Patents by Inventor Mikio Mori

Mikio Mori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11220032
    Abstract: To manufacture a sprue-bush which is capable of suitably cooling a melt raw resin in a raw resin-flow path as a whole, there is provided a method for manufacturing a sprue-bush, wherein a shaped part is located on a base part to manufacture the sprue-bush, the base part comprising a raw resin-flow path and a cooling medium-flow path, wherein, in the shaped part, a downstream raw resin-flow path portion is located and a downstream cooling medium-flow path portion is also located, the downstream raw resin-flow path portion corresponding to a downstream side region of a raw resin-flow path of the sprue-bush, the downstream cooling medium-flow path portion being positioned around the downstream raw resin-flow path portion and corresponding to a downstream side region of a cooling medium-flow path of the sprue-bush, and wherein the downstream cooling medium-flow path portion is located to surround the downstream raw resin-flow path portion.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: January 11, 2022
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shinya Watanabe, Satoshi Abe, Kenichi Tanaka, Mikio Mori, Yoshiyuki Uchinono
  • Patent number: 10953580
    Abstract: In order to provide a sprue-bush which is capable of suitably cooling a melt raw resin in a raw resin-flow path as a whole, there is provided a sprue-bush, comprising a raw resin-flow path and a cooling medium-flow path located around the raw resin-flow path, wherein a width dimension of the raw-resin flow path gradually becomes larger toward a downstream side-end surface of the sprue-bush, and wherein the downstream side-end surface of the sprue-bush is a heat transfer surface.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: March 23, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shinya Watanabe, Satoshi Abe, Kenichi Tanaka, Mikio Mori, Yoshiyuki Uchinono
  • Patent number: 10898953
    Abstract: There is provided a manufacturing method of a three-dimensional shaped object, the method being capable of reducing a warp deformation of the three-dimensional shaped object. The manufacturing method according to an embodiment of the present invention produces a three-dimensional shaped object by alternate repetition of a powder-layer forming and a solidified-layer forming on a base plate, wherein the forming of at least one prior solidified layer is performed under a higher temperature condition than that for the forming of a subsequent solidified layer, the at least one prior solidified layer being formed prior to the subsequent solidified layer.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: January 26, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Satoshi Abe, Isao Fuwa, Mikio Mori
  • Patent number: 10821663
    Abstract: There is provided a manufacturing method of a three-dimensional shaped object, the method being capable of reducing a warp deformation of the three-dimensional shaped object. The manufacturing method according to an embodiment of the present invention produces a three-dimensional shaped object by alternate repetition of a powder-layer forming and a solidified-layer forming by light beam irradiation, wherein as a platform for the three-dimensional shaped object, a plate laminate body comprising a dummy solidified layer and a base plate for the shaped object is used, and the dummy solidified layer is formed on one of principal surfaces of the base plate, whereas the three-dimensional shaped object is manufactured on the other of the principal surfaces of the base plate.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: November 3, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Satoshi Abe, Isao Fuwa, Mikio Mori
  • Patent number: 10413970
    Abstract: There is provided a method for manufacturing a three-dimensional shaped object by alternate repetition of a powder-layer forming and a solidified-layer forming by an irradiation with a light beam in order to provide a selective laser sintering method capable of reducing a warp of the three-dimensional shaped object, the warp being due to a stress around an upper surface of the three-dimensional shaped object. Especially, in the present invention, a part of a region for the formation of the solidified layer is not irradiated with the light beam to form a non-irradiated portion, thereby providing at least one slit-groove at an upper surface of the three-dimensional shaped object, the slit-groove being for reducing a stress of the three-dimensional shaped object.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: September 17, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masataka Takenami, Satoshi Abe, Mikio Mori
  • Publication number: 20190224898
    Abstract: To manufacture a sprue-bush which is capable of suitably cooling a melt raw resin in a raw resin-flow path as a whole, there is provided a method for manufacturing a sprue-bush, wherein a shaped part is located on a base part to manufacture the sprue-bush, the base part comprising a raw resin-flow path and a cooling medium-flow path, wherein, in the shaped part, a downstream raw resin-flow path portion is located and a downstream cooling medium-flow path portion is also located, the downstream raw resin-flow path portion corresponding to a downstream side region of a raw resin-flow path of the sprue-bush, the downstream cooling medium-flow path portion being positioned around the downstream raw resin-flow path portion and corresponding to a downstream side region of a cooling medium-flow path of the sprue-bush, and wherein the downstream cooling medium-flow path portion is located to surround the downstream raw resin-flow path portion.
    Type: Application
    Filed: June 28, 2017
    Publication date: July 25, 2019
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shinya WATANABE, Satoshi ABE, Kenichi TANAKA, Mikio MORI, Yoshiyuki UCHINONO
  • Publication number: 20190224897
    Abstract: In order to provide a sprue-bush which is capable of suitably cooling a melt raw resin in a raw resin-flow path as a whole, there is provided a sprue-bush, comprising a raw resin-flow path and a cooling medium-flow path located around the raw resin-flow path, wherein a width dimension of the raw-resin flow path gradually becomes larger toward a downstream side-end surface of the sprue-bush, and wherein the downstream side-end surface of the sprue-bush is a heat transfer surface.
    Type: Application
    Filed: June 28, 2017
    Publication date: July 25, 2019
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shinya WATANABE, Satoshi ABE, Kenichi TANAKA, Mikio MORI, Yoshiyuki UCHINONO
  • Publication number: 20190091923
    Abstract: There is provided a manufacturing method of a three-dimensional shaped object, the method being capable of reducing a warp deformation of the three-dimensional shaped object. The manufacturing method according to an embodiment of the present invention produces a three-dimensional shaped object by alternate repetition of a powder-layer forming and a solidified-layer forming by light beam irradiation, wherein as a platform for the three-dimensional shaped object, a plate laminate body comprising a dummy solidified layer and a base plate for the shaped object is used, and the dummy solidified layer is formed on one of principal surfaces of the base plate, whereas the three-dimensional shaped object is manufactured on the other of the principal surfaces of the base plate.
    Type: Application
    Filed: March 8, 2017
    Publication date: March 28, 2019
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Satoshi ABE, Isao FUWA, Mikio MORI
  • Publication number: 20190076923
    Abstract: There is provided a manufacturing method of a three-dimensional shaped object, the method being capable of reducing a warp deformation of the three-dimensional shaped object. The manufacturing method according to an embodiment of the present invention produces a three-dimensional shaped object by alternate repetition of a powder-layer forming and a solidified-layer forming on a base plate, wherein the forming of at least one prior solidified layer is performed under a higher temperature condition than that for the forming of a subsequent solidified layer, the at least one prior solidified layer being formed prior to the subsequent solidified layer.
    Type: Application
    Filed: March 8, 2017
    Publication date: March 14, 2019
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Satoshi ABE, Isao FUWA, Mikio MORI
  • Publication number: 20170341143
    Abstract: There is provided a manufacturing method of the three-dimensional shaped object, the method being capable of reducing an undesirable phenomenon associated with the contamination of the light transmission window with the fume substance. The manufacturing method according to an embodiment of the present invention is a method for manufacturing a three-dimensional shaped object by alternate repetition of a powder-layer forming and a solidified-layer forming, wherein the irradiation with light beam for the solidified-layer forming is performed by directing the light beam into the chamber through a light transmission window of the chamber, and wherein a gas blow is supplied to the light transmission window by use of a movable gas supply device, the light transmission window having been contaminated with a fume generated upon the formation of the solidified layer.
    Type: Application
    Filed: December 22, 2015
    Publication date: November 30, 2017
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Satoshi ABE, Isao FUWA, Masataka TAKENAMI, Mikio MORI
  • Publication number: 20170203366
    Abstract: There is provided a method for manufacturing a three-dimensional shaped object by alternate repetition of a powder-layer forming and a solidified-layer forming by an irradiation with a light beam in order to provide a selective laser sintering method capable of reducing a warp of the three-dimensional shaped object, the warp being due to a stress around an upper surface of the three-dimensional shaped object. Especially, in the present invention, a part of a region for the formation of the solidified layer is not irradiated with the light beam to form a non-irradiated portion, thereby providing at least one slit-groove at an upper surface of the three-dimensional shaped object, the slit-groove being for reducing a stress of the three-dimensional shaped object.
    Type: Application
    Filed: July 28, 2015
    Publication date: July 20, 2017
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masataka TAKENAMI, Satoshi ABE, Mikio MORI
  • Publication number: 20090314356
    Abstract: In a conventional gas-insulated switchgear placed outdoors, a pressure relief plate of a pressure relief device-a component of the switchgear-becomes wet due to entering of rain or moisture to corrode and deteriorate; and the wet portions swell by their freezing, resulting in further deterioration in mechanical strength of the portions; therefore, the switchgear has a problem in long term reliability. In order to prevent the surface of the pressure relief plate from being exposed to rain or moisture, a hydrophobic synthetic resin is adhered to the outside surface of the pressure relief plate that closes the pressure relief hole provided on the insulated switchgear; therefore, deterioration through corroding or the one in mechanical strength can be curbed to secure long term reliability of the gas-insulated switchgear.
    Type: Application
    Filed: March 13, 2009
    Publication date: December 24, 2009
    Applicant: Mitsubishi Electric Corporation
    Inventors: Masanori Osumi, Mikio Mori
  • Patent number: 7236755
    Abstract: Herein disclosed is a broadcast wave receiving apparatus, comprising: first and second tuning circuits each having a resonance frequency; first controlling means for controlling one of the first and second tuning circuits to ensure that the resonance frequency of one of the first and second tuning circuits is tuned to a specific frequency before allowing one of the first and second tuning circuits to detect a broadcast wave at the specific frequency; judging means for judging whether or not to receive the broadcast wave detected by one of the first and second tuning circuits on the basis of predetermined threshold information on the broadcast waves; and second controlling means for controlling the other of the first and second tuning circuits to ensure that the resonance frequency of the other of the first and second tuning circuits is tuned to the specific frequency before allowing the other of the first and second tuning circuits to produce a broadcast signal indicative of the broadcast wave detected by one
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: June 26, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kimito Terai, Mikio Mori, Masahiro Kawazoe
  • Publication number: 20050141845
    Abstract: A temperature controller and temperature control element, whose plate-surface temperature distribution is highly homogeneous, which can be used in a waveguide type optical module. In a waveguide type optical module a temperature control element is supported on a pedestal inside a casing and an optical waveguide is mounted on the temperature control element. The temperature control element includes a plate having a heater or heat absorber provided on the non-heating side thereof or buried therein. The pedestal is provided to support the plate mainly in contact with the non-heating side of the plate. A total area of contact of the pedestal with the plate including an area of contact with the heater or heat absorber is set to over 30% of the area of the non-heating side of the plate and a sum of surface roughness of the pedestal and those of both the plate and heater is set to over 0.05 ?m.
    Type: Application
    Filed: January 24, 2003
    Publication date: June 30, 2005
    Inventors: Mikio Mori, Hajime Sakamoto, Yasutaka Ito
  • Publication number: 20050120932
    Abstract: A cloth-cutting device is attached to a sewing machine for cutting a cloth along a feeding direction of the cloth during a sewing operation. The cloth-cutting device includes a mount member mounted to the sewing machine on the side of the sewing head, an extendable member linearly vertically extendable from the mount member, and a cutter disposed at a lower end of the extendable member. The cutter is movable between a storage position on the side of a sewing head of the sewing machine and an operational position on the side of a table of the sewing machine as the extendable member moves between an upper position and a lower position.
    Type: Application
    Filed: October 14, 2004
    Publication date: June 9, 2005
    Inventor: Mikio Mori
  • Publication number: 20050078919
    Abstract: A waveguide type optical module is provided which includes a temperature control element supported on pedestals inside a casing, and an optical waveguide provided on the temperature control element. The heating control element includes a plate having a heater or heat absorber provided on a non-heating side thereof or buried therein. The plate is supported on the pedestals with less than 30% of the area thereof being in contact with the plate. Because of such a structure, the waveguide type optical module has a good wavelength demultiplexing characteristic, and the temperature controller and control element for use in the optical module incur less occurrence of particle separation and shows a high homogeneity of plate-surface temperature distribution.
    Type: Application
    Filed: January 16, 2003
    Publication date: April 14, 2005
    Applicant: IBIDEN CO., LTD
    Inventors: Mikio Mori, Hajime Sakamoto, Yasutaka Ito
  • Publication number: 20040198283
    Abstract: Herein disclosed is a broadcast wave receiving apparatus, comprising: first and second tuning circuits each having a resonance frequency; first controlling means for controlling one of the first and second tuning circuits to ensure that the resonance frequency of one of the first and second tuning circuits is tuned to a specific frequency before allowing one of the first and second tuning circuits to detect a broadcast wave at the specific frequency; judging means for judging whether or not to receive the broadcast wave detected by one of the first and second tuning circuits on the basis of predetermined threshold information on the broadcast waves; and second controlling means for controlling the other of the first and second tuning circuits to ensure that the resonance frequency of the other of the first and second tuning circuits is tuned to the specific frequency before allowing the other of the first and second tuning circuits to produce a broadcast signal indicative of the broadcast wave detected by one
    Type: Application
    Filed: March 31, 2004
    Publication date: October 7, 2004
    Applicant: Matsushita Electric Industrial Co., Ltd.
    Inventors: Kimito Terai, Mikio Mori, Masahiro Kawazoe
  • Patent number: 6303873
    Abstract: An inexpensive electronic part module and a process for manufacturing the same, wherein an inexpensive thermoplastic resin is used as the substrate of the circuit board. In order to electrically connect the solder bumps of an electronic part such as an IC chip to a connection pattern, without forming connection holes in the substrate, the substrate is melted and the solder bumps are passed through the substrate by pressing the electronic part against the substrate in a state that the electronic part is heated. The substrate itself can be utilized as an adhesive. The solder bumps 2 are passed through the substrate 4 and contacted with the connection pattern 5 by pressing the solder bumps 2 against the substrate 4 in a state that the electronic part 3 is heated to a temperature higher than the melting point of the thermoplastic resin and lower than the melting point of the solder bumps 2.
    Type: Grant
    Filed: April 29, 1998
    Date of Patent: October 16, 2001
    Assignee: Ibiden Co., Ltd.
    Inventors: Mikio Mori, Toshimi Kohmura
  • Patent number: 6019863
    Abstract: Indication members provided around a central hole in a disk does not adversely affect reference surfaces to be clamped, and clear, stable indication is maintained. For this purpose, first and second optical disks having annular light transmissive disk substrates with a common central hole, one surface of each of which light transmissive disk substrates is provided with a reflection film, are attached to each other as one body with an adhesive layer interposed therebetween, such that the reflection films opposed each other, thereby forming a compound optical disk. Label members are provided from the reflection film side by printing or attachment on flat portions surrounding the central hole.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: February 1, 2000
    Assignees: Kabushiki Kaisha Toshiba, Toshiba-Emi Limited
    Inventors: Hideyuki Irie, Takeshi Hagio, Minami Amano, Mikio Mori, Takashi Tomita, Keiji Kakinuma
  • Patent number: 6018134
    Abstract: A main circuit portions are arranged in the order of a breaking section fixed-side conductor, a breaking section movable-side conductor, a disconnecting section movable-side conductor, and a disconnecting section fixed-side conductor, and first and second grounding conductors are respectively provided for grounding the breaking section fixed-side conductor and the disconnecting section fixed-side conductor at both end portions of the apparatus. The arrangement of operating devices is set in the order of a first grounding-section operating device, a breaking-section operating device, a disconnecting-section operating device, and a second grounding-section operating device. In addition, a breaking section is supported by a single supporting insulator to reduce the number of creepage insulation portions.
    Type: Grant
    Filed: February 10, 1998
    Date of Patent: January 25, 2000
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshiki Hirano, Naoyuki Nakatsukasa, Daisuke Yoshida, Kouichirou Wada, Mikio Mori, Masashi Matsuki