Abstract: In an embodiment an optoelectronic device includes a lead frame with a first metallic region and at least one second metallic region spaced therefrom, wherein the first metallic region and the at least one second metallic region form a first cavity on a first side of the lead frame, at least one electrical component, which is arranged in the first cavity and molded with a mold compound, and which electrically connects the first metallic region and the at least one second metallic region to one another, and at least one optoelectronic component, wherein the second side is formed by a first outer side of the lead frame and the first side is formed by a side lying within the lead frame, and wherein the first cavity is formed by a cavity, which extends from the first side of the lead frame in a direction of a second outer side of the lead frame opposite the first outer side.

Abstract: In an embodiment an optoelectronic semiconductor device includes a carrier comprising a mounting side and an attachment side opposite the mounting side, a plurality of separate, metallic lead frame parts and a potting body mechanically holding together the lead frame parts, and a plurality of optoelectronic semiconductor chips mounted on the mounting side, wherein the lead frame parts project beyond the potting body at the mounting side, wherein at least some of the lead frame parts have a double-layered design so that the lead frame parts together form a support layer on the attachment side and a mounting layer on the mounting side, wherein the support layer is embedded in the potting body and the mounting layer extends at least partially onto the potting body.

Abstract: The invention relates to a lead frame assembly comprising a plurality of regularly arranged lead frames, each of which is suitable for electrically contacting components, comprises at least two lead frame elements distanced laterally by a recess and which are provided as electrical connections of different polarity, and has at least one anchoring element, which is suitable for anchoring a housing body of the component, the lead frame elements being thinned, flat regions of the lead frame, and the at least one anchoring element protrudes from a plane of the lead frame elements in the form of a pillar, and a plurality of connection elements, which in each case connects two lead frame elements of adjacent lead frames to one another, the two connected lead frame elements being provided as terminals of different polarity.

Abstract: In an embodiment an arrangement includes an optoelectronic component having a radiation passage surface and a housing top surface, which surrounds the radiation passage surface in lateral directions at least in places and a cover covering the radiation passage surface and the housing top surface at least in places, wherein the cover is configured to be partially removed such that the radiation passage surface is at least partially exposed and the housing top surface remains covered at least in places by a remainder of the cover.

Abstract: In an embodiment a carrier includes a shaped body, a lead frame, a first electrode and a second electrode, wherein the first electrode includes a first subregion of the lead frame, a second subregion of the lead frame, and an electrical connection connecting the first subregion to the second subregion, wherein the first subregion is laterally spaced from the second subregion by an intermediate region, wherein the lead frame has at least one subsection, which is located at least in places in the intermediate region and thus in a lateral direction between the first subregion and the second subregion of the first electrode, wherein the intermediate region is at least partially filled by the shaped body or directly adjoins the shaped body, the electrical connection being embedded in the shaped body, and wherein the subsection of the lead frame is neither a subregion of the first electrode nor a subregion of the second electrode.

Abstract: In an embodiment a method for manufacturing a plurality of light emitting devices includes arranging, fixing and wiring several semiconductor elements on a substrate, optional fastening of the substrate via an adhesive layer on an auxiliary carrier, introducing a filler into spaces between the semiconductor elements, inserting the substrate with the semiconductor elements attached thereto and the filler into a cavity of a molding tool, generating a vacuum in the cavity of the mold, introducing a matrix material into the filler, curing of the matrix material, molding the substrate with the light-emitting devices and separating the devices.

Abstract: Aspects relate to an optoelectronic semiconductor component comprising a semiconductor body having an optically active region designed to emit or detect electromagnetic radiation, a support, a molded body, and a prefabricated optical shielding with a support structure and a diaphragm. The semiconductor body and the molded body are arranged on the front face of the support. The molded body at least partly surrounds the semiconductor body in a lateral direction, and the optical shielding is arranged on the molded body face facing away from the support and projects beyond the molded body in the lateral direction in the direction of the semiconductor body. The diaphragm has an opening which is oriented towards the optically active region. Additionally, an insulating structure is arranged adjacently to the semiconductor body, the insulating structure at least partly surrounding the semiconductor body. Aspects also relate to a method for producing the optoelectronic semiconductor component.

Abstract: In an embodiment an optoelectronic semiconductor device includes an optoelectronic semiconductor chip configured to generate radiation and attached to a mounting side of a carrier and an encapsulation body at least partially transparent to the radiation, wherein the carrier is composed of a plurality of separate, metallic lead frame parts and of a potting body, the potting body holding the lead frame parts together, wherein the lead frame parts project beyond the potting body at the mounting side, wherein an attachment side of the carrier is opposite the mounting side so that the mounting side is further away from the attachment side than sides of the potting body facing away from the attachment side, wherein, as seen in a plan view of the attachment side, the potting body projects over the lead frame parts on all sides.

Abstract: In one embodiment, the optoelectronic semiconductor device comprises at least two metallic lead frame parts and a circuit chip on the lead frame parts. An electrically insulating and opaque matrix material mechanically connects the lead frame parts. The circuit chip is embedded in the matrix material, so that a carrier is formed by the matrix material together with the lead frame parts and the circuit chip. An optoelectronic semiconductor chip is provided on a carrier upper side. Furthermore, the semiconductor device comprises at least one optical component on the carrier upper side.

Abstract: A method for removing a protective film from a semiconductor component includes providing the semiconductor component having the protective film on a component upper side. The protective film protrudes beyond the component upper side at a longitudinal side. The method also includes separating the protective film from the component upper side with a removal tool which has a removal opening. The separating of the protective film from the component upper side includes guiding the removal tool next to the semiconductor component along the longitudinal side in a direction transverse to the component upper side while it bears on the protective film so that the protective film is bent by the removal tool in a direction toward a side face of the semiconductor component, and retracting the removal tool so that the protective film catches in the removal opening and the protective film is detached from the component upper side.

Abstract: In an embodiment a pixel for a multi-pixel LED module includes a first light-emitting semiconductor chip having a first upper chip side and a first lead-frame section having a first upper side, a first contacting protrusion and a second contacting protrusion, wherein the first contacting protrusion and the second contacting protrusion extend from the first upper side, and wherein the first light-emitting semiconductor chip is embedded in an electrically insulating material such that the first upper side is covered by the electrically insulating material and the first upper chip side and the contacting protrusions are exposed.

Abstract: An optoelectronic semiconductor component includes at least one optoelectronic semiconductor chip, a plurality of lead frame parts, a casting body that mechanically connects the lead frame parts to one another so that a mounting carrier is formed on which the at least one optoelectronic semiconductor chip is mounted, and a plurality of metallizations, wherein the lead frame parts are each formed in one piece and comprise at least one through-plating region and at least one mounting region, the through-plating regions each penetrate the mounting carrier and the mounting regions project beyond the casting body, and the metallizations each start from at least one of the through-plating regions and extend directly onto the casting body laterally next to the at least one associated through-plating region.

Abstract: In at least one embodiment, the optoelectronic component comprises an optoelectronic semiconductor chip with an emission side and a rear side opposite the emission side. Furthermore, the component comprises a housing body with a top side and an underside opposite the top side, and a metal layer on the top side of the housing body. During proper operation, the semiconductor chip emits primary electromagnetic radiation via the emission side. The semiconductor chip is embedded in the housing body and laterally surrounded by the housing body. The emission side is on the rear side and the top side is downstream of the underside along a main emission direction of the semiconductor chip. The metal layer is at least partially reflecting or absorbing radiation generated by the optoelectronic component.

Abstract: In one embodiment, an optoelectronic semiconductor device includes at least two lead frame parts and an optoelectronic semiconductor chip which is mounted in a mounting region on one of the lead frame parts. The lead frame parts are mechanically connected to one another via a casting body. The semiconductor chip is embedded in the cast body. In the mounting region the respective lead frame part has a reduced thickness. An electrical line is led over the cast body from the semiconductor chip to a connection region of the other of the lead frame parts. In the connection region, the respective lead frame part has the full thickness. From the connection region to the semiconductor chip the electrical line does not overcome any significant difference in height.

Abstract: A carrier and a component are disclosed. In an embodiment a component includes a semiconductor chip including a substrate and a semiconductor body arranged thereon and a metallic carrier having a coefficient of thermal expansion which is at least 1.5 times greater than a coefficient of thermal expansion of the substrate or of the semiconductor chip, wherein the semiconductor chip is attached to a mounting surface of the metallic carrier by a connection layer such that the connection layer is located between the semiconductor chip and a buffer layer and adjoins a rear side of the semiconductor chip, wherein the buffer layer has a yield stress which is at least 10 MPa and at most 300 MPa, and wherein the substrate of the semiconductor chip and the metallic carrier of the component have a higher yield stress than the buffer layer.

Abstract: The invention relates to a lead frame assembly comprising a plurality of regularly arranged lead frames, each of which is suitable for electrically contacting components, comprises at least two lead frame elements distanced laterally by a recess and which are provided as electrical connections of different polarity, and has at least one anchoring element, which is suitable for anchoring a housing body of the component, the lead frame elements being thinned, flat regions of the lead frame, and the at least one anchoring element protrudes from a plane of the lead frame elements in the form of a pillar, and a plurality of connection elements, which in each case connects two lead frame elements of adjacent lead frames to one another, the two connected lead frame elements being provided as terminals of different polarity.

Abstract: In one embodiment, the optoelectronic semiconductor device comprises at least two metallic lead frame parts and a circuit chip on the lead frame parts. An electrically insulating and opaque matrix material mechanically connects the lead frame parts. The circuit chip is embedded in the matrix material, so that a carrier is formed by the matrix material together with the lead frame parts and the circuit chip. An optoelectronic semiconductor chip is provided on a carrier upper side. Furthermore, the semiconductor device comprises at least one optical component on the carrier upper side.

Abstract: In an embodiment a pixel for a multi-pixel LED module includes a first light-emitting semiconductor chip having a first upper chip side and a first lead-frame section having a first upper side, a first contacting protrusion and a second contacting protrusion, wherein the first contacting protrusion and the second contacting protrusion extend from the first upper side, and wherein the first light-emitting semiconductor chip is embedded in an electrically insulating material such that the first upper side is covered by the electrically insulating material and the first upper chip side and the contacting protrusions are exposed.

Abstract: A method of producing a surface-mountable multi-chip component includes providing a chip arrangement including a metallic conductor structure exposed at a rear side, a plurality of semiconductor chips and an housing material; and forming a solder stop coating on a rear side of the chip arrangement, wherein the solder stop coating separates connection regions of the conductor structure.

Abstract: In one embodiment, an optoelectronic semiconductor device includes at least two lead frame parts and an optoelectronic semiconductor chip which is mounted in a mounting region on one of the lead frame parts. The lead frame parts are mechanically connected to one another via a casting body. The semiconductor chip is embedded in the cast body. In the mounting region the respective lead frame part has a reduced thickness. An electrical line is led over the cast body from the semiconductor chip to a connection region of the other of the lead frame parts. In the connection region, the respective lead frame part has the full thickness. From the connection region to the semiconductor chip the electrical line does not overcome any significant difference in height.