Abstract: There is described an image forming system, which makes it possible to speedily implement the reprinting operation, and to alleviate the burden of the printer controller. The system includes a printer controller to parse a print job described in a Page Description Language so as to generate image data; and an image forming apparatus, configured separately from the printer controller, to implement a printing operation based on the image data. The printer controller applies a first processing to the print job so as to generate multi-value image data and transmits the multi-value image data to the image forming apparatus. The image forming apparatus applies a second processing to the multi-value image data, received from the printer controller, so as to generate processed image data, serving as printable image data based on which a reproduced image can be directly printed, and implements the printing operation based on the processed image data.

Abstract: There is described an image forming apparatus, which makes it possible to form a lining cover sheet image at an appropriate position of the lining cover sheet, irrespective of change of the lining cover sheet width. The apparatus includes a lining cover-sheet width acquiring section to acquire a lining cover-sheet width; a cover-sheet image data acquiring section to acquire various cover-sheet image data sets; a cover-sheet image data arranging section to arrange the front cover-sheet image data and the rear cover-sheet image data in such a manner that they are arranged at an interval of the lining cover-sheet width, and to arrange the lining cover-sheet image data in such a manner that a lining image center line coincides with a cover sheet center line, in its width direction; and an image forming section to form the total cover sheet image, based on the arranged image data.

Abstract: There is described an image forming system, which makes it possible to speedily implement the reprinting operation, and to alleviate the burden of the printer controller. The system includes a printer controller to parse a print job described in a Page Description Language so as to generate image data; and an image forming apparatus, configured separately from the printer controller, to implement a printing operation based on the image data. The printer controller applies a first processing to the print job so as to generate multi-value image data and transmits the multi-value image data to the image forming apparatus. The image forming apparatus applies a second processing to the multi-value image data, received from the printer controller, so as to generate processed image data, serving as printable image data based on which a reproduced image can be directly printed, and implements the printing operation based on the processed image data.

Abstract: Disclosed herein is an information processing apparatus including a controller for instructing printing of a spine for case binding based on data of a certain page in a data file including data of a plurality of pages.

Abstract: There is described an image forming apparatus, which makes it possible to form a lining cover sheet image at an appropriate position of the lining cover sheet, irrespective of change of the lining cover sheet width. The apparatus includes a lining cover-sheet width acquiring section to acquire a lining cover-sheet width; a cover-sheet image data acquiring section to acquire various cover-sheet image data sets; a cover-sheet image data arranging section to arrange the front cover-sheet image data and the rear cover-sheet image data in such a manner that they are arranged at an interval of the lining cover-sheet width, and to arrange the lining cover-sheet image data in such a manner that a lining image center line coincides with a cover sheet center line, in its width direction; and an image forming section to form the total cover sheet image, based on the arranged image data.

Abstract: Disclosed is a user interface to carry out a book printing in which one sheet is associated with a plurality of pages of a book, wherein the user interface is capable of setting different print modes for the sheets constituting the book.

Abstract: A space portion is present between the upper surface of a semiconductor chip of a semiconductor chip mounted substrate fitted into a cavity (concave portion for setting) of a lower mold section and the top surface of a cavity of an upper mold section. The upper and lower mold sections are closed while a resin member having a thickness larger than the height of the space portion is inserted in the space portion. At this time, clamping force between the upper and lower mold sections is applied to the semiconductor chip through the resin member. The resin member is deformed in response to the shape of the space portion. Underfill is molded between the semiconductor chip and the substrate while the resin member adheres to both of the upper surface of the semiconductor chip and the top surface of the cavity of the upper mold section.

Abstract: A die used for molding an electronic component with resin includes a fixed, top die and a movable, bottom die and at least has a surface contacting a melted resin material that is electroplated with nickel-tungsten alloy. This plating can provide releaseability of a resin-molded body and the like superior to hard-chromium plating to allow an ejector pin to efficiently eject and release the resin-molded body from the die.

Abstract: A cutting blade is fixed on a shaft that rotates about its shaft center, and that is linearly advanced by an advancing movement. The shaft's center further revolves with a small radius of revolution at a rapid predetermined rate of revolution greater than the rate of advancing movement. Thus the blade is pressed against and cuts a substrate and produces chips, and the blade is intermittently disengaged from the substrate whereby the chips move in the direction in which the blade rotates to be removed from between the cutting edge of the blade and the substrate. This reduces working resistance, enhances working efficiency, and prevents the blade surface from having significant frictional heat. Furthermore, the generated frictional heat can readily dissipate and the blade can thus have a long life.

Abstract: A polishing apparatus includes a polishing pad rotated by a surface plate rotating shaft about a surface plate axis, a slurry conduit supplying slurry to an upper surface of the polishing pad, a substrate holding mechanism holding a substrate, a substrate rotating shaft rotating the substrate holding mechanism about a substrate axis, and a rotating mechanism rotating the substrate axis or the surface plate axis about an eccentric axis. The angular velocity of rotation about the eccentric axis is set larger than the angular velocity of rotation about the substrate axis or the surface plate axis. Thus, the effective contact area between a small area on the substrate and the polishing pad is increased, biased wear of abrasive grains on the polishing pad is prevented, clogging of the polishing pad is suppressed, and new abrasive grains and new chemicals can be supplied with high efficiency to each area of the substrate. Thus, the polishing rate is improved.

Abstract: A space portion is present between the upper surface of a semiconductor chip of a semiconductor chip mounted substrate fitted into a cavity (concave portion for setting) of a lower mold section and the top surface of a cavity of an upper mold section. The upper and lower mold sections are closed while a resin member having a thickness larger than the height of the space portion is inserted in the space portion. At this time, clamping force between the upper and lower mold sections is applied to the semiconductor chip through the resin member. The resin member is deformed in response to the shape of the space portion. Underfill is molded between the semiconductor chip and the substrate while the resin member adheres to both of the upper surface of the semiconductor chip and the top surface of the cavity of the upper mold section.

Abstract: A method of processing a leadframe involves steps of transporting a leadframe to load it into a lead processing unit including plural sets of processing presses; adjusting a press pitch of the processing presses according to a work pitch of workpieces on the leadframe by rotating a nut member that is coupled to at least one of the processing presses and engaged on a non-rotating screw shaft extending in the transport direction of the leadframe, so that the nut member moves along the screw shaft and the respective processing press coupled thereto moves with the nut member; and performing a predetermined lead processing on the leadframe using the processing presses after the step of adjusting the press pitch.

Abstract: There are provided a lower sensor and an upper sensor mounted respectively on top and bottom surfaces of a sensor unit, an operation unit calculating respective measurements indicating the degree of adhesion of dirt to respective surfaces of a lower mold and an upper mold based on respective detection signals from the lower sensor and the upper sensor, and a comparator unit comparing each measurement from the operation unit with a predetermined reference value to transmit a predetermined warning signal if the measurement is equal to or smaller than the reference value. The warning signal is thus transmitted if reflected radiation that is radiation reflected from the mold surface has its intensity equal to or smaller than the reference value.

Abstract: There are provided a shaft rotating around the shaft's center in a direction in which a blade rotates, and the blade fixed to the shaft and moving at a rate of movement, wherein the shaft's center rotates at a predetermined rate of rotation with a small radius of rotation rapidly, the rate of rotation being greater than the rate of movement. Thus the blade is pressed against and thus cuts a substrate and produces chips and the blade is disengaged from the substrate and the chips thus move in the direction in which the blade rotates and the chips are thus removed from between the cutting edge of the blade and the substrate. This can provide reduced working resistance and hence enhanced working efficiency and also prevent the blade surface from having significant frictional heat. Furthermore, the generated frictional heat can readily dissipate and the blade can thus have a long life.

Abstract: A resin seal apparatus includes a movable bottom die vertically moved by an elevator mechanism, a transport mechanism horizontally moving the movable bottom die having placed thereon a printed circuit board with a semiconductor chip mounted thereon, an intermediate die abutting against a periphery of the printed circuit board when the movable bottom die is moved upward, a film of resin stretched by a film stretch mechanism over the intermediate die and the printed circuit board, a die for a chip, pressing a back surface of the semiconductor chip via the film of resin, and a top die pressing a top surface of the intermediate die via the film of resin. This apparatus allows a PCB with a semiconductor chip mounted thereon in the form of a flip chip to be sealed with resin in a reduced period of time to fabricate an electronic component.

Abstract: A polishing apparatus includes a polishing pad rotated by a surface place rotating shaft, a slurry conduit supplying slurry to an upper surface of the polishing pad, a substrate holding mechanism holding a substrate, a substrate rotating shaft rotating the substrate holding mechanism about a substrate axis and a rotating mechanism rotating the substrate axis about an eccentric axis. Angular velocity of rotation of the substrate axis about the eccentric axis is set larger than angular velocity of rotation of the substrate holding mechanism about the substrate axis. Thus, contact area between a small area on the substrate and the polishing pad is increased, bias wear of abrasive grains on the polishing pad is prevented, clogging of the polishing pad is suppressed, and new abrasive grains and new chemicals can be supplied with high efficiency to each area of the substrate. Thus, polishing rate is improved.

Abstract: Resin sealed lead frames are processed by modular processing work stations related in number to a plurality of steps used in processing the lead or leads of the resin sealed lead frame. The work stations are separate modules which are detachably interconnected, whereby the number of modules can be exactly correlated to the number of steps actually required for processing the lead or leads of the resin sealed lead frame. As required, modules can be added or omitted. The resin sealed lead frame is sequentially advanced through the modules in steps corresponding to at least two pitches, whereby one pitch is defined as the on-center spacing between two neighboring products on the lead frame. Such feed advance permits performing at least two processing steps simultaneously. Thus, the method for processing the resin sealed lead frame and the apparatus therefore are adaptable to a change in the type of processing and to the production volume.

Abstract: A resin seal apparatus includes a movable bottom die vertically moved by an elevator mechanism, a transport mechanism horizontally moving the movable bottom die having placed thereon a printed circuit board with a semiconductor chip mounted thereon, an intermediate die abutting against a periphery of the printed circuit board when the movable bottom die is moved upward, a film of resin stretched by a film stretch mechanism over the intermediate die and the printed circuit board, a die for a chip, pressing a back surface of the semiconductor chip via the film of resin, and a top die pressing a top surface of the intermediate die via the film of resin. This apparatus allows a PCB with a semiconductor chip mounted thereon in the form of a flip chip to be sealed with resin in a reduced period of time to fabricate an electronic component.

Abstract: Resin sealed lead frames are processed by modular processing work stations related in number to a plurality of steps used in processing the lead or leads of the resin sealed lead frame. The work stations are separate modules which are detachably interconnected, whereby the number of modules can be exactly correlated to the number of steps actually required for processing the lead or leads of the resin sealed lead frame. As required, modules can be added or omitted. The resin sealed lead frame is sequentially advanced through the modules in steps corresponding to at least two pitches, whereby one pitch is defined as the on-center spacing between two neighboring products on the lead frame. Such feed advance permits performing at least two processing steps simultaneously. Thus, the method for processing the resin sealed lead frame and the apparatus therefore are adaptable to a change in the type of processing and to the production volume.

Abstract: A method of sealing an electronic component with molded resin comprises an electronic component setting step of engaging an electronic component mounted on a lead frame in mold cavities which are provided on mold surfaces of a fixed mold section and a movable mold section respectively to be opposed to each other, and a resin sealing step of charging a heated/melted resin material in the mold cavities engaged with the electronic component and sealing the electronic component received in the mold cavities and the lead frame around the same in a resin mold package corresponding to the shapes of the mold cavities. The resin sealing step is carried out by applying a prescribed resin pressure to the resin charged in the mold cavities and thereafter pressing the resin received in the mold cavities against the lead frame from the exterior.