Abstract: In an apparatus for molding resin to seal electronic parts, an internal die space defined at least by pots, cull portions, resin passages and cavities when an upper mold section and a lower mold section are closed, is cut off or sealed from the exterior atmosphere. Thereupon the die space is evacuated using a first evacuation by a vacuum source and a second or instantaneous evacuation by an instantaneous evacuation mechanism. The vacuum source for the first evacuation may be an active vacuum pump, while the instantaneous evacuation mechanism may be a vacuum tank that has been previously pumped down, for example. Using this apparatus, it is possible to quickly improve the degree of vacuum in the internal die space by efficiently and reliably discharging air, moisture and gas from the internal die space to the exterior due to a synergistic action of the evacuation and the instantaneous evacuation. Consequently, the formation of voids in resin molded members is prevented.

Abstract: A resin sealing and molding apparatus for electronic parts includes, a cleaning UV application mechanism for removing mold surface contaminants adhering to or accumulating on the mold surfaces. The UV application mechanism is mounted to be freely reciprocative to a retracted position not inhibiting an operation for supplying unsealed lead frames and resin tablets to each resin molding unit part and an operation for taking out sealed lead frames, and to a deployed or operating position close to the mold surfaces in each resin molding unit. Using this UV application mechanism especially in conjunction with a suction device, the mold surface contaminants, such as a; mold release agent contained in a resin material or volatile gas generated by heating, that adhere to or accumulate on the mold surfaces of each resin molding unit are efficiently and reliably removed.

Abstract: An image forming apparatus having a first mode for image forming at a first recorded pixel density and a second mode for image forming at a second recorded pixel density that is higher than that in the first mode, includes: a selector for selecting either the first mode or the second mode; a fixing unit having a temperature detecting sensor to detect a temperature of the fixing unit; and a controller for changing a temperature condition to be set for the fixing unit in accordance with a change between the first recorded pixel density and the second recorded pixel density selected by the selector.

Abstract: In a method of molding resin to seal electronic parts, an internal die space defined at least by pots, cull portions, resin passages and cavities when an upper mold section and a lower mold section are closed, is cut off or sealed from the exterior atmosphere. Thereupon the die space is evacuated using a first evacuation by a vacuum source and a second or instantaneous evacuation by an instantaneous evacuation mechanism. The vacuum source for the first evacuation may be an active vacuum pump, while the instantaneous evacuation mechanism may be a vacuum tank that has been previously pumped down, for example. According to this method, it is possible to quickly improve the degree of vacuum in the internal die space by efficiently and reliably discharging air, moisture and gas from the internal die space to the exterior due to a synergistic action of the evacuation and the instantaneous evacuation. Consequently, the formation of voids in resin molded members is prevented.

Abstract: In an apparatus for molding resin to seal an electronic part, a sealed space portion is formed between molding surfaces of an upper mold section and a lower mold section by covering an outer side periphery of a pot, a resin path and a cavity. A resin tablet is heated at its bottom portion and peripheral portion in the pot of the lower mold section to expand upwardly from its top portion. Air and moisture included inside the resin tablet is expelled into the sealed space portion which is evacuated including any air and moisture inside the sealed space portion, whereby the formation of voids in the molded resin body is avoided.

Abstract: In a method for molding resin to seal an electronic part, a sealed space portion is formed between molding surfaces of an upper mold section and a lower mold section by covering an outer side periphery of a pot, a resin path and a cavity. A resin tablet is heated at its bottom portion and peripheral portion in the pot of the lower mold section to expand upwardly from its top portion. Air and moisture included inside the resin tablet is expelled into the sealed space portion which is evacuated including any air and moisture inside the sealed space portion, whereby the formation of voids in the molded resin body is avoided.

Abstract: An electronic component is molded into a resin seal by first compressing a resin tablet to increase its density by removing air contained in the tablet. The compressed or molded resin tablet is supplied into a pot (3) wherein the tablet is melted by heat. The melted resin is injected under pressure into cavities (5a, 5b) through a transfer path (9), whereby electronic components (10) set in these cavities (5a, 5b) are seal molded. This method substantially prevents air from being mixed into the melted resin and also avoids the formation of a void within and on the surface of a resin sealed molding of the electronic components (10) encapsulated in the resin.

Abstract: In enlarging dot matrix data stored in an original memory on a work memory, it is discriminated whether or not a data write position overlaps the position of already-produced data. If no overlapping occurs, the data is written as it is in the work memory. If overlapping occurs, it is then discriminated whether or not the color of a dot in the original memory to be processed is the same as that of a dot adjacent to the target dot. If the colors are the same, data is written at positions except the overlapped portion. In other words, data already written at the overlapped position is given a priority. On the other hand, if the dots are of different colors, data at the overlapped portion is temporarily cleared and data is written at positions including the overlapped portion.

Abstract: A tape carrier used for assemblage of integrated circuit chips based on a TAB system, comprises a plurality of square frames, each including a substantially square opening for defining a position of an integrated circuit chip to be bonded to the frame, the square opening being formed within a mold area of the frame on which, when the integrated circuit chip mounted at the square opening and bonded to the frame is resin-molded, the resin-molded integrated circuit chip extends. At least two substantially rectangular first openings are formed within the mold area at a space between the square opening and an outer periphery of the mold area. A plurality of lead groups, extend from an inside of the square opening to positions adjacent to a periphery of the frame by crossing one of the first openings.

Abstract: An IC chip is packaged on a film carrier. The film carrier comprises an insulation film and many conductive leads formed on the insulation film in predetermined patterns. Each of the leads has an inner lead portion to be connected to a terminal of the IC chip, and an outer lead portion to be connected to a conductive pattern of a mounting board. The film carrier further comprises an embankment, which is made of insulation material and formed on and/or in the vicinity of the outer lead portions of the leads to prevent an ooze of resin when the IC chip is sealed with the resin.

Abstract: A lead frame for enclosing a semiconductor chip with resin has a plurality of leads and at least one side frame member for supporting the leads. The lead frame is formed at a required location with a resin adhering portion for effectively removing resin and fins solidified in the air vent of a molding apparatus and formed between the lead frame and the dies of the apparatus.

Abstract: An apparatus of the multiplunger type having a stationary die and a movable die opposed thereto includes stationary and movable cavity blocks and ejector plates removably mounted on stationary and movable die bases, respectively. The lower one of the die bases is removably provided with a plunger holder on which plungers are arranged at an adjustingly variable spacing. The above components on the die bases are easily changeable, while the spacing between the plungers is readily adjustable to the spacing between the pots in the cavity block to be used upon a change. The apparatus is suited to the production of various kinds of semiconductor devices in small quantities.

Abstract: A molding apparatus for enclosing semiconductor chips with resin has a plurality of plungers for applying pressure to a resin material, at least one transfer channel holding each of resin material supplying pots in communication with corresponding one of cavities for transferring the resin material in a molten state, a communication bore formed in the vicinity of the transfer channel in communication therewith, slide members each intimately fitting in the communication bore and slidable forward or backward, pressing-pushing members for pushing each slide member toward the corresponding transfer channel with a uniform pressure, and a pressure sensor operable by the retraction of each slide member for detecting the internal pressure of the transfer channel.

Abstract: An apparatus for cleaning plastics forming mold faces comprising composite brushes each consisting of a vibratory brush adapted to be vibrated in a vertical direction or in unspecified directions by a vibrating mechanism, and a rotary brush annularly surrounding the vibratory brush and adapted to be rotated in a horizontal direction, the composite brushes being disposed in opposed relation to the faces of two mold halves, a dirt sucking mechanism having a vacuum source for sucking and removing flash peeled from the mold faces by the vibratory and rotary brushes, and an air blowing mechanism for blowing air against the mold faces to cool the flash so as to enhance the flash peeling action of the vibratory and rotary brushes.