Abstract: Provided is a photoelectric conversion module capable of improving bonding strength between photoelectric conversion elements adjacent to each other. The photoelectric conversion module (100) comprises a first photoelectric conversion element (10a) including a collector electrode (30a) and a second photoelectric conversion element (10b) including a conductive substrate (20b). The first photoelectric conversion element (10a) and the second photoelectric conversion element (10b) are arranged side by side so as to partially overlap each other. The photoelectric conversion module comprises a conductor (200) electrically connecting the collector electrode (30a) of the first photoelectric conversion element (10a) and the conductive substrate (20b) of the second photoelectric conversion element (10b) to each other. The conductor (200) is provided from a region of the collector electrode (30a) of the first photoelectric conversion element (10a) to a region outside the collector electrode (30a).

Abstract: A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, a main component of the dielectric layers being ceramic, a main component of the internal electrode layers being Ni, the internal electrode layers being alternately exposed to two end faces of the multilayer chip opposite to each other, and external electrodes, each of which is provided on each of the two end faces. Each of the external electrodes includes a base layer contacting the internal electrode layers, a main component of the base layer being Cu. The base layer includes Ni of 1 wt % or more and 10 wt % or less on a presumption that an amount of Cu is 100 wt %.

Abstract: A cable connection structure manufacturing method includes: covering, by a first electrode, an end face of an electric cable, and covering, by a second electrode, a terminal of a substrate; plastically deforming the first electrode and the second electrode having substantially same hardness by first scrubbing in which the first electrode and the second electrode rub against each other at a first pressure and a first amplitude; polishing the first electrode and the second electrode by second scrubbing in which the first electrode and the second electrode rub against each other at a second pressure smaller than the first pressure and a second amplitude smaller than the first amplitude; and bonding the first electrode and the second electrode at a third pressure higher than the first pressure.

Abstract: A cable connection structure includes an electric cable, an end face of a core wire of which is exposed, a first electrode that covers the end face, a substrate, a terminal of which is exposed on a principal surface, and a second electrode bonded to the first electrode without another member interposed between the first electrode and the second electrode, the second electrode covering the terminal and having substantially same Vickers hardness as Vickers hardness of the first electrode.

Abstract: An endoscope distal end portion includes: a channel that is tubular, the channel being where a surgical tool is to be inserted in; a light guide configured to guide illumination light emitted from a light source; an imager configured to capture an image of an observed region illuminated with the illumination light from the light guide; and a fixing member that is made of resin and that has a columnar outer shape, the fixing member being configured to seal around the channel, the light guide, and the imager, wherein the channel is in contact with the imager, and the light guide is in contact with at least one of the channel and the imager, and a contact surface of the channel in contact with the light guide or a contact surface of the imager in contact with the light guide has a groove or a projection formed thereon.

Abstract: A cable connection structure includes an electric cable, an end face of a core wire of which is exposed, a first electrode that covers the end face, a substrate, a terminal of which is exposed on a principal surface, and a second electrode bonded to the first electrode without another member interposed between the first electrode and the second electrode, the second electrode covering the terminal and having substantially same Vickers hardness as Vickers hardness of the first electrode.

Abstract: A cable connection structure manufacturing method includes: covering, by a first electrode, an end face of an electric cable, and covering, by a second electrode, a terminal of a substrate; plastically deforming the first electrode and the second electrode having substantially same hardness by first scrubbing in which the first electrode and the second electrode rub against each other at a first pressure and a first amplitude; polishing the first electrode and the second electrode by second scrubbing in which the first electrode and the second electrode rub against each other at a second pressure smaller than the first pressure and a second amplitude smaller than the first amplitude; and bonding the first electrode and the second electrode at a third pressure higher than the first pressure.

Abstract: An endoscope distal end portion includes: a channel that is tubular, the channel being where a surgical tool is to be inserted in; a light guide configured to guide illumination light emitted from a light source; an imager configured to capture an image of an observed region illuminated with the illumination light from the light guide; and a fixing member that is made of resin and that has a columnar outer shape, the fixing member being configured to seal around the channel, the light guide, and the imager, wherein the channel is in contact with the imager, and the light guide is in contact with at least one of the channel and the imager, and a contact surface of the channel in contact with the light guide or a contact surface of the imager in contact with the light guide has a groove or a projection formed thereon.

Abstract: An imaging apparatus mount assembly for an image sensor chip includes a substrate, a plurality of first pins and at least one first electronic component, both mounted on a first surface of the substrate, and a first resin sealant configured to seal the first surface so as to expose an end face of a first shaft section opposite to where a first connecting section is provided. A plurality of second pins and at least one second electronic component are both mounted on a second surf ace of the substrate. A second resin sealant is configured to seal the second surface so as to expose an end face of a second shaft section opposite to where a second connecting section is provided. The image sensor chip includes a light receiving unit and a back-surface electrode, the first shaft section exposed on the first resin sealant is connected to the back-surface electrode.

Abstract: A stacked mounting structure and a method of manufacturing stacked mounting structure are provided. The stacked mounting structure includes a plurality of members provided with a mounting area which is necessary for installing and operating components to be mounted on at least one principal surface, and an area for connections for signal transfer for operating the components to be mounted, and an electroconductive member which is disposed on the area for connections between the mutually facing members, and a cross section of the electroconductive member is same as or smaller than the area for connections, and an end portion of the electroconductive member is extended from a principal surface of one member up to a principal surface of the other member, and a height of the electroconductive member regulates a distance of the mounting area.

Abstract: A normal detection method for measuring the distance to a measurement subject using one or a plurality of distance detectors, and obtaining a normal vector on the measured surface of the measurement subject from the obtained measurement result, wherein: within a three-dimensional space, the straight line linking a first measurement point measured at a first measurement position using a distance detector and a second measurement point measured at a second measurement position different from the first measurement position is set as a first vector; the straight line linking the first measurement point and a third measurement point measured at a third measurement position different from the first measurement position and the second measurement position as a second vector; and a normal vector on the measured surface is obtained by determining the vector product of the first vector and the second vector.

Abstract: A cable connecting structure includes a cable that includes a conductive film formed on a surface of a core line exposed at a distal end surface, and a substrate that includes an electrode formed on a predetermined connection side surface for connecting the cable. The distal end surface of the cable and the connection side surface of the substrate are arranged so as to face each other. The conductive film formed on the surface of the core line and the electrode are connected by a conductive material.

Abstract: An imaging module includes: an imaging unit including a light receiving unit having a plurality of pixels arranged in a specified shape including a lattice shape and configured to receive light and to perform photoelectric conversion on the received light, the imaging unit being configured to capture an image of a subject and to output the image as a light quantity signal; a signal processing unit configured to perform signal processing on the light quantity signal; and a flexible substrate which includes a bendable insulating film and on which the imaging unit and the signal processing unit are mounted. The flexible substrate is bent to arrange the signal processing unit and the flexible substrate in a space extending from an outer edge of an incident surface of the imaging unit in a direction perpendicular to the incident surface while maintaining a shape of the outer edge.

Abstract: To improve working efficiency of mounting components in a lower part of a vehicle body, a vehicle assembly line includes a supporting unit to support a vehicle body in a position such that the front direction of the vehicle body is perpendicular to the conveying direction. The supporting unit includes an upstream supporting member and a downstream supporting member provided upstream and downstream of the platform along the conveying direction, respectively. The centers of the support columns fixed to a platform, of the upstream supporting member and the downstream supporting member, are located upstream and downstream, respectively, with respect to a center line CLb of the platform extending in a direction perpendicular to the conveying direction of the platform, and located apart from and opposite to each other across a center line CLa of the platform extending in the conveying direction, to provide a working space for mounting below the vehicle body supported by the carrier device.

Abstract: The method for manufacturing the structure includes an imaging device installation process in which a camera 41 that obtains an image of a target hole 33 formed in an upper panel 31 is installed on the rear spar 22, and a positioning process in which relative positions are positioned by relatively moving the upper panel 31 and the rear spar 22 while the image of the target hole 33 obtained by the camera 41 and displayed on a monitor screen is aligned with a target line preset on the monitor screen.

Abstract: A normal-line detection method for finding the normal vector of a measurement surface of a measurement target by means of at least one distance detector and calculating the normal vector from the measurement results thus obtained is provided. The normal vector of the measurement surface is found by calculating the exterior product of a first vector which connects a first measurement point and a second measurement point and a second vector which connects a third measurement point and a fourth measurement point and is shifted in parallel such that an end thereof is set at any one of the first measurement point and the second measurement point.

Abstract: A method for manufacturing a mount assembly in which pins and electronic components are connected to a same surface of a substrate. Each pin including a connecting section and a shaft section having a diameter smaller than that of the connecting section. A height of each electronic component being not larger than that of each pin when being mounted. The method includes: setting the pins and the electronic components so as to be aligned; and disposing the pins and the electronic components which are aligned, on a stage of a mounting apparatus, lowering a head unit of the mounting apparatus on which the substrate is adsorbed, and connecting the pins and the electronic components collectively to the surface of the substrate by applying heat and pressure while solder applied to a land on the substrate and the connecting section of each pin are in contact with each other.

Abstract: A drill that exhibits improved drill-hole depth precision is provided. Said drill, which uses a tool (T) mounted to a main shaft (16) to drill a countersunk hole (Wh) into a workpiece (W), is provided with the following: a pressure foot (17) that presses on the surface of the workpiece (W) and suppresses vibration thereof; and a displacement sensor (18) that measures the distance (L), in the axial direction of the main shaft (16), between the pressure foot (17) pressing on the workpiece (W) and the end face (16a) of the main shaft (16), which is set to a prescribed reference distance (Lo). The axial position of the main shaft (16) is corrected using a correction distance (?L), i.e. the difference between the distance (L) measured by the displacement sensor (18) and the reference distance (Lo).

Abstract: A case, in which an inner bottom surface is formed, and a chuck tool in which a lower surface is formed are provided. The inner bottom surface is a concave surface. The lower surface is a concave surface. An elongated member chucking apparatus changes an orientation of an elongated member inside the case to a predetermined orientation with respect to the chuck tool by sandwiching the elongated member between the inner bottom surface and the lower surface. The elongated member is held by the chuck tool in the predetermined orientation.

Abstract: An imaging unit includes: an imager that receives and photoelectrically converts light from a target to be captured; a branching unit that branches a signal from the imager into two signals; a first converter into which one of the two signals is input to convert the input signal into an optical signal; a second converter into which the other of the two signals is input to convert the input signal into an electric signal; a first output unit that outputs the optical signal; a second output unit that outputs the electric signal; a detector that detects a unit connected to the imaging unit; and a controller that causes the first output unit to output the optical signal if the unit detected by the detector is the control unit, and causes the second output unit to output the electric signal if the unit detected by the detector is the inspection unit.