Abstract: A method in a computer system for preparing for a clinical event is provided. In a preferred embodiment, the method includes the steps of identifying a preference card associated with the clinical event, the preference card including a list of predefined clinical item values, accessing at least one patient-specific demographic value; determining whether at least one of the predefined clinical item values is incompatible with at least one patient-specific demographic value, and updating the preference card if at least one of the predefined clinical item values is incompatible with at least one patient-specific demographic value.

Abstract: A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer.

Abstract: An optoelectronic structure can include a liquid crystal polymer layer and an optoelectronic device adjacent to a first surface of the liquid crystal polymer layer. The liquid crystal polymer layer can include the first surface and a second surface opposite the first surface. In an embodiment, the liquid crystal polymer layer can further include a liquid crystal polymer at least partially exposed to a gas at the second surface. In another embodiment, the liquid crystal polymer may be a thermotropic liquid crystal polymer. In still another embodiment, the polymer layer can include an additive to reduce migration of a gas through the polymer layer. Methods of forming such optoelectronic structures can include melt-processing techniques.

Abstract: A magnetic flow meter includes a first spud end, a second spud end, and a sensing area positioned between the first spud end and the second spud end. The sensing area has a wall thickness that is thinner than a thickness of the first spud end and the second spud end. The flow meter can be manufactured via molding while a plug is positioned in at least two holes of the magnetic flow meter. The flow meter can also be manufactured to have a near hermetic seal formed by inserting a flexible printed circuit board in a slit of a gasket and then either compressing a register cup surrounding the tube gasket or driving a pin into a center pin around which the tube gasket is positioned.

Abstract: A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer.

Abstract: A magnetic flow meter includes a first spud end, a second spud end, and a sensing area positioned between the first spud end and the second spud end. The sensing area has a wall thickness that is thinner than a thickness of the first spud end and the second spud end. The flow meter can be manufactured via molding while a plug is positioned in at least two holes of the magnetic flow meter.

Abstract: A package for microelectronic circuits includes a frame made of a high molecular weight plastic material, such as a liquid crystal polymer (LCP), attached to a flange, or leadframe. The plastic material is injection molded to the flange. Initial polymerization of the plastic material can occur in a liquid state and results in an intermediate material having an initial melting temperature. After the frame is injection molded, the frame is heated and undergoes further (secondary) polymerization, thereby lengthening polymer chains in the plastic material. These longer polymer chains have higher molecular weight, and the resulting final material has a higher melting temperature, than the intermediate material. The resulting ultra-high molecular weight polymer can withstand high temperatures, such as those encountered during soldering. Thus, after the further (secondary) polymerization, a die can be soldered to the flange, without damaging the plastic frame.

Abstract: A reseller program may be used to increase the number of Customer desired domain names that are registered by a Registrar. There are two main embodiments of this reseller program. In the first embodiment, Resellers guide Customers to a Registrar web site through the use of advertisements, links in various web sites and/or links from search engines. The Registrar web site communicates directly with the Customer and registers the Customer desired domain names and compensates the Reseller for guiding the Customer to the Registrar web site. In the second embodiment, Resellers have their own reseller web sites that communicate directly with the Customers and communicate the desired domain names to the Registrar web site so the Registrar web site can register the Customer desired domain names. In this embodiment, the Customer may compensate the Reseller and the Reseller may compensate the Registrar for the services rendered.

Abstract: A package for microelectronic circuits includes a frame made of a high molecular weight plastic material, such as a liquid crystal polymer (LCP), attached to a flange, or leadframe. The plastic material is injection molded to the flange. Initial polymerization of the plastic material can occur in a liquid state and results in an intermediate material having an initial melting temperature. After the frame is injection molded, the frame is heated and undergoes further (secondary) polymerization, thereby lengthening polymer chains in the plastic material. These longer polymer chains have higher molecular weight, and the resulting final material has a higher melting temperature, than the intermediate material. The resulting ultra-high molecular weight polymer can withstand high temperatures, such as those encountered during soldering. Thus, after the further (secondary) polymerization, a die can be soldered to the flange, without damaging the plastic frame.

Abstract: A circuit package for housing semiconductor or other integrated circuit devices (“die”) includes a high-copper flange, one or more high-copper leads and a liquid crystal polymer frame molded to the flange and the leads. The flange includes a dovetail-shaped groove or other frame retention feature that mechanically interlocks with the molded frame. During molding, a portion of the frame forms a key that freezes in or around the frame retention feature. The leads include one or more lead retention features to mechanically interlock with the frame. During molding, a portion of the frame freezes in or adjacent these lead retention features. The frame includes compounds to prevent moisture infiltration and match its coefficient of thermal expansion (CTE) to the CTE of the leads and flange. The is frame is formulated to withstand die-attach temperatures. A lid is ultrasonically welded to the frame after a die is attached to the flange.

Abstract: A circuit package for housing semiconductor or other integrated circuit devices (“die”) includes a high-copper flange, one or more high-copper leads and a liquid crystal polymer frame molded to the flange and the leads. The flange includes a dovetail-shaped groove or other frame retention feature that mechanically interlocks with the molded frame. During molding, a portion of the frame forms a key that freezes in or around the frame retention feature. The leads include one or more lead retention features to mechanically interlock with the frame. During molding, a portion of the frame freezes in or adjacent these lead retention features. The frame includes compounds to prevent moisture infiltration and match its coefficient of thermal expansion (CTE) to the CTE of the leads and flange. The is frame is formulated to withstand die-attach temperatures. A lid is ultrasonically welded to the frame after a die is attached to the flange.

Abstract: The present invention is based on a regulation circuit for making available a constant current supply on the basis of a transformer principle, in which there flows through the luminescent diodes (D1, . . . , DN) a triangular a.c. current varying periodically around a DC current value. Both a charging and a discharging current of inductive reactance connected in series to the luminescent diodes (D 1, . . . , DN), functioning as a storage choke for filtering of mains harmonics, flows as diode current through the luminescent diodes (D 1, . . . , DN). According to one exemplary embodiment of the invention the ceramic circuit board of the LED illumination module in accordance with the invention has a direct mains current supply, which for protection from mechanical damage is accommodated in a transparent housing having a highly transparent polymer mass serving as optically active lens surface.

Abstract: A brush includes a first tuft holder having at least one tuft, a second tuft holder having at least one tuft, a support structure having a handle to grasp and use the brush, an adjustment mechanism for adjusting the brush between (1) a first condition where the first and second tuft holders are not movable with respect to each other; and, (2) a second condition where the first tuft holder is movable with respect to the second tuft holder, and wherein the first and second tuft holders remain attached to the support structure in the first and second conditions.

Abstract: A user interface for a mobile device allows users to interact across applications with information relevant to known people, organizations, or locations, referred to herein as “recognized entities.” Every type of recognized entity has associated action options that populate a node menu for that type. The node menu options are selectable, for example, through a touchscreen interface, to rapidly execute the associated action. In another embodiment, a plurality of data windows, referred to as “spinners,” are viewed simultaneously on one display. Each spinner is a view of one or more data objects provided that are distinguished from one another by data type, context, parsing or sorting algorithms, or user interaction with this data. The spinners respond to user actions, to new information from the server, or external events by automatically visibly scrolling the data displayed in the spinner windows.

Abstract: A microcircuit package having a ductile layer between a copper flange and die attach. The ductile layer absorbs the stress between the flange and semiconductor device mounted on the flange, and can substantially reduce the stress applied to the semiconductor device. In addition, the package provides the combination of copper flange and polymeric dielectric with a TCE close to copper, which results in a low stress structure of improved reliability and conductivity.

Abstract: A user interface for a mobile device allows users to interact across applications with information relevant to known people, organizations, or locations, referred to herein as “recognized entities.” Every type of recognized entity has associated action options that populate a node menu for that type. The node menu options are selectable, for example, through a touchscreen interface, to rapidly execute the associated action. In another embodiment, a plurality of data windows, referred to as “spinners,” are viewed simultaneously on one display. Each spinner is a view of one or more data objects provided that are distinguished from one another by data type, context, parsing or sorting algorithms, or user interaction with this data. The spinners respond to user actions, to new information from the server, or external events by automatically visibly scrolling the data displayed in the spinner windows.

Abstract: A reseller program may be used to increase the number of Customer desired domain names that are registered by a Registrar. There are two main embodiments of this reseller program. In the first embodiment, Resellers guide Customers to a Registrar web site through the use of advertisements, links in various web sites and/or links from search engines. The Registrar web site communicates directly with the Customer and registers the Customer desired domain names and compensates the Reseller for guiding the Customer to the Registrar web site. In the second embodiment, Resellers have their own reseller web sites that communicate directly with the Customers and communicate the desired domain names to the Registrar web site so the Registrar web site can register the Customer desired domain names. In this embodiment, the Customer may compensate the Reseller and the Reseller may compensate the Registrar for the services rendered.

Abstract: The present invention relates to thiophene and furan compounds and their pharmaceutically acceptable salts, and further relates to their use in treating schizophrenia, cognitive deficits associated with schizophrenia, Alzheimer's disease, dementia of the Alzheimer's type, mild cognitive impairment, or depression.

Abstract: A package for microelectronic circuits includes a frame made of a high molecular weight plastic material, such as a liquid crystal polymer (LCP), attached to a flange, or leadframe. The plastic material is injection molded to the flange. Initial polymerization of the plastic material can occur in a liquid state and results in an intermediate material having an initial melting temperature. After the frame is injection molded, the frame is heated and undergoes further (secondary) polymerization, thereby lengthening polymer chains in the plastic material. These longer polymer chains have higher molecular weight, and the resulting final material has a higher melting temperature, than the intermediate material. The resulting ultra-high molecular weight polymer can withstand high temperatures, such as those encountered during soldering. Thus, after the further (secondary) polymerization, a die can be soldered to the flange, without damaging the plastic frame.

Abstract: The present invention relates to pyrrole and pyrazole compounds of formula (I) and their pharmaceutically acceptable salts, and further relates to their use in treating schizophrenia, cognitive deficits associated with schizophrenia, Alzheimer's disease, dementia of the Alzheimer's type, mild cognitive impairment, or depression. The compounds act as potentiators on glutamate receptors, in particular AMPA and the GluR family.