Patents by Inventor Mikio Nakamura

Mikio Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140047689
    Abstract: In a method of fastening composite material parts, a first smoothness of a first fastener is measured which is arranged to a first countersink through-hole which is formed in a first fastened work as stacked composite material parts. A second countersink depth is determined based on the first smoothness. A second countersink through hole with a second countersink depth is formed in a second fastened work as the composite material parts. The second fastened work is fastened using the second fastener arranged to the second countersink through-hole.
    Type: Application
    Filed: April 25, 2012
    Publication date: February 20, 2014
    Inventors: Yusuke Ikeda, Toshiyuki Funato, Takahiro Inagaki, Mikio Nakamura, Yosuke Ikeda, Kunihiro Kuroi, Akihito Suzuki, Yuji Kondo, Tsugumaru Yamashita
  • Publication number: 20130336737
    Abstract: Provided is a machine tool, which is capable of highly accurately performing machining with respect to a bent surface of a subject to be machined. The machine tool fixes work (W), which has an upper flat surface (Wa) and a lower bent surface (Wb), in a state wherein the upper flat surface (Wa) is horizontally disposed, and makes a hole in the lower bent surface (Wb). The machine tool is provided with: a lower machining head (25), which has rotatably mounted thereon a tool (T1) that makes the hole in the lower bent surface (Wb); a lower saddle (24) which moves the lower machining head (25) in the axis direction of the tool (T1); and a lower cross rail (23), which is provided by being tilted, with respect to the upper flat surface (Wa), at a tilt angle (?) that is set corresponding to the curvature of the lower bent surface (Wb), and which supports the lower saddle (24) such that the lower saddle can move in the tilt direction of the tilt angle (?).
    Type: Application
    Filed: November 25, 2011
    Publication date: December 19, 2013
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Yoshihito Fujita, Hiroyuki Sakoshi, Hiroo Nabeta, Mikio Nakamura
  • Publication number: 20130314521
    Abstract: An image pickup unit includes an image pickup device, an objective lens, and a prism that has a reflective surface. The image pickup unit includes: a projecting portion that is an area at which the image pickup device projects to the rear from the prism; a terminal portion provided on the projecting portion; a flexible printed wiring board that extends along the prism and the projecting portion; an image pickup device connection terminal portion formed on a face that faces the projecting portion of the flexible printed wiring board; and a cable connection terminal portion formed at an area that extends over the projecting portion of the flexible printed wiring board. The terminal portion and the image pickup device connection terminal portion are joined in an opposed state. An electronic component is mounted on a face on an opposite side to the reflective surface of the flexible printed wiring board.
    Type: Application
    Filed: July 30, 2013
    Publication date: November 28, 2013
    Applicant: OLYMPUS CORPORATION
    Inventors: Nau SATAKE, Hiroyuki MOTOHARA, Junya YAMADA, Takanori SEKIDO, Mikio NAKAMURA
  • Publication number: 20130232781
    Abstract: A mount assembly includes a member in which a mount component is mounted at least on one main face of the member and at which a member connecting electrode is formed; and a connection member that has a pillar-shaped parallel portion arranged so that a longitudinal direction of the parallel portion is parallel to the main face of the member, one end side of the parallel portion being connected to the member connecting electrode.
    Type: Application
    Filed: April 26, 2013
    Publication date: September 12, 2013
    Inventors: Mikio Nakamura, Takanori Sekido
  • Patent number: 8513536
    Abstract: An electronic circuit module is mounted on an electronic circuit board. The electronic circuit module includes an electronic component that has a first electrode and a second electrode that form a facing surface. The electronic circuit module also includes a coaxial cable with a core wire and a shielded wire being exposed in stages. The core wire and the shielded wire of the coaxial cable are directly connected to the first electrode and the second electrode that are exposed at a predetermined cable connecting surface of the electronic component.
    Type: Grant
    Filed: December 1, 2010
    Date of Patent: August 20, 2013
    Assignee: Olympus Corporation
    Inventors: Nau Negishi, Mikio Nakamura
  • Publication number: 20130202378
    Abstract: The end portion processing apparatus includes an X-direction driving unit which allows a back-and-forth movement along an X-direction; a cutter supporting member which is supported by the X-direction driving unit, is able to run in a Y-direction, and supports a cutter member extending in a Z-direction which is perpendicular to the XY-plane; a guide member which has a shape matching to a processing planned shape when seeing from the Z-direction, and guides the cutter supporting member such that the cutter member moves to follow the processing planned shape; and a Y-direction position changing mechanism which changes the position in the Y-direction of the cutter supporting member to the work material. The Y-direction position changing mechanism changes the position of the cutter supporting member such that the cutter supporting member runs on further inner side in case of going back than in case of going forth.
    Type: Application
    Filed: December 27, 2011
    Publication date: August 8, 2013
    Inventors: Shigemi Yamane, Mikio Nakamura
  • Publication number: 20130185918
    Abstract: The method for manufacturing the structure includes an imaging device installation process in which a camera that obtains an image of a target hole formed in an upper panel is installed on the rear spar, and a positioning process in which relative positions are positioned by relatively moving the upper panel and the rear spar while the image of the target hole obtained by the camera and displayed on a monitor screen is aligned with a target line preset on the monitor screen.
    Type: Application
    Filed: December 16, 2011
    Publication date: July 25, 2013
    Inventors: Shigemi Yamane, Mikio Nakamura
  • Patent number: 8390737
    Abstract: An imaging module includes an imaging element provided with an external terminal that is disposed at an end of the front surface on which a light-receiving surface is formed and also includes a substrate on which the imaging element is mounted. On the back surface of the imaging element, an external connecting electrode that is electrically connected to the external terminal is disposed. On the main surface of the substrate, an imaging element connecting electrode is disposed at a position opposing the external connecting electrode. The external connecting electrode is connected to the imaging element connecting electrode.
    Type: Grant
    Filed: August 20, 2010
    Date of Patent: March 5, 2013
    Assignee: Olympus Corporation
    Inventor: Mikio Nakamura
  • Publication number: 20130005181
    Abstract: A cable connection structure includes a cable that has an outer skin and at least one conducting wire, and a substrate to which the cable is connected at a main surface side having a hard wiring, wherein the substrate includes, at the main surface side, a first flat section having flatness and a second flat section having flatness thinner than the first flat section via a level difference surface from the first flat section and an end part of the outer skin is arranged on the second flat section and at least one of the conducting wire is connected to a connecting electrode formed on the second flat section.
    Type: Application
    Filed: September 13, 2012
    Publication date: January 3, 2013
    Applicant: OLYMPUS CORPORATION
    Inventors: Junya YAMADA, Mikio NAKAMURA
  • Publication number: 20120258613
    Abstract: A cable connecting structure includes a cable that includes a conductive film formed on a surface of a core line exposed at a distal end surface, and a substrate that includes an electrode formed on a predetermined connection side surface for connecting the cable. The distal end surface of the cable and the connection side surface of the substrate are arranged so as to face each other. The conductive film formed on the surface of the core line and the electrode are connected by a conductive material.
    Type: Application
    Filed: June 18, 2012
    Publication date: October 11, 2012
    Applicant: OLYMPUS CORPORATION
    Inventor: Mikio NAKAMURA
  • Publication number: 20120036842
    Abstract: The present invention provides an exhaust purification device for an engine, comprising: an ammonia supply system including an ammonia supply injector for supplying ammonia to a combustion chamber and a control unit for controlling the ammonia supply injector, and a NOx purification system provided in an exhaust passage and including a Selective Catalytic Reduction catalyst being able to fulfill a function for purifying NOx under the presence of the ammonia.
    Type: Application
    Filed: October 27, 2011
    Publication date: February 16, 2012
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Mikio NAKAMURA
  • Publication number: 20110127079
    Abstract: An electronic circuit module is mounted on an electronic circuit board. The electronic circuit module includes an electronic component that has a first electrode and a second electrode that form a facing surface. The electronic circuit module also includes a coaxial cable with a core wire and a shielded wire being exposed in stages. The core wire and the shielded wire of the coaxial cable are directly connected to the first electrode and the second electrode that are exposed at a predetermined cable connecting surface of the electronic component.
    Type: Application
    Filed: December 1, 2010
    Publication date: June 2, 2011
    Applicant: OLYMPUS CORPORATION
    Inventors: Nau NEGISHI, Mikio NAKAMURA
  • Publication number: 20110042140
    Abstract: A cable assembly includes a plurality of cables; and a cable fixing member which has a facing surface to be oppositely arranged, in connecting each of the cables to a member as a connection target, with respect to a connection surface of the connection target member and fixes a distal end part of each of the cables in a state where an axial direction of the distal end part of each of the cables is arranged along the facing surface, wherein a side surface of a core wire of each of the cables is exposed at a predetermined first position on the facing surface of the cable fixing member and a first connection part which connects the core wire of each of the cables to the connection target member is formed at the first exposed part.
    Type: Application
    Filed: August 20, 2010
    Publication date: February 24, 2011
    Applicant: OLYMPUS CORPORATION
    Inventors: Mikio NAKAMURA, Hiroshi SUZUSHIMA, Fukashi YOSHIZAWA, Hideharu MIYAHARA
  • Publication number: 20110043672
    Abstract: An imaging module includes an imaging element provided with an external terminal that is disposed at an end of the front surface on which a light-receiving surface is formed and also includes a substrate on which the imaging element is mounted. On the back surface of the imaging element, an external connecting electrode that is electrically connected to the external terminal is disposed. On the main surface of the substrate, an imaging element connecting electrode is disposed at a position opposing the external connecting electrode. The external connecting electrode is connected to the imaging element connecting electrode.
    Type: Application
    Filed: August 20, 2010
    Publication date: February 24, 2011
    Applicant: OLYMPUS CORPORATION
    Inventor: Mikio NAKAMURA
  • Publication number: 20110024171
    Abstract: A multilayer laminated circuit includes ceramic layers sandwiched between all adjacent layers of a plurality of passive-element conductor layers and a plurality of wiring conductor layers. At least one of the passive-element conductor layers and the wiring conductor layers is connected to an electrode via a via that pierces through the ceramic layers from a principal-surface top side of the multilayer laminated circuit. External electrodes including an electrode, which is to be connected to the via on the principal-surface top side to make an external connection, are formed on the principal-surface top side. An external wiring conductor that connects at least a pair of the external electrodes is formed on the principal-surface top side.
    Type: Application
    Filed: July 29, 2010
    Publication date: February 3, 2011
    Applicant: OLYMPUS CORPORATION
    Inventors: Mikio NAKAMURA, Hiroshi SUZUSHIMA
  • Patent number: 7876573
    Abstract: A stacked mounting structure includes a first substrate, a second substrate, and an intermediate substrate which has a space accommodating therein components to be mounted. A first contact (connecting) terminal and a second contact (connecting) terminal are formed on the first substrate and the second substrate, and have a wire which is formed on a side surface of the intermediate substrate. By formation of the intermediate substrate to be on an inner side than an edge surface of the substrates, a part of the two contact terminals respectively are exposed. One end of the wire is connected to an exposed portion of the first contact terminal, and the other end of the wire is connected to an exposed portion of the second contact terminal.
    Type: Grant
    Filed: April 9, 2007
    Date of Patent: January 25, 2011
    Assignee: Olympus Corporation
    Inventors: Hiroyuki Motohara, You Kondoh, Mikio Nakamura, Takanori Sekido, Shinji Yasunaga
  • Publication number: 20110013059
    Abstract: An image pickup unit having a lens barrel for an optical system includes an electrode which is formed on at least two of a one end portion of the lens barrel, the other end portion of the lens barrel, and a trunk portion of the lens barrel, a wire portion which connects the electrodes electrically, an image pickup element which is provided on one of the one end portion and the other end portion, a plurality of functional elements which is provided to the lens barrel, and a multiplexed-signal converting element which converts multiplexed signal from a plurality of external electrodes provided to the lens barrel. The wire portion transmits signals between the image pickup element and the plurality of functional elements, and the multiplexed-signal converting element.
    Type: Application
    Filed: July 13, 2010
    Publication date: January 20, 2011
    Applicant: OLYMPUS CORPORATION
    Inventors: Mikio NAKAMURA, Tsutomu NAKAMURA
  • Publication number: 20110001810
    Abstract: An image pickup apparatus includes an image pickup module which is provided with a plurality of functional elements for obtaining image information of an object to be photographed, and a signal separation circuit which separates a drive signal from a combined signal in which, at least two of a plurality of drive signals for the plurality of functional elements respectively, are superimposed, an image pickup module control section which is provided with a signal combining section which superimposes at least two of the plurality of drive signals, and a signal transmitting section which is interposed between the image pickup module and the image pickup module control section, and which transmits the combined signal in which, at least two of the plurality of drive signals are superimposed.
    Type: Application
    Filed: July 1, 2010
    Publication date: January 6, 2011
    Applicant: OLYMPUS CORPORATION
    Inventors: Mikio NAKAMURA, Naoki YOSHIDA, Tsutomu NAKAMURA, Fukashi YOSHIZAWA
  • Publication number: 20100254109
    Abstract: A mount assembly includes a member in which a mount component is mounted at least on one main face of the member and at which a member connecting electrode is formed; and a connection member that has a pillar-shaped parallel portion arranged so that a longitudinal direction of the parallel portion is parallel to the main face of the member, one end side of the parallel portion being connected to the member connecting electrode.
    Type: Application
    Filed: March 19, 2010
    Publication date: October 7, 2010
    Applicant: OLYMPUS CORPORATION
    Inventors: Mikio Nakamura, Takanori Sekido
  • Patent number: 7808551
    Abstract: An imaging module includes a flexible printed circuit board which has a first area on which a first functional element is mounted, a second area on which a second functional element is mounted, and a third area which is formed between the first area and the second area, an electronic component which is mounted on the first area, and an imaging device which is mounted on the second area. The flexible printed circuit board is formed by an insulating layer which is integrated, spreading over the first area, the second area, and the third area. The flexible printed circuit board is formed such that the flexible printed circuit board can be bent at least in the third area.
    Type: Grant
    Filed: November 2, 2007
    Date of Patent: October 5, 2010
    Assignee: Olympus Corporation
    Inventors: Hiroshi Ito, You Kondoh, Mikio Nakamura