angles less than about 45° and back angles less than about 45°. The methods include imprinting stamps into nanoimprint resists disposed on substrates. The nanoimprint resists are subjected to a cure process. The stamps are released from the nanoimprint resist at a release angle ? using a release method. The nanoimprint resists are subjected to an anneal process to form a waveguide structure comprising a plurality of gratings with a front angle ? and a back angle ? relative to a second plane of the surface of the substrate less than about 45°.

Abstract: Embodiments described herein relate to methods for fabricating waveguide structures utilizing substrates. The waveguide structures are formed having input coupling regions, waveguide regions, and output coupling regions formed from substrates. The regions are formed by imprinting stamps into resists disposed on hard masks formed on surfaces of the substrates to form positive waveguide patterns. Portions of the positive waveguide patterns and the hard masks formed under the portions are removed. The substrates are masked and etched to form gratings in the input coupling regions and the output coupling regions. Residual portions of the positive waveguide patterns and the hard masks disposed under the residual portions are removed to form waveguide structures having input coupling regions, waveguide regions, and output coupling regions formed from substrates.

Abstract: Embodiments of the present disclosure generally relate to an optically transparent substrate, comprising a major surface having a peripheral edge region with an orientation feature formed therein, and a texture formed on the peripheral edge region, the texture having an opacity that is greater than an opacity of the major surface.

Abstract: Embodiments described herein relate to methods of fabricating waveguide structures with gratings having front angles less than about 45° and back angles less than about 45°. The methods include imprinting stamps into nanoimprint resists disposed on substrates. The nanoimprint resists are subjected to a cure process. The stamps are released from the nanoimprint resist at a release angle ? using a release method. The nanoimprint resists are subjected to an anneal process to form a waveguide structure comprising a plurality of gratings with a front angle ? and a back angle ? relative to a second plane of the surface of the substrate less than about 45°.

Abstract: Embodiments herein describe a sub-micron 3D diffractive optics element and a method for forming the sub-micron 3D diffractive optics element. In a first embodiment, a method is provided for forming a sub-micron 3D diffractive optics element on a substrate without planarization. The method includes depositing a material stack to be patterned on a substrate, depositing and patterning a thick mask material on a portion of the material stack, etching the material stack down one level, trimming a side portion of the thick mask material, etching the material stack down one more level, repeating trim and etch steps above ‘n’ times, and stripping the thick mask material from the material stack.

Abstract: Embodiments described herein relate to apparatus and methods for display structure fabrication. In one embodiment, a waveguide structure having an input grating structure and an output grating structure is fabricated and a spacer material is deposited on the waveguide. The spacer material is etched from various portions of the waveguide structure and a high refractive index material is deposited on the waveguide. Portions of the spacer material remaining on the waveguide structure are removed leaving the high refractive index material disposed on desired surfaces of the waveguide structure.

Abstract: Embodiments described herein relate to apparatus and methods for display structure fabrication. In one embodiment, a waveguide structure having an input grating structure and an output grating structure is fabricated and a spacer material is deposited on the waveguide. The spacer material is etched from various portions of the waveguide structure and a high refractive index material is deposited on the waveguide. Portions of the spacer material remaining on the waveguide structure are removed leaving the high refractive index material disposed on desired surfaces of the waveguide structure.

Abstract: Embodiments described herein relate to a waveguide imaging structure. The waveguide imaging structure generally includes an input coupling region, a waveguide region, and an output coupling region. In certain embodiments, a photochromic material layer is disposed on an output coupling region of the imaging structure. Also described herein are methods and materials for forming the photochromic material layer.

Abstract: A method of fabricating electrochemical devices may comprise: providing a layer of dielectric material on a metal electrode; enhancing light absorption in the layer of dielectric material within the visible and near UV range, forming a layer of enhanced dielectric material; and laser ablating substantially all of the enhanced dielectric material in select areas of the layer using a laser with a wavelength in the visible and near UV range, wherein the laser ablating leaves the metal electrode substantially intact. In some embodiments, the layer may be provided engineered for higher laser light absorption within the visible and near ultraviolet range, without the need for enhancing. An electrochemical device may comprise: a substrate; a stack of active device layers formed on the substrate; and an encapsulation layer covering the stack, engineered to strongly absorb laser light within the visible and near ultraviolet range.

Abstract: A thin film device. The thin film device may include: an active device region; a thin film encapsulant disposed adjacent to the active device region and encapsulating at least a portion of the active device region. The thin film encapsulant may include an outer layer, wherein the outer layer is disposed adjacent ambient and comprises a hydrophobic layer.

Abstract: A thin film device may include an active device region, where the active device region comprises a selective expansion region. The thin film device may further include a polymer layer disposed adjacent to the active device region and encapsulating the active device region, the polymer layer comprising a plurality of polymer sub-layers. A first polymer sub-layer of the plurality of polymer sub-layers may have a first hardness, while a second polymer sub-layer of the plurality of polymer sub-layers has a second hardness, the second hardness being different from the first hardness.

Abstract: Approaches herein provide encapsulation of a micro battery cell of a cell matrix. The micro battery cell includes an active device, such as a thin film device, formed atop a first side of a substrate. An encapsulant may be formed over the active device, wherein the encapsulant adheres to the active device and to a second side of the substrate. In some approaches, the encapsulant penetrates a plurality of openings provided through the substrate, thus allowing the encapsulant to form along the second side of the substrate to fully envelope the micro battery cell.

Abstract: A thin film device, comprising: an active device region, the active device region having reversible motion at least along a first direction between a first device state and a second device state; and a thin film encapsulant disposed adjacent the selective expansion region, wherein the thin film encapsulant comprises a first thickness in the first device state and a second thickness in the second device state, the first thickness being greater than the second thickness by 10% or greater, wherein the thin film encapsulant comprises a laser-etchable material.

Abstract: Approaches herein provide improved encapsulation of an energy storage device. In one approach, a thin film storage device stack is formed atop a first side of a substrate, and an encapsulant is formed over the thin film storage device stack. A recess formed in the substrate adjacent the thin film storage device stack provides an anchoring point for the encapsulant. In some approaches, the recess is provided partially through a depth of the substrate, and has a geometry to promote physical coupling between the encapsulant and the substrate.