Abstract: A connecting material can form a detachable connecting structure. According to the connecting material, a connecting portion between a certain object and another object can be more readily formed, and the certain object can be more readily detached from the another object after formation of the connecting portion. The connecting material comprises a solder material and a hydrogen storage metal material which is able to occlude hydrogen, and which is in the form of particles dispersed in the connecting material.

Abstract: The system includes sensing means 120 for detecting a state of a space; a robot 102 for executing a handling job for an article; an article identifying part 32 for identifying, when an article is handled by a movable body, the article in response to a detection result obtained by the sensing means 120; and an article handling subject identifying part 33 for identifying an article handling subject that handles the article. When the movable body that handles the article is the robot 102, the article handling subject identifying part 33 identifies a subject having issued a job instruction to the robot 102 as the article handling subject.

Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material. In the flow soldering process, thermal efficiency of flow soldering is improved in preheating step and/or solder material supplying step thereof. In one aspect of the present invention, a heating cover is located above a preheater, and the flow soldering is conducted while the board passes between the heating cover and the preheater. In another aspect of the present invention, a gap between a preheater and a solder bath is 20 to 60 mm. In yet another aspect of the present invention, a distance between a primary wave and a secondary wave is not larger than 60 mm.

Abstract: A package is formed by covering a circuit board with a thermoplastics film. The cylindrical or sheet-like thermoplastic film is decompressed and used to cover the circuit board to protect the board and components mounted on the board.

Abstract: A package is formed by covering a circuit board with a thermoplastice film. The cylindrical or sheet-like thermoplastic film is decompressed and used to cover the circuit board to protect the board and components mounted on the board.

Abstract: A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material.

Abstract: There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process. In the present invention, a differential thermal analysis curve of a sample of the lead-free solder material is obtained by utilizing a differential thermal analysis method, and thereby a quality of the lead-free solder material used for a flow soldering process is estimated based on the obtained differential thermal analysis curve.

Abstract: All images of a plurality of sucked and held electronic components are picked up, sucked and held states of the electronic components are successively recognized by their respective images in an order of placing the electronic components onto a circuit board, and the electronic components for which the recognition processing is completed can be successively placed onto the circuit board in this order during a process of the recognition processing.

Abstract: A connection structure of the present invention has a board with a through hole perforating therethrough, a land formed around the through hole, and a lead extending from an electronic component and disposed in the through hole. The land includes a wall surface land portion formed on a wall surface of the through hole, and front and back surface land portions formed on the front and back surfaces of the board respectively. A fillet connecting the land and the lead includes upper and lower fillet portions respectively contacting with the front and back surface land portions. A profile of the upper fillet portion is smaller than that of the lower fillet portion and is not smaller than that of the through hole. Therefore, occurrence of lift-off is effectively reduced while using a lead-free solder material.

Abstract: It is realized that a solder material is sufficiently supplied to a through hole formed through a board by a spraying mode flux applying method in a flow soldering process for mounting an electronic component onto the board by means of a solder material.

Abstract: There is provided a flow soldering process for mounting an electronic component onto a board by a solder material, which process is appropriate for using a lead-free solder material as the solder material.

Abstract: A cylindrical or sheet-like thermoplastic film is decompressed and used to cover a board to protect the board and components.

Abstract: There is provided a connecting material which can form a detachable connecting structure. According to the connecting material, the connecting portion between a certain object and other object can be more readily formed, and said certain object can be more readily detached from said other object after the formation of the connecting portion.

Abstract: There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process.

Abstract: A sub control panel for use in maintenance work has a control switch, enable switches and manipulation prohibition members. The sub control panel is configured such that the control switch is not activated unless the enable switches are being kept ON by one hand of the operator and the operator is prevented by the manipulation prohibition members from manipulating with the one hand from turning ON the enable switches. When the sub control panel is to be used, the operator must use both hands and is hindered from inserting both hands to a driven part of a machine to be subjected to maintenance work when the machine is operating.