Abstract: A curable perfluoropolyether based gel composition is provided comprising (A) a linear fluorinated polymer containing at least two alkenyl groups, (B) a polyfluoromonoalkenyl compound containing one alkenyl group and having a perfluoropolyether structure in its backbone, (C) a cyclic organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms and at least one perfluoroalkyl group or perfluoropolyether structure-containing group, and (D) a hydrosilylation reaction catalyst. The composition cures into a gel having improved acid resistance as well as heat resistance, solvent resistance, chemical resistance, weatherability, parting property, and water/oil repellency.

Abstract: A curable perfluoropolyether based gel composition is provided comprising (A) a linear fluorinated polymer containing at least two alkenyl groups, (B) a polyfluoromonoalkenyl compound containing one alkenyl group and having a perfluoropolyether structure in its backbone, (C) a cyclic organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms and at least one perfluoroalkyl group or perfluoropolyether structure-containing group, and (D) a hydrosilylation reaction catalyst. The composition cures into a gel having improved acid resistance as well as heat resistance, solvent resistance, chemical resistance, weatherability, parting property, and water/oil repellency.

Abstract: The curable composition for encapsulating an optical semiconductor includes, a linear polyfluoro compound, a cyclic organosiloxane having a SiH group and a fluorine-containing organic group, and/or an organo hydrogen siloxane having a SiH group and a fluorine-containing organic group, a platinum group metal catalyst, a cyclic organosiloxane having a SiH group, a fluorine-containing organic group and an epoxy group, and a cyclic organopolysiloxane having a monovalent unsaturated hydrocarbon group and a fluorine-containing organic group, and a hardness of the cured product obtained by curing is 30 to 80 by Type A durometer regulated by HS K6253-3.

Abstract: An adhesive composition is provided comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure in its main chain, (B) a fluorinated organohydrogensiloxane having at least two SiH groups, (C) a hydrosilylation catalyst, (D) hydrophobic silica powder, (E) a fluorinated acetylene alcohol, and (F) an organosiloxane containing a SiH group and an epoxy and/or trialkoxysilyl group. A cured product of the composition has a smooth and uniform surface.

Abstract: A method of producing a base compound for a liquid fluoroelastomer which is unaffected by the storage state of the added silica powder, and yields minimal fluctuation in the viscosity between production lots. Specifically, a method of producing a base compound for a liquid fluoroelastomer containing: (A) a linear fluoropolyether compound having at least two alkenyl groups within each molecule and having a perfluoroalkyl ether structure within the main chain, and (B) a hydrophobic silica powder, the method including: (1) heating the component (A) under normal pressure at a temperature of 50 to 100 ° C., (2) adding 20 to 60 parts by mass of the component (B) to 100 parts by mass of the component (A) that has been heated in step (1) while performing kneading to obtain a kneaded product, and (3) kneading the kneaded product obtained in step (2) at a temperature exceeding 100° C., either under conditions of heat and reduced pressure or under conditions of heat and pressure.

Abstract: There are provided an optical semiconductor sealing curable composition that provides a cured material having excellent transparency, and an optical semiconductor apparatus having an optical semiconductor device sealed using the cured material obtained by curing the optical semiconductor sealing curable composition. There is provided an optical semiconductor sealing curable composition containing: (A) a linear polyfluoro compound; (B) cyclic organosiloxane having an SiH group and a fluorine-containing organic group; (C) a platinum group metal catalyst; (D) cyclic organosiloxane having an SiH group, fluorine-containing organic group, and an epoxy group; and (E) cyclic organosiloxane having an SiH group, a fluorine-containing organic group, and a cyclic carboxylic acid anhydride residue.

Abstract: A curable fluoropolyether gel composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure in its backbone, (B) a polyfluoromonoalkenyl compound having one alkenyl group and a perfluoropolyether structure in its backbone, (C) a fluorinated organohydrogensiloxane having at least two SiH groups, and (D) a platinum-based hydrosilylation catalyst is improved by adding (E) a fluorinated acetylene alcohol as reaction regulator. The resulting composition has advantages including uniform dispersion of the catalyst, storage stability, consistent curability, and cured hardness.

Abstract: An adhesive composition is provided comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure in its main chain, (B) a fluorinated organohydrogensiloxane having at least two SiH groups, (C) a hydrosilylation catalyst, (D) hydrophobic silica powder, (E) a fluorinated acetylene alcohol, and (F) an organosiloxane containing a SiH group and an epoxy and/or trialkoxysilyl group. A cured product of the composition has a smooth and uniform surface.

Abstract: The curable composition for encapsulating an optical semiconductor includes, a linear polyfluoro compound, a cyclic organosiloxane having a SiH group and a fluorine-containing organic group, and/or an organo hydrogen siloxane having a SiH group and a fluorine-containing organic group, a platinum group metal catalyst, a cyclic organosiloxane having a SiH group, a fluorine-containing organic group and an epoxy group, and a cyclic organopolysiloxane having a monovalent unsaturated hydrocarbon group and a fluorine-containing organic group, and a hardness of the cured product obtained by curing is 30 to 80 by Type A durometer regulated by HS K6253-3.

Abstract: A thermosetting fluoropolyether adhesive composition is provided. This composition cures at lower than 100° C., and the cured product exhibits good adhesion to various substrates and excellent adhesion durability at a temperature of up to 150° C. A method for adhering the composition to the substrate is also provided.

Abstract: A curable perfluoropolyether gel composition is provided. The composition comprises (A) a straight chain fluorine-containing polymer represented by the following formula (1): (B) a polyfluoromonoalkenyl compound containing one alkenyl group per molecule and having a perfluoropolyether structure in its backbone, (C) an organosilicon compound containing at least two hydrogen atoms bonded to the silicon atom per molecule, and (D) a hydrosilylation catalyst. The composition can be produced into a cured product having excellent heat resistance, solvent resistance, chemical resistance, weatherability, releasability, water repellency, oil repellency, and the like as well as an improved acid resistance.

Abstract: A fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure in its main chain, (B) a fluorinated organohydrogensiloxane containing at least two SiH groups, but not alkoxy and epoxy groups, (C) a platinum group metal-based catalyst, (D) an organosilicon compound having at least one silicon-bonded alkoxy group, and (E) a hydrolytic catalyst can be cured to metal and plastic substrates through addition reaction.

Abstract: There are provided an optical semiconductor sealing curable composition that provides a cured material having excellent transparency, and an optical semiconductor apparatus having an optical semiconductor device sealed using the cured material obtained by curing the optical semiconductor sealing curable composition. There is provided an optical semiconductor sealing curable composition containing: (A) a linear polyfluoro compound; (B) cyclic organosiloxane having an SiH group and a fluorine-containing organic group; (C) a platinum group metal catalyst; (D) cyclic organosiloxane having an SiH group, fluorine-containing organic group, and an epoxy group; and (E) cyclic organosiloxane having an SiH group, a fluorine-containing organic group, and a cyclic carboxylic acid anhydride residue.

Abstract: A method of producing a base compound for a liquid fluoroelastomer which is unaffected by the storage state of the added silica powder, and yields minimal fluctuation in the viscosity between production lots. Specifically, a method of producing a base compound for a liquid fluoroelastomer containing: (A) a linear fluoropolyether compound having at least two alkenyl groups within each molecule and having a perfluoroalkyl ether structure within the main chain, and (B) a hydrophobic silica powder, the method including: (1) heating the component (A) under normal pressure at a temperature of 50 to 100° C., (2) adding 20 to 60 parts by mass of the component (B) to 100 parts by mass of the component (A) that has been heated in step (1) while performing kneading to obtain a kneaded product, and (3) kneading the kneaded product obtained in step (2) at a temperature exceeding 100° C., either under conditions of heat and reduced pressure or under conditions of heat and pressure.

Abstract: A fluoropolyether base rubber composition comprising (a) a linear fluoropolyether compound containing at least two ester groups in a molecule and a divalent perfluoroalkyl ether structure in its backbone, and having a Mn of 3,000-100,000, and (b) a siloxane polymer containing at least three amino groups in a molecule cures at room temperature into a product having heat resistance, low-temperature performance, chemical resistance, solvent resistance and oil resistance.

Abstract: An adhesive composition is provided comprising (A) a fluorinated amide compound containing at least two vinyl groups and having a polyfluoro structure, (B) a fluorinated organosilicon compound containing a fluorinated organic group, at least two SiH groups, and an alkyl, aryl or aralkyl group, and (C) a platinum catalyst, and (D) an organosiloxane containing a SiH group and an epoxy and/or trialkoxysilyl group. The composition is cured on brief heating into a product which achieves adhesion to various substrates and has solvent resistance, chemical resistance, heat resistance, low-temperature properties, low moisture permeability, electric insulation, and acid resistance.

Abstract: A thermosetting fluoropolyether adhesive composition is provided. This composition cures at lower than 100° C., and the cured product exhibits good adhesion to various substrates and excellent adhesion durability at a temperature of up to 150° C. A method for adhering the composition to the substrate is also provided.

Abstract: Perfluoropolyether compositions are provided comprising: (A) a linear perfluoropolyether compound containing at least two alkenyl groups, having a perfluoropolyether structure comprising recurring units —CaF2aO— in its backbone, and having a molecular weight of 10,000 to 100,000; (B) an organosilicon compound containing at least two silicon atom-bonded hydrogen atoms; (C) a reinforcing filler; (D) a hydrosilylation catalyst; and (E) a polyfluoromonoalkenyl compound containing one alkenyl group and having a perfluoropolyether structure in its backbone. The compositions cure into rubber or gel products having improved acid resistance.

Abstract: A heat-curable fluoropolyether adhesive composition comprising (A) a linear polyfluoro compound having at least two alkenyl groups and a perfluoropolyether structure, (B) a fluorinated organohydrogensiloxane having at least two SiH groups, (C) a platinum group metal catalyst, (D) an organosiloxane having at least one SiH group and at least one epoxy and/or trialkoxysilyl group, and (E) a compound having at least two allyloxycarbonyl groups can be cured to metal and plastic substrates by heating at a temperature from 20° C. to less than 100° C.

Abstract: A curable perfluoropolyether gel composition is provided. The composition comprises (A) a straight chain fluorine-containing polymer represented by the following formula (1): (B) a polyfluoromonoalkenyl compound containing one alkenyl group per molecule and having a perfluoropolyether structure in its backbone, (C) an organosilicon compound containing at least two hydrogen atoms bonded to the silicon atom per molecule, and (D) a hydrosilylation catalyst. The composition can be produced into a cured product having excellent heat resistance, solvent resistance, chemical resistance, weatherability, releasability, water repellency, oil repellency, and the like as well as an improved acid resistance.