Patents by Inventor Michio Kaida

Michio Kaida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11977100
    Abstract: An inspection jig includes contact terminals and a pitch conversion unit electrically connected to the contact terminals and configured to convert a first pitch between adjacent two of the contact terminals into a second pitch different from the first pitch. The contact terminals each include a tubular body that extends in an axial direction of the contact terminal and is electrically conductive, and a conductor that is electrically conductive and has a stick shape. The tubular body includes a spring portion that has a helical shape along a peripheral surface of the tubular body. The conductor includes an uninserted portion that protrudes from the tubular body toward a first side in the axial direction, and an inserted portion that is disposed in the tubular body and is fixed to a first axial end portion of the tubular body. The pitch conversion unit includes a board portion and a protruding portion.
    Type: Grant
    Filed: February 20, 2020
    Date of Patent: May 7, 2024
    Assignee: NIDEC READ CORPORATION
    Inventor: Michio Kaida
  • Publication number: 20220357362
    Abstract: An inspection jig includes: film-shaped wiring substrates each having one surface provided with an electrode; a pedestal that supports the wiring substrates which are laminated such that electrode regions are exposed, the electrode region being a region where the electrode is provided in each of the wiring substrates; and a plurality of probes which have base end portions in contact with the electrode regions and extend in a direction away from the electrode regions.
    Type: Application
    Filed: August 8, 2020
    Publication date: November 10, 2022
    Inventor: Michio KAIDA
  • Publication number: 20220155346
    Abstract: In a contact terminal, the first insertion portion includes a first contact portion having a first flat surface along an axial direction, the second insertion portion includes a second contact portion having a second flat surface along the axial direction, the first flat surface and the second flat surface are in contact with each other, the tubular body includes at least one of a first end side notch provided along the axial direction on a peripheral surface of the one end portion in the axial direction of the tubular body and a second end side notch provided along the axial direction on a peripheral surface of the other end portion in the axial direction of the tubular body.
    Type: Application
    Filed: March 12, 2020
    Publication date: May 19, 2022
    Inventors: Michio KAIDA, Norihiro OTA, Yusuke YOKOTA
  • Publication number: 20220137094
    Abstract: An inspection jig includes contact terminals and a pitch conversion unit electrically connected to the contact terminals and configured to convert a first pitch between adjacent two of the contact terminals into a second pitch different from the first pitch. The contact terminals each include a tubular body that extends in an axial direction of the contact terminal and is electrically conductive, and a conductor that is electrically conductive and has a stick shape. The tubular body includes a spring portion that has a helical shape along a peripheral surface of the tubular body. The conductor includes an uninserted portion that protrudes from the tubular body toward a first side in the axial direction, and an inserted portion that is disposed in the tubular body and is fixed to a first axial end portion of the tubular body. The pitch conversion unit includes a board portion and a protruding portion.
    Type: Application
    Filed: February 20, 2020
    Publication date: May 5, 2022
    Inventor: Michio KAIDA
  • Publication number: 20220026481
    Abstract: A probe includes a tubular body having conductivity and a tubular shape, and a first central conductor having conductivity and a stick shape. The tubular body has a cross section perpendicular to an axial direction, the cross section having a shape that is rectangular or hexagonal, and the first central conductor includes a first insertion portion having a cross section perpendicular to an axial direction of the first central conductor, the cross section having a shape that is same as the shape of the cross section of the tubular body, the first insertion portion being inserted into one end portion side of the tubular body, and a first projecting portion projecting from one end portion of the tubular body.
    Type: Application
    Filed: December 19, 2019
    Publication date: January 27, 2022
    Inventors: Norihiro OTA, Michio KAIDA
  • Patent number: 10962569
    Abstract: Provided are a probe that enables control of a bending direction and can be simply manufactured, an inspection jig using the probe, an inspection device, and a method of manufacturing the probe. A probe has a substantially bar-like shape extending linearly and includes: a tip end portion, a body portion continuous with the tip end portion Pa; and a base end portion continuous with the body portion. The body portion includes a first connection region having a thickness in a thickness direction perpendicular to an axial direction of the bar-like shape that gradually decreases away from the tip end portion, and a second connection region having a thickness that gradually decreases away from the base end portion. A dimension of the body portion in a width direction perpendicular to the thickness direction is larger than dimensions of the tip end portion and the base end portion.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: March 30, 2021
    Assignees: Nidec-Read Corporation, SV Probe Technology Taiwan Co., Ltd.
    Inventors: Michio Kaida, Huei Che Yu
  • Publication number: 20190353684
    Abstract: Provided are a probe that enables control of a bending direction and can be simply manufactured, an inspection jig using the probe, an inspection device, and a method of manufacturing the probe. A probe has a substantially bar-like shape extending linearly and includes: a tip end portion, a body portion continuous with the tip end portion Pa; and a base end portion continuous with the body portion. The body portion includes a first connection region having a thickness in a thickness direction perpendicular to an axial direction of the bar-like shape that gradually decreases away from the tip end portion, and a second connection region having a thickness that gradually decreases away from the base end portion. A dimension of the body portion in a width direction perpendicular to the thickness direction is larger than dimensions of the tip end portion and the base end portion.
    Type: Application
    Filed: May 16, 2019
    Publication date: November 21, 2019
    Applicants: Nidec-Read Corporation, SV Probe Technology Taiwan Co., Ltd.
    Inventors: Michio KAIDA, Huei Che Yu
  • Patent number: 9910084
    Abstract: A flexible circuit board inspecting apparatus for conducting an inspection on a flexible circuit board includes a transport path and an inspection part mechanism. The transport path is configured to successively transport the flexible circuit board having a plurality of unit circuit boards arranged thereon. The inspection part mechanism is configured to bring and distance a jig for inspecting the flexible circuit board transported on the transport path close to and from the flexible circuit board. The transport path includes a longitudinal transport portion for transporting the flexible circuit board in a downward vertical direction. The inspection part mechanism moves the jig in a direction perpendicular to the flexible circuit board transported on the longitudinal transport portion to bring and distance the jig close to and from the flexible circuit board.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: March 6, 2018
    Assignee: NIDEC-READ CORPORATION
    Inventors: Takashi Nakagawa, Toshihide Matsukawa, Osamu Hikita, Michio Kaida
  • Publication number: 20160163576
    Abstract: A substrate inspection system includes a plurality of processing units, and each processing unit is provided with a transport mechanism configured to transport an substrate to be inspected along a transport passage which extends substantially horizontally, a lift mechanism configured to lift the substrate to be inspected to a height position, at a set position on the transport passage, and processors each configured to perform a predetermined process on the substrate to be inspected positioned at the height position. The processing units are arranged such that transport passages thereof are aligned and such that the transport directions thereof are the same direction. Between two adjacent transport passages, the substrate to be inspected is delivered from the transport passage on an upstream side to the transport passage on a downstream side.
    Type: Application
    Filed: February 11, 2016
    Publication date: June 9, 2016
    Inventors: Takashi Nakagawa, Toshihide Matsukawa, Osamu Hikita, Akira Ogata, Michio Kaida
  • Publication number: 20150310161
    Abstract: Provided is a method of designing a circuit board inspecting jig having a contact to be brought into conductive contact with a test point on a circuit board to be inspected. The method includes: preparing temporary design data by temporarily designing the circuit board inspecting jig based on design data for the circuit board to be inspected (a first designing process); acquiring an expansion and contraction ratio of the circuit board based on a condition upon manufacturing the circuit board (and an environmental condition upon inspecting the circuit board) (an expansion and contraction ratio acquiring process); and obtaining design data for the circuit board inspecting jig to be actually manufactured by scaling the temporary design data up and down by the expansion and contraction ratio (a second designing process).
    Type: Application
    Filed: April 22, 2015
    Publication date: October 29, 2015
    Inventors: Michio KAIDA, Toshihide MATSUKAWA, Makoto FUJINO, Osamu HIKITA
  • Publication number: 20150268298
    Abstract: A flexible circuit board inspecting apparatus for conducting an inspection on a flexible circuit board includes a transport path and an inspection part mechanism. The transport path is configured to successively transport the flexible circuit board having a plurality of unit circuit boards arranged thereon. The inspection part mechanism is configured to bring and distance a jig for inspecting the flexible circuit board transported on the transport path close to and from the flexible circuit board. The transport path includes a longitudinal transport portion for transporting the flexible circuit board in a downward vertical direction. The inspection part mechanism moves the jig in a direction perpendicular to the flexible circuit board transported on the longitudinal transport portion to bring and distance the jig close to and from the flexible circuit board.
    Type: Application
    Filed: March 19, 2015
    Publication date: September 24, 2015
    Inventors: Takashi NAKAGAWA, Toshihide MATSUKAWA, Osamu HIKITA, Michio KAIDA
  • Publication number: 20150086303
    Abstract: A substrate inspection system includes a plurality of processing units, and each processing unit is provided with a transport mechanism configured to transport an substrate to be inspected along a transport passage which extends substantially horizontally, a lift mechanism configured to lift the substrate to be inspected to a height position, at a set position on the transport passage, and processors each configured to perform a predetermined process on the substrate to be inspected positioned at the height position. The processing units are arranged such that transport passages thereof are aligned and such that the transport directions thereof are the same direction. Between two adjacent transport passages, the substrate to be inspected is delivered from the transport passage on an upstream side to the transport passage on a downstream side.
    Type: Application
    Filed: September 16, 2014
    Publication date: March 26, 2015
    Inventors: Takashi Nakagawa, Toshihide Matsukawa, Osamu Hikita, Akira Ogata, Michio Kaida
  • Patent number: 6462556
    Abstract: A probe is made to contact one end of the test wiring of a circuit board 32, with a head 52 electrostatically coupled to the other end of said wiring. A pulse-like DC voltage is supplied from a signal source 46, and, simultaneously with a switch section SWp turning on, the maximum voltage is applied to the test wiring. If a detection signal is below a specified value, then a computer 44 will read it as “open” or “shorting”. Further, a tip 52a of the head 52 is associated with the circuit board 32 only through an insulating sheet 33, so that the tip 52a is kept away from each pad of a pad section 38 on the board at a fixed distance (equivalent to the thickness of insulating sheet 33). Thus, continuity testing may be performed in a non-contact manner by moving head 52 only in X and Y directions without movement in the Z-direction.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: October 8, 2002
    Assignee: Nidec-Read Corporation
    Inventors: Munehiro Yamashita, Michio Kaida
  • Publication number: 20010013783
    Abstract: A probe is made to contact one end of the test wiring of a circuit board 32, with a head 52 electrostatically coupled to the other end of said wiring. A pulse-like DC voltage is supplied from a signal source 46, and, simultaneously with a switch section SWp turning on, the maximum voltage is applied to the test wiring. If a detection signal is below a specified value, then a computer 44 will read it as “open” or “shorting”. Further, a tip 52a of the head 52 is associated with the circuit board 32 only through an insulating sheet 33, so that the tip 52a is kept away from each pad of a pad section 38 on the board at a fixed distance (equivalent to the thickness of insulating sheet 33). Thus, continuity testing may be performed in a non-contact manner by moving head 52 only in X and Y directions without movement in the Z-direction.
    Type: Application
    Filed: March 30, 2001
    Publication date: August 16, 2001
    Inventors: Munehiro Yamashita, Michio Kaida
  • Patent number: D894025
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: August 25, 2020
    Assignees: NIDEC-READ CORPORATION, SV PROBE TECHNOLOGY TAIWAN CO., LTD.
    Inventors: Michio Kaida, Huei Che Yu