Abstract: The invention relates to an arrangement comprising at least one optoelectronic semiconductor component (101), said arrangement comprising a carrier element arrangement (108) suitable for carrying the at least one optoelectronic semiconductor component. The arrangement comprises a housing body (103) consisting of a light-absorbent plastic material, which is arranged on the carrier element arrangement. The housing body comprises a raised area (104) and a set-back area (105) between which an inclined flank (115) is formed. The set-back area extends up to the optoelectronic semiconductor component, in order to reduce reflections.

Abstract: An optoelectronic component including a connection carrier comprising a structured carrier strip in which interspaces are filled with an electrically insulating material and an optoelectronic semiconductor chip attached and electrically connected to a top portion of the connection carrier, wherein the electrically insulating material terminates substantially flush with the carrier strip in places or the carrier strip projects beyond the electrically insulating material, and the carrier strip is not covered by the electrically insulating material on the top portion and/or on a bottom portion of the connection carrier.