Abstract: A component for a vacuum deposition apparatus comprises a component body and a spray deposit formed on a surface of a component body. A spray deposit has surface roughness in which a mean spacing S of tops of local peak of profile is in the range from 50 to 150 ?m, and distances to a bottom of profile valley line Rv and to a top of profile peak line are in the ranges from 20 to 70 ?m, respectively. Furthermore, a spray deposit has a low hardness coat selected from an Al base spray deposit of Hv 30 (Vickers hardness) or less, a Cu base spray deposit of Hv 100 or less, a Ni base spray deposit of Hv 200 or less, a Ti base spray deposit of Hv 300 or less, a Mo base spray deposit of Hv 300 or less and a W base spray deposit of Hv 500 or less. Such component for a vacuum deposition apparatus may suppress, with stability and effectiveness, peeling of deposition material adhering on a component during deposition. In addition, the number of apparatus cleaning and of exchange of components may be largely reduced.

Abstract: An endoscope apparatus comprises an endoscope having a treatment tool passage channel in at least an insertion portion, an adaptor for endoscope forceps opening, which can be detachably attached to a treatment tool insertion opening which is at one end of the treatment tool passage channel, an insertion shape detection probe provided with a plurality of shape detection elements which are to be passed and arranged in the treatment tool passage channel via the adaptor for endoscope forceps opening, an insertion shape detection unit for detecting magnetic field emitted from the shape detection elements of the insertion shape detection probe, an insertion shape detection device which drives the insertion shape detection probe and outputs video signals for visualizing the insertion shape from the signals corresponding to the magnetic field detected by the insertion shape detection unit, and a display device for displaying the insertion shape of the insertion portion based on the video signals output from the inser

Abstract: When a user accesses an IC card system, the user intentionally registers processing or actions necessary for an IC card to an IC card management system, or the system determines a predetermined state to register the processing to the IC card management system. The IC card management system beforehand delivers the actions to an IC card terminal. Thereafter, when the user inserts the IC card of which the necessary actions have been registered to the IC card management system to the IC card terminal, the IC card terminal executes the actions corresponding to the IC card.

Abstract: An endoscope apparatus comprises an endoscope having a treatment tool passage channel in at least an insertion portion, an adaptor for endoscope forceps opening, which can be detachably attached to a treatment tool insertion opening which is at one end of the treatment tool passage channel, an insertion shape detection probe provided with a plurality of shape detection elements which are to be passed and arranged in the treatment tool passage channel via the adaptor for endoscope forceps opening, an insertion shape detection unit for detecting magnetic field emitted from the shape detection elements of the insertion shape detection probe, an insertion shape detection device which drives the insertion shape detection probe and outputs video signals for visualizing the insertion shape from the signals corresponding to the magnetic field detected by the insertion shape detection unit, and a display device for displaying the insertion shape of the insertion portion based on the video signals output from the inser

Abstract: A component for a vacuum deposition apparatus comprises a component body and a spray deposit formed on a surface of a component body. A spray deposit has surface roughness in which a mean spacing S of tops of local peak of profile is in the range from 50 to 150 &mgr;m, and distances to a bottom of profile valley line Rv and to a top of profile peak line are in the ranges from 20 to 70 &mgr;m, respectively. Furthermore, a spray deposit has a low hardness coat selected from an Al base spray deposit of Hv 30 (Vickers hardness) or less, a Cu base spray deposit of Hv 100 or less, a Ni base spray deposit of Hv 200 or less, a Ti base spray deposit of Hv 300 or less, a Mo base spray deposit of Hv 300 or less and a W base spray deposit of Hv 500 or less. Such component for a vacuum deposition apparatus may suppress, with stability and effectiveness, peeling of deposition material adhering on a component during deposition.

Abstract: An endoscope includes an insertion section inserted into the body cavity and a probe provided inside the insertion section for detecting the form of the endoscope. The probe includes a plurality of coil portions arranged in the longitudinal direction of the insertion section of the endoscope and a wire electrically connecting the coil portions. The coil portions and the wire are covered with a flexible member. And the outer diameter of the covered wire is smaller than the outer diameter of the covered coil portions.

Abstract: An endoscope capable of improving assembly operativity and facilitating a repair operation is provided. This endoscope has an insertion section having a proximal end portion and a distal end portion, and inserted into a body cavity, an operation section arranged on a proximal end portion side of the insertion section, a universal cord extending from the operation section, and having a distal end portion, and a conduit extended in the insertion section, the operation section and the universal cord. This conduit has one end arranged on the distal end portion of the insertion section and having a first opening portion formed therein and the other end arranged on the connector and having a second opening portion formed therein, and separable on a portion between one end and the other end.

Abstract: The present invention provides a carbon film coated member comprising: a base material; and a coated film formed on at least part of a surface of the base material, the coated film comprising: a matrix composed of amorphous carbon; and at least one of metal and metal carbide contained in the matrix, wherein an atomic ratio (M/C) of the metal (M) to carbon (C) constituting the coated film is 0.01 to 0.7. According to the above structure, there can be provided a carbon film coated member excellent in low-friction property, wear resistance and durability, and capable of suppressing a dust generation, peeling-off and deterioration of the coated film even if the carbon film coated member is used as semiconductor equipment members such as wafer cassette, dummy wafer, probe pin or the like under severe operating conditions, so that the carbon film coated member would not exert a bad influence onto the resultant semiconductor products.

Abstract: An endoscope apparatus comprises an endoscope having a treatment tool passage channel in at least an insertion portion, an adaptor for endoscope forceps opening, which can be detachably attached to a treatment tool insertion opening which is at one end of the treatment tool passage channel, an insertion shape detection probe provided with a plurality of shape detection elements which are to be passed and arranged in the treatment tool passage channel via the adaptor for endoscope forceps opening, an insertion shape detection unit for detecting magnetic field emitted from the shape detection elements of the insertion shape detection probe, an insertion shape detection device which drives the insertion shape detection probe and outputs video signals for visualizing the insertion shape from the signals corresponding to the magnetic field detected by the insertion shape detection unit, and a display device for displaying the insertion shape of the insertion portion based on the video signals output from the inser

Abstract: A torque measuring device including a light irradiation element for irradiating a light, and a control unit operatively connected to the irradiation element so as to branch the light into a plurality of lights as beams and control a beam diameter of the respective lights so as to irradiate the lights on a surface of a member to be measured. The torque measuring device further includes a plurality of reflectors disposed on the surface of the member to be measured so as to change reflection state of the respective lights, a plurality of detectors for detecting the changes of intensities of the respective reflected lights and generating signals thereof, and a signal processor for processing the generated signals and operating a rotation period on the basis of the generated signals thereby to calculate a torque of the member to be measured.

Abstract: An endoscope includes an insertion section inserted into the body cavity and a probe provided inside the insertion section for detecting the form of the endoscope. The probe includes a plurality of coil portions arranged in the longitudinal direction of the insertion section of the endoscope and a wire electrically connecting the coil portions. The coil portions and the wire are covered with a flexible member. And the outer diameter of the covered wire is smaller than the outer diameter of the covered coil portions.

Abstract: When a user accesses an IC card system, the user intentionally registers processing or actions necessary for an IC card to an IC card management system, or the system determines a predetermined state to register the processing to the IC card management system. The IC card management system beforehand delivers the actions to an IC card terminal. Thereafter, when the user inserts the IC card of which the necessary actions have been registered to the IC card management system to the IC card terminal, the IC card terminal executes the actions corresponding to the IC card.

Abstract: A refractory metal silicide target is characterized by comprising a fine mixed structure composed of MSi2 (where M: refractory metal) grains and Si grains, wherein the number of MSi2 grains independently existing in a cross section of 0.01 mm2 of the mixed structure is not greater than 15, the MSi2 grains have an average grain size not greater than 10 &mgr;m, whereas free Si grains existing in gaps of the MSi2 grains have a maximum grain size not greater than 20 &mgr;m. The target has a high density, high purity fine mixed structure with a uniform composition and contains a small amount of impurities such as oxygen etc. The employment of the target can reduce particles produced in sputtering, the change of a film resistance in a wafer and the impurities in a film and improve yield and reliability when semiconductors are manufactured.

Abstract: A refractory metal silicide target is characterized by comprising a fine mixed structure composed of MSi2 (where M: refractory metal) grains and Si grains, wherein the number of MSi2 grains independently existing in a cross section of 0.01 mm2 of the mixed structure is not greater than 15, the MSi2 grains have an average grain size not greater than 10 &mgr;m, whereas free Si grains existing in gaps of the MSi2 grains have a maximum grain size not greater than 20 &mgr;m. The target has a high density, high purity fine mixed structure with a uniform composition and contains a small amount of impurities such as oxygen etc. The employment of the target can reduce particles produced in sputtering, the change of a film resistance in a wafer and the impurities in a film and improve yield and reliability when semiconductors are manufactured.

Abstract: A refractory metal silicide target is characterized by comprising a fine mixed structure composed of MSi2 (where M: refractory metal) grains and Si grains, wherein the number of MSi2 grains independently existing in a cross section of 0.01 mm2 of the mixed structure is not greater than 15, the MSi2 grains have an average grain size not greater than 10 &mgr;m, whereas free Si grains existing in gaps of the MSi2 grains have a maximum grain size not greater than 20 &mgr;m. The target has a high density, high purity fine mixed structure with a uniform composition and contains a small amount of impurities such as oxygen etc. The employment of the target can reduce particles produced in sputtering, the change of a film resistance in a wafer and the impurities in a film and improve yield and reliability when semiconductors are manufactured.

Abstract: An endoscope capable of improving assembly operativity and facilitating a repair operation is provided. This endoscope has an insertion section having a proximal end portion and a distal end portion, and inserted into a body cavity, an operation section arranged on a proximal end portion side of the insertion section, a universal cord extending from the operation section, and having a distal end portion, and a conduit extended in the insertion section, the operation section and the universal cord. This conduit has one end arranged on the distal end portion of the insertion section and having a first opening portion formed therein and the other end arranged on the connector and having a second opening portion formed therein, and separable on a portion between one end and the other end.

Abstract: A Mo—W material for the formation of wirings is discloses which, as viewed integrally, comprises 20 to 95% of tungsten and the balance of molybdenum and inevitable impurities by atomic percentage. The Mo—W material for wirings is a product obtained by compounding and integrating a Mo material and a W material as by the powder metallurgy technique or the smelting technique or a product obtained by arranging these materials in amounts calculated to account for the percentage composition mentioned above. The Mo—W material containing W in a proportion in the range of from 20 to 95% manifests low resistance and, at the same time, excels in workability and tolerance for etchants. The wiring thin film which is formed of the Mo—W alloy of this percentage composition is used as address wirings and others for liquid crystal display devices.

Abstract: The invention relates to a motor which comprises a drive system which has a stator (10) and a rotor (14), and a control system which controls the drive system and has circuit boards (21), (22), both being housed in a casing (2), wherein the casing (2) has a first conductive pin (25) for flowing a current to input power to the control system and a second conductive pin (26) for flowing a current to output from the control system to respective phases of a coil, and the circuit boards are supported by the first and second conductive pins. And, the invention relates to a method of manufacturing a motor which comprises the steps of using a first die (101) and a second die (102) which are mutually connected with a die split face (104) therebetween and a third die (103) which is inserted in the middle of the first and second dies, inserting and fixing a motor stator, a metallic cylinder and embedding members into a cavity formed by the first, second and third dies, and pouring a molten resin to effect resin molding.

Abstract: A Mo-W material for the formation of wirings is discloses which, as viewed integrally, comprises 20 to 95% of tungsten and the balance of molybdenum and inevitable impurities by atomic percentage. The Mo-W material for wirings is a product obtained by compounding and integrating a Mo material and a W material as by the powder metallurgy technique or the smelting technique or a product obtained by arranging these materials in amounts calculated to account for the percentage composition mentioned above. The Mo-W material containing W in a proportion in the range of from 20 to 95% manifests low resistance and, at the same time, excels in workability and tolerance for etchants. The wiring thin film which is formed of the Mo-W alloy of this percentage composition is used as address wirings and others for liquid crystal display devices.

Abstract: A bonded pipe produced by using the liquid phase diffusion process in which the pipe ends of pipes to be bonded are butted with an insert material lower in melting point than the pipe material against each other, wherein the thickness is increased in such a manner that the outside diameter of the butted portion is expanded and the inside diameter thereof is reduced. A method for bonding pipes in which pipe ends of the pipes are butted through an insert material lower in melting point than the pipe material against each other, and the butted portion is heated to and held at a holding temperature higher than the melting point of the insert material, whereby the insert material is diffused in liquid phase into the pipe material, characterized in that at the time point when the outer pipe face temperature of the above-mentioned butted portion reaches a value which is not less than the A.sub.