Patents by Inventor Michael Zitzlsperger
Michael Zitzlsperger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8692275Abstract: An optoelectronic component includes a housing. At least one semiconductor chip is arranged in the housing. The semiconductor chip includes an active layer suitable for producing or detecting electromagnetic radiation. A casting compound at least partially surrounds the semiconductor chip. Reflective particles are embedded in the casting compound.Type: GrantFiled: May 4, 2011Date of Patent: April 8, 2014Assignee: OSRAM Opto Semiconductors GmbHInventors: Harald Jaeger, Michael Zitzlsperger, Albert Schneider
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Patent number: 8668365Abstract: An optoelectronic device includes at least one luminescence diode chip which emits electromagnetic radiation during operation of the optoelectronic device, and at least one shield against stray radiation which laterally surrounds the luminescence diode chip only in places, wherein each shield is integral with a component of the optoelectronic device.Type: GrantFiled: September 1, 2009Date of Patent: March 11, 2014Assignee: OSRAM Opto Semiconductors GmbHInventors: Peter Brick, Sven Weber-Rabsilber, Michael Zitzlsperger
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Patent number: 8629549Abstract: A carrier body for a semiconductor component, in particular for an optoelectronic semiconductor component, is specified. Said carrier body has a connecting layer and a conductor layer, which are connected to one another via main areas facing one another. The connecting layer, the conductor layer or both the connecting layer and the conductor layer has/have at least one thinned region in which the layer thickness of said layer(s) is less than the maximum layer thickness of said layer(s). The connecting layer is either completely electrically conductive and electrically insulated at least from parts of the conductor layer or it is electrically insulating at least in parts. Furthermore, a semiconductor component comprising the electrical connection conductor and also a method for producing the carrier body are specified.Type: GrantFiled: October 22, 2009Date of Patent: January 14, 2014Assignee: OSRAM Opto Semiconductors GmbHInventors: Michael Zitzlsperger, Stefanie Marion Muetzel
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Publication number: 20130240935Abstract: A method of producing a surface-mountable semiconductor component including providing an auxiliary carrier made with a plastics material; applying at least one insert and at least one optoelectronic component to a mounting surface of the auxiliary carrier; enclosing, the optoelectronic component and the insert in a common molding, wherein the molding covers the optoelectronic component and the insert form-fittingly at least in places the optoelectronic component and the insert are not in direct contact with one another, and the optoelectronic component and the insert are connected together mechanically by the molding; removing the auxiliary earner; and producing individual surface-mountable semiconductor components by severing the molding.Type: ApplicationFiled: June 27, 2011Publication date: September 19, 2013Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Harald Jäger, Michael Zitzlsperger, Markus Pindl
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Publication number: 20130200405Abstract: An optoelectronic semiconductor component includes a substrate that has an upper side and an under side lying opposite the upper side. The substrate is formed with an electrically conductive mounting region, an electrically conductive connection region and an electrically isolating oxidation region. An optoelectronic part is arranged on the upper side of the substrate in the region of the mounting region. The oxidation region electrically isolates the mounting region from the connection region. The oxidation region extends, without interruption, from the upper side of the substrate to the underside of the substrate. The mounting region and the connection region are formed with aluminum and the oxidation region is formed with an oxide of the aluminum. The mounting region, the oxidation region and the connection region being are designed contiguously to form an entity.Type: ApplicationFiled: August 18, 2011Publication date: August 8, 2013Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Michael Zitzlsperger, Johann Ramchen
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Patent number: 8502252Abstract: An optoelectronic component (1) is provided, having at least two connecters (2) for electrical contacting of the component (1), a housing body (3), in which the connecters (2) are embedded in places, a heat sink (4), which is connected to at least one connecter (2), wherein the housing body (3) is formed of a plastics material, the housing body (3) comprises an opening (30), in which the heat sink (4) is freely accessible in places, at least one optoelectronic semiconductor chip (5) is arranged in the opening (30) on the heat sink (4), and at least two of the connecters (2) each comprise a chip-end portion (2c), which faces the at least one optoelectronic semiconductor chip (5), wherein the chip-end portions (2c) of the at least two connecters (2) are arranged in a common plane.Type: GrantFiled: August 20, 2009Date of Patent: August 6, 2013Assignee: OSRAM Opto Semiconductor GmbHInventors: Stefan Groetsch, Thomas Zeiler, Michael Zitzlsperger, Harald Jaeger
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Patent number: 8482025Abstract: An optoelectronic semi-conductor component includes a first carrier having a top side and an underside laying opposite the top side of the first carrier, wherein the first carrier has a first and a second region; at least one optoelectronic semiconductor chip arranged at the top side on the first carrier; and at least one electronic component arranged in the second region at the underside of the first carrier, wherein the first region has a greater thickness in a vertical direction than the second region, wherein, at the underside, the first region projects beyond the second region in a vertical direction, and the at least one electronic component is electrically conductively connected to the at least one optoelectronic semi-conductor chip.Type: GrantFiled: May 5, 2010Date of Patent: July 9, 2013Assignee: OSRAM Opto Semiconductors GmbHInventors: Stephan Preuβ, Michael Zitzlsperger
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Publication number: 20130126935Abstract: A surface-mountable optoelectronic component has a radiation passage face, an optoelectronic semiconductor chip and a chip carrier. A cavity is formed in the chip carrier and the semiconductor chip is arranged in the cavity. A molding surrounds the chip carrier at least in places. The chip carrier extends completely through the molding in a vertical direction perpendicular to the radiation passage face.Type: ApplicationFiled: May 25, 2011Publication date: May 23, 2013Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Michael Zitzlsperger, Harald Jaeger
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Publication number: 20130092966Abstract: An optoelectronic component includes a housing. At least one semiconductor chip is arranged in the housing. The semiconductor chip includes an active layer suitable for producing or detecting electromagnetic radiation. A casting compound at least partially surrounds the semiconductor chip. Reflective particles are embedded in the casting compound.Type: ApplicationFiled: May 4, 2011Publication date: April 18, 2013Applicant: OSRAM Opto Semiconductors GmbHInventors: Harald Jaeger, Michael Zitzlsperger, Albert Schneider
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Publication number: 20120299041Abstract: An optoelectronic semiconductor component includes a radiation emitting semiconductor chip having a radiation coupling out area. Electromagnetic radiation generated in the semiconductor chip leaves the semiconductor chip via the radiation coupling out area. A converter element is disposed downstream of the semiconductor chip at its radiation coupling out area. The converter element is configured to convert electromagnetic radiation emitted by the semiconductor chip. The converter element has a first surface facing away from the radiation coupling out area. A reflective encapsulation encapsulates the semiconductor chip and portions of the converter element at side areas in a form-fitting manner. The first surface of the converter element is free of the reflective encapsulation.Type: ApplicationFiled: November 17, 2010Publication date: November 29, 2012Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Gertrud Kräuter, Bernd Barchmann, Krister Bergenek, Michael Zitzlsperger, Johann Ramchen
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Publication number: 20120139003Abstract: An optoelectronic component including a connection carrier including an electrically insulating film at a top side of the connection carrier, an optoelectronic semiconductor chip at the top side of the connection carrier, a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and a potting body surrounding the optoelectronic semiconductor chip, wherein a bottom area of the cutout is formed at least regionally by the electrically insulating film, the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip, and the cutout is at least regionally free of the potting body.Type: ApplicationFiled: May 28, 2010Publication date: June 7, 2012Applicants: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG, OSRAM OPTO SEMICONDUCTORS GMBHInventors: Michael Zitzlsperger, Eckhard Ditzel, Jörg Erich Sorg
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Publication number: 20120126279Abstract: An optoelectronic semi-conductor component includes a first carrier having a top side and an underside laying opposite the top side of the first carrier, wherein the first carrier has a first and a second region; at least one optoelectronic semiconductor chip arranged at the top side on the first carrier; and at least one electronic component arranged in the second region at the underside of the first carrier, wherein the first region has a greater thickness in a vertical direction than the second region, wherein, at the underside, the first region projects beyond the second region in a vertical direction, and the at least one electronic component is electrically conductively connected to the at least one optoelectronic semi-conductor chip.Type: ApplicationFiled: May 5, 2010Publication date: May 24, 2012Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Stephan Preuss, Michael Zitzlsperger
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Publication number: 20120119250Abstract: An optoelectronic semiconductor component (100) is specified, with a support (1) which has a mounting surface (11) and at least one penetration (3), where the penetration (3) extends from the mounting surface (11) to a bottom surface (12) of the support (1) that lies opposite the mounting surface (11); at least one optoelectronic semiconductor chip (2), which is mounted on the mounting surface (11); a radiation-transparent casting body (5), which surrounds the at least one optoelectronic semiconductor chip (2) at least in places, where the casting body (5) is arranged at least in places in the penetration (3) of the support (1).Type: ApplicationFiled: December 23, 2009Publication date: May 17, 2012Applicant: OSRAM OPTO SEMICONDUCTORS GmbHInventor: Michael Zitzlsperger
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Publication number: 20120111628Abstract: An electronic device includes a base body, which has a top side and also an underside lying opposite the top side. The base body has connection locations at its underside. An electronic component is arranged at the base body at the top side of the base body. The base body has at least one side area having at least one point of inspection having a first region and second region. The second region is embodied as an indentation in the first region. The first and the second region contain different materials.Type: ApplicationFiled: June 22, 2010Publication date: May 10, 2012Inventors: Michael Zitzlsperger, Stefan Groetsch
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Publication number: 20120112337Abstract: An optoelectronic component (1) is provided, having at least two connecters (2) for electrical contacting of the component (1), a housing body (3), in which the connecters (2) are embedded in places, a heat sink (4), which is connected to at least one connecter (2), wherein the housing body (3) is formed of a plastics material, the housing body (3) comprises an opening (30), in which the heat sink (4) is freely accessible in places, at least one optoelectronic semiconductor chip (5) is arranged in the opening (30) on the heat sink (4), and at least two of the connecters (2) each comprise a chip-end portion (2c), which faces the at least one optoelectronic semiconductor chip (5), wherein the chip-end portions (2c) of the at least two connecters (2) are arranged in a common plane.Type: ApplicationFiled: August 20, 2009Publication date: May 10, 2012Applicant: OSRAM Opto Semiconductors GmbHInventors: Stefan Groetsch, Thomas Zeiler, Michael Zitzlsperger, Harald Jaeger
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Publication number: 20120098110Abstract: A carrier body for a semiconductor component, in particular for an optoelectronic semiconductor component, is specified. Said carrier body has a connecting layer and a conductor layer, which are connected to one another via main areas facing one another. The connecting layer, the conductor layer or both the connecting layer and the conductor layer has/have at least one thinned region in which the layer thickness of said layer(s) is less than the maximum layer thickness of said layer(s). The connecting layer is either completely electrically conductive and electrically insulated at least from parts of the conductor layer or it is electrically insulating at least in parts. Furthermore, a semiconductor component comprising the electrical connection conductor and also a method for producing the carrier body are specified.Type: ApplicationFiled: October 22, 2009Publication date: April 26, 2012Applicant: OSRAM OPTO SEMICONDCTORS GMBHInventors: Michael Zitzlsperger, Stefanie Muetzel
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Publication number: 20120037929Abstract: An optoelectronic component has an optoelectronic semiconductor chip, a contact frame, a contact carrier, a first electrical connection zone and a second electrical connection zone electrically insulated from the first electrical connection zone, which each have a part of the contact frame and a part of the contact carrier, wherein the contact frame has a recess which separates the first electrical connection zone at least in places from the second electrical connection zone and into which the optoelectronic semiconductor chip projects, and wherein the contact frame has a contact element which connects the contact frame electrically with the optoelectronic semiconductor chip.Type: ApplicationFiled: March 5, 2010Publication date: February 16, 2012Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Johann Ramchen, Michael Zitzlsperger
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Publication number: 20110303945Abstract: A semiconductor arrangement including at least one lead arrangement with a top and a bottom opposite the top; a least one solder resist layer which partially covers the top and the bottom, at least sub-zones of the top and the bottom, which are not covered by the solder resist layer, forming electrical base members; an optoelectronic semiconductor element, which is mounted on at least one of the base members on the top of the lead arrangement and is connected electrically conductively therewith, and an encapsulant applied at least to the top of the lead arrangement, the encapsulant covering up the semiconductor element and lying at least partially against the solder resist layer, wherein the base members are bordered all round by the solder resist layer.Type: ApplicationFiled: January 29, 2010Publication date: December 15, 2011Applicant: OSRAM Opto Semiconductors GmbHInventors: Michael Zitzlsperger, Matthias Sperl
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Publication number: 20110266559Abstract: The application relates to a semiconductor component, a photo-reflective sensor, and also a method for producing a housing for a photo-reflective sensor, wherein the housing lower part is monolithic and has at least two cavities into which an emitter and a detector are introduced.Type: ApplicationFiled: April 17, 2009Publication date: November 3, 2011Applicant: OSRAM Opto Semiconductors GmbHInventors: Michael Zitzlsperger, Thomas Zeiler
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Publication number: 20110182075Abstract: An optoelectronic device includes at least one luminescence diode chip which emits electromagnetic radiation during operation of the optoelectronic device, and at least one shield against stray radiation which laterally surrounds the luminescence diode chip only in places, wherein each shield is integral with a component of the optoelectronic device.Type: ApplicationFiled: September 1, 2009Publication date: July 28, 2011Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Peter Brick, Sven Weber-Rabsilber, Michael Zitzlsperger