Abstract: A semiconductor device includes a semiconductor element having a lower surface bonded to an insulating substrate side, and a plate-shaped lead terminal bonded to an upper surface of the semiconductor element, and having a horizontally extending portion. The horizontally extending portion in the lead terminal is bonded to the semiconductor element and includes a linearly extending portion in a planar view. The semiconductor device further includes a sealing resin that seals the semiconductor element together with the linearly extending portion in the lead terminal. A linear expansion coefficient of the sealing resin shows a value intermediate between a linear expansion coefficient of the lead terminal and a linear expansion coefficient of the semiconductor element, and the lead terminal includes a recess or a projection to horizontally and partially separate the linearly extending portion into parts.

Abstract: A base plate (1) includes a fixed surface and a radiating surface which is a surface opposite to the fixed surface. An insulating substrate (3) is bonded to the fixed surface of the base plate (1). Conductive patterns (4,5) are provided on the insulating substrate (3). Semiconductor chips (7,8) are bonded to the conductive pattern (4). An Al wire (12) connects top surfaces of the semiconductor chip (8) to the conductive pattern (5). The insulating substrate (3), the conductive patterns (4 ,5), the semiconductor chips (7 to 10) and the Al wires (11 to 13) are sealed with resin (16). The base plate (1) includes a metal part (19) and a reinforcing member (20) provided in the metal part (19). A Young's modulus of the reinforcing member (20) is higher than a Youngs modulus of the metal part (19).

Abstract: A heat sink has a fixation surface and a heat release surface opposite from the fixation surface. A fin is provided in a central portion of the heat release surface. An insulating member is provided on the fixation surface of the heat sink. An electroconductive member is provided on the insulating member . A semiconductor chip is provided on the electroconductive member. A metal frame is connected to the semiconductor chip. A molding resin covers the heat sink, the insulating member, the electroconductive member, the semiconductor chip, and the metal frame so that the fin is exposed to outside. A hole extends through a peripheral portion of the heat sink and a peripheral portion of the molding resin. The semiconductor module is mounted on a cooling jacket by passing a screw through the hole.

Abstract: A printer including: a detection unit which detects first remaining amounts of inks; a generation unit which generates a plurality of mixed color information on mixed colors having different distribution densities of the inks, the plurality of mixed color information each including a mixed color and second remaining amounts of the inks representing estimated remaining amounts of the inks based on the first remaining amounts if the mixed color were to be used for printing; and an obtaining unit which obtains mixed color information selected from the plurality of mixed color information.

Abstract: A printer including: a detection unit which detects first remaining amounts of inks; a generation unit which generates a plurality of mixed color information on mixed colors having different distribution densities of the inks, the plurality of mixed color information each including a mixed color and second remaining amounts of the inks representing estimated remaining amounts of the inks based on the first remaining amounts if the mixed color were to be used for printing; and an obtaining unit which obtains mixed color information selected from the plurality of mixed color information.

Abstract: A printer including: a detection unit which detects first remaining amounts of inks; a generation unit which generates a plurality of mixed color information on mixed colors having different distribution densities of the inks, the plurality of mixed color information each including a mixed color and second remaining amounts of the inks representing estimated remaining amounts of the inks based on the first remaining amounts if the mixed color were to be used for printing; and an obtaining unit which obtains mixed color information selected from the plurality of mixed color information.

Abstract: An exhaust gas purification filter collects PM contained in and purifies exhaust gas emitted from a gasoline direct injection engine. The exhaust gas purification filter has a honeycomb structural body which has a plurality of cells, partition walls and plug members. Each of the cells is surrounded by the partition walls. An opening section of one end of each of the cells is plugged by a plug member. The plug members satisfies a relationship of L/D?50 and L?3, where L is an average length (mm) of the plug members and D is an average pore size mm of the plug members. The honeycomb structural body and the plug members are made of cordierite. The cordierite contains silica, talc, kaolin, alumina and/or aluminum hydroxide, etc.

Abstract: A honeycomb structure body is comprised of a honeycomb body, a pair of electrodes, a pair of electrode terminals and one or more slit sections. The honeycomb body is comprised of a cell formation section and an outer skin section. The outer skin section has a cylindrical shape and covers the cell formation section. The electrodes are formed on an outer peripheral surface of the outer skin section so that the electrodes face with to each other in a radial direction of the honeycomb structure body. Each electrode terminal is formed in an electrode terminal formation section on the corresponding electrode. One or more the slit sections are formed in at least one of an electrode terminal formation section and a circumferential outside section of the electrode terminal formation section.

Abstract: A semiconductor device according to the present invention includes a ceramic substrate, a plurality of circuit patterns arranged on a surface of the ceramic substrate, a semiconductor element arranged on an upper surface of at least one circuit pattern, and a sealing resin for sealing the ceramic substrate, the plurality of circuit patterns, and the semiconductor element, in which an undercut part is formed in opposed side surfaces of the circuit patterns adjacent to one another, the undercut part is configured such that an end of an upper surface of the circuit pattern protrudes outside the circuit pattern more than an end of a lower surface of the circuit pattern on the ceramic substrate, and the undercut part is also filled with the sealing resin.

Abstract: A semiconductor device according to the present invention includes: a power semiconductor element that is a semiconductor element; bonding parts provided for bonding of an upper surface and a lower surface of the semiconductor element; and metal plates bonded to the power semiconductor element from above and below through the bonding parts, wherein the bonding part includes a mesh metal body disposed between the semiconductor element and the metal plate, and a bonding member in which the mesh metal body is embedded.

Abstract: A honeycomb structural body has a honeycomb body and a pair of electrodes. The honeycomb body has a cell formation part and an outer skin part of a cylindrical hollow shape. The electrodes are formed on an outer peripheral surface of the outer skin part so that the electrodes face to each other in a diameter direction of the honeycomb body. Each of the electrodes has a reference electrode part formed at a central part of the electrode and one or more outside electrode parts formed at both ends of the reference electrode part. The reference electrode parts of the electrode face to each other. The outside electrode parts of the electrodes face to each other. An electrical resistivity of the reference electrode part is smaller than an electrical resistivity of each of the outside electrode parts in each of the electrodes.

Abstract: A honeycomb structural body has a honeycomb body and an electrode pair. The honeycomb body has a cell formation part and an outer skin part of a cylindrical-hollow shape. The electrodes are formed on an outer peripheral surface of the outer skin part so that the electrodes face to each other in a diameter direction of the honeycomb body. Each electrode has a reference electrode part formed at a central part of the electrode and one or more outside electrode parts formed at both ends of the reference electrode part. An electrode terminal is formed at the central part of each electrode. The reference electrode parts of the electrodes face to each other. The outside electrode parts of the electrodes face to each other. A thickness of each electrode is gradually decreased from the central part toward the outside of the electrode along the circumferential direction of the honeycomb body.

Abstract: An electrically heated catalyst device has a cylindrical outer skin part and a cell formation part. A pair of electrodes formed on the outer skin park faces relative to each other in a radial direction of the honeycomb structural body. An electrode terminal is formed on the corresponding electrode in an outer radial direction of the honeycomb structural body. A length edge line of each electrode is inclined to a virtual reference line at a predetermined angle. The virtual reference line is a virtual line defined on the outer circumferential surface of the outer skin part and is parallel to the axial direction of the honeycomb structural body. The electrode terminals are formed at a predetermined interval in the axial direction of the honeycomb structural body to make an angle of less than 180° when viewed from one end surface perpendicular to the axial direction of the honeycomb structural body.

Abstract: Provided is a semiconductor device including a heat dissipating fin; an insulating sheet bonded to an upper surface of the heat dissipating fin, with a part of the upper surface being exposed; a heat spreader located on the insulating sheet; a power element located on the heat spreader; and a transfer molding resin located to cover a predetermined surface including the part of the upper surface of the heat dissipating fin, the insulating sheet, the heat spreader and the power element, wherein the upper surface of the heat dissipating fin has a protruding shape and/or recessed shape located so as to bind an edge of the insulating sheet.

Abstract: Provided is a semiconductor device including a heat dissipating fin; an insulating sheet bonded to an upper surface of the heat dissipating fin, with a part of the upper surface being exposed; a heat spreader located on the insulating sheet; a power element located on the heat spreader; and a transfer molding resin located to cover a predetermined surface including the part of the upper surface of the heat dissipating fin, the insulating sheet, the heat spreader and the power element, wherein the upper surface of the heat dissipating fin has a protruding shape and/or recessed shape located so as to bind an edge of the insulating sheet.

Abstract: A honeycomb structural body has a honeycomb body and a pair of electrodes. The honeycomb body has a cell formation part and an outer skin part of a cylindrical hollow shape. The electrodes are formed on an outer peripheral surface of the outer skin part so that the electrodes face to each other in a diameter direction of the honeycomb body. Each of the electrodes has a reference electrode part formed at a central part of the electrode and one or more outside electrode parts formed at both ends of the reference electrode part. The reference electrode parts of the electrode face to each other. The outside electrode parts of the electrodes face to each other. An electrical resistivity of the reference electrode part is smaller than an electrical resistivity of each of the outside electrode parts in each of the electrodes.

Abstract: A honeycomb structural body has a honeycomb body and an electrode pair. The honeycomb body has a cell formation part and an outer skin part of a cylindrical-hollow shape. The electrodes are formed on an outer peripheral surface of the outer skin part so that the electrodes face to each other in a diameter direction of the honeycomb body. Each electrode has a reference electrode part formed at a central part of the electrode and one or more outside electrode parts formed at both ends of the reference electrode part. An electrode terminal is formed at the central part of each electrode. The reference electrode parts of the electrodes face to each other. The outside electrode parts of the electrodes face to each other. A thickness of each electrode is gradually decreased from the central part toward the outside of the electrode along the circumferential direction of the honeycomb body.

Abstract: A semiconductor device according to the present invention includes: a power semiconductor element that is a semiconductor element; bonding parts provided for bonding of an upper surface and a lower surface of the semiconductor element; and metal plates bonded to the power semiconductor element from above and below through the bonding parts, wherein the bonding part includes a mesh metal body disposed between the semiconductor element and the metal plate, and a bonding member in which the mesh metal body is embedded.

Abstract: A power module includes: an encapsulation-target portion having at least one semiconductor element; and an encapsulation member that has first and second planes between which the encapsulation-target portion is interposed, and that encapsulates the encapsulation-target portion. The encapsulation member has, on the at least one semiconductor element, at least one opening that exposes part of a surface of the encapsulation-target portion the surface being on a side of the first plane. Thus, a semiconductor device of which size can be reduced can be provided.