Abstract: A nitride semiconductor substrate having properties preferable for the manufacture of various nitride semiconductor devices is made available, by specifying or controlling the local variation in the off-axis angle of the principal surface of the nitride semiconductor substrate. In a nitride semiconductor single-crystal wafer having a flat principal surface, the crystallographic plane orientation of the principal surface of the nitride semiconductor single-crystal wafer varies locally within a predetermined angular range.

Abstract: A nitride semiconductor substrate having properties preferable for the manufacture of various nitride semiconductor devices is made available, by specifying or controlling the local variation in the off-axis angle of the principal surface of the nitride semiconductor substrate. In a nitride semiconductor single-crystal wafer having a flat principal surface, the crystallographic plane orientation of the principal surface of the nitride semiconductor single-crystal wafer varies locally within a predetermined angular range.

Abstract: The invention provides porous silicon nitride ceramics that having uniform, fine closed pores and a manufacturing method thereof. Metal Si powder is mixed with a sintering additive, followed by thermal treatment, which is a pre-process for forming a specific grain boundary phase. Two-stage thermal treatment is thereafter performed by microwave heating at a temperature of 1000° C. or more. The metal Si powder is thereafter subjected to a nitriding reaction from its surface, the metal Si is thereafter diffused to nitride formed on the outer shell thereof such that porous silicon nitride ceramics having uniform, fine closed pores can be produced. Having a high ratio of closed pores and being superior in electrical/mechanical characteristics, the porous silicon nitride ceramics can display excellent characteristics if used, for example, for an electronic circuit board that requires an anti-hygroscopicity, a low dielectric constant, a low dielectric loss, and mechanical strength.

Abstract: Powder of a metal serving as a precursor for ceramics (1) and a sintering additive are mixed with each other and heat-treated by microwave heating thereby nitriding or oxidizing the metallic powder from the surface thereof and diffusing the metal with a nitride or an oxide formed on the shell of the metal for obtaining porous ceramics (1) having homogeneous and fine closed pores (1a). The porous ceramics (1) according to the present invention, having the closed pores (1a) homogeneously diffusing at a high ratio, exhibits excellent characteristics when applied to an electronic circuit board or the like requiring moisture absorption resistance, low permittivity and low dielectric loss as well as mechanical strength.

Abstract: Powder of a metal serving as a precursor for ceramics (1) and a sintering additive are mixed with each other and heat-treated by microwave heating thereby nitriding or oxidizing the metallic powder from the surface thereof and diffusing the metal with a nitride or an oxide formed on the shell of the metal for obtaining porous ceramics (1) having homogeneous and fine closed pores (1a). The porous ceramics (1) according to the present invention, having the closed pores (1a) homogeneously diffusing at a high ratio, exhibits excellent characteristics when applied to an electronic circuit board or the like requiring moisture absorption resistance, low permittivity and low dielectric loss as well as mechanical strength.

Abstract: The invention provides porous silicon nitride ceramics that have uniform, fine closed pores and a manufacturing method thereof. Metal Si powder is mixed with a sintering additive, followed by thermal treatment, which is a pre-process for forming a specific grain boundary phase. Two-stage thermal treatment is thereafter performed by microwave heating at a temperature of 1000° C. or more. The metal Si powder is thereafter subjected to a nitriding reaction from its surface, the metal Si is thereafter diffused to nitride formed on the outer shell of the metal Si, and thereby porous silicon nitride ceramics that have uniform, fine closed pores can be obtained.

Abstract: An Si3N4 sintered body produced by reactive sintering of silicon, wherein a compound of at least one element selected from the group consisting of Y, Yb and Sm is contained by 0.6 to 13% by weight as Ln2O3 (wherein Ln=Y, Yb or Sm), an oxygen content in Si3N4 crystal grains is not more than 1% by weight, a ratio of Si and Ln in the Si3N4 sintered body is within a range of 0.1 to 0.8 in a molar ratio of SiO2/Ln2O3 of the Si in terms of SiO2 to the oxide Ln2O3, and the sintered body has a relative density of 85 to 99.9%, a thermal conductivity of at least 70 W/m.K or more and a three-point bending strength of at least 600 MPa. The Si3N4 sintered body is produced by mixing 80 to 99% by weight of silicon powder and 1 to 20% by weight of powder of oxide of at least one element of Y, Yb and SM, by nitriding a molded body of the powder mixture in an atmosphere containing nitrogen at 1400° C.

Abstract: A Si3N4 composite substrate which manifests no generation of cracking on the substrate even by mechanical shock or thermal shock, and is excellent in heat radiation property and heat-cycle-resistance property is obtained by using a Si3N4 substrate as a ceramic substrate. A Si3N4 substrate having a thermal conductivity of 90 W/m·K or more and a three-point flexural strength of 700 MPa or more is used, and the thickness tm of a metal layer connected on one major surface of the substrate and the thickness tc of the Si3N4 substrate are controlled so as to satisfy the relation formula: 2 tm≦tc≦20 tm. When metal layers are connected to both major surfaces of the Si3N4 substrate, the thickness tc and the total thickness ttm of the metal layers on both major surfaces are controlled so as to satisfy the relation formula: ttm≦tc≦10 ttm.

Abstract: The invention provides a slurry composition suitable for the manufacture of Si3N4 sintered bodies, wherein the dispersion properties and oxidation resistance of Si powder in water are improved, resulting in the homogenous dispersion of a sintering aid powder and a fine Si powder with less oxygen. Si powder, a sintering aid, water in an amount of 50 to 90 wt % relative to the total weight of the composition, and a surface coating agent in an amount of 0.05 to 10 wt % relative to the Si powder are added, the pH is adjusted to between 3 and 8, and the ingredients are milled and mixed. Trivalent metal ions such as Fe or Ga, or a polysiloxane with a BHL of no more than 10 is used as the surface coating agent. The resulting slurry composition can be used to prepare Si3N4 sintered bodies with better electrical, thermal, and mechanical properties.

Abstract: An Si3N4 sintered body produced by reactive sintering of silicon, wherein a compound of at least one element selected from the group consisting of Y, Yb and Sm is contained by 0.6 to 13% by weight as Ln2O3 (wherein Ln=Y, Yb or Sm), an oxygen content in Si3N4 crystal grains is not more than 1% by weight, a ratio of Si and Ln in the Si3N4 sintered body is within a range of 0.1 to 0.8 in a molar ratio of SiO2/Ln2O3 of the Si in terms of SiO2 to the oxide Ln2O3, and the sintered body has a relative density of 85 to 99.9%, a thermal conductivity of at least 70 W/m.K or more and a three-point bending strength of at least 600 MPa. The Si3N4 sintered body is produced by mixing 80 to 99% by weight of silicon powder and 1 to 20% by weight of powder of oxide of at least one element of Y, Yb and SM, by nitriding a molded body of the powder mixture in an atmosphere containing nitrogen at 1400° C.

Abstract: A high thermal conductive silicon nitride base sintered body which comprises a phase comprising crystal grains of silicon nitride and a grain boundary phase containing a compound of at least one element selected from the group consisting of yttrium and the lanthanide elements in an amount of 1 to 20% by weight in terms of oxide amount, and contains free silicon dispersed therein in an amount of 0.01 to 10% by weight based on the whole. This high thermal conductive silicon nitride base sintered body has high strength coupled with high thermal conductivity and thus is useful not only as various parts for semiconductor devices, such as radiating insulating substrates, but as various structural parts for machines, OA apparatuses, etc.

Abstract: A silicon nitride sintered body prepared through a nitriding reaction of Si, consists of crystal grains mainly composed of silicon nitride and/or SIALON and a grain boundary phase. The grain boundary phase includes a first component including at least one element selected from a group of Na, K, Mg, Ca and Sr and a second component including at least one element selected from a group of Y and lanthanoid series elements. The molar ratio of the first component to the second component is in the range of 1:1 to 6:1 in terms of oxides. The mean breadth and the mean length of the crystal grains are not more than 0.1 .mu.m and not more than 3 .mu.m respectively, and the standard deviation of the mean length in the sintered body is within 1.5 .mu.m. Especially, the mean breadth of the crystal grains is at least 0.4 .mu.m and not more than 0.9 .mu.m.