Abstract: A method of manufacturing a semiconductor device includes the steps of preparing a substrate having a high-voltage applied region, a peripheral region, a cell region with at least first and second portions, the high-voltage applied region having a well formed therein; simultaneously forming a plurality of spaced floating gates on the first and second portions of the cell region and a plurality of spaced first gates on the high-voltage applied region; implanting first impurity ions in the high-voltage applied region of the substrate using the first gates as a mask to form a first impurity region, the floating gates masking the cell region from the first impurity ions; simultaneously forming control gates on the respective floating gates of the cell region and a plurality of spaced second gates on the peripheral region; selectively etching one of the control gates and one of the floating gates to form a plurality of gate patterns in the first portion of the cell region; and implanting second impurity ions in th

Abstract: A thin, stacked face-to-face integrated circuit packaging structure includes a chips attached to both major surfaces of a rigid interposer, and interconnected by printed wiring traces and vias to external solder ball contacts attached to the interposer.

Abstract: A method and apparatus for producing an integrated circuit package (30) comprising a substrate (70) having an opening (86) and first and second surfaces (92, 94), a plurality of routing strips (82) being integral with the substrate (70) and extending into the opening (86), a plurality of pads (100) disposed on the first and second surfaces (92, 94) are electrically connected with at least one of the routing strips (82), wire bonding (80) electrically connecting at least one bonding pad (120) to at least one of the routing strips (82) and a silicon chip (50) attached to the printed circuit board (70) by an adhesive material (60) that provide a seal between silicon chip (50) and printed circuit board (70) is disclosed.

Abstract: A memory device and a method for manufacturing the same is provided that reduces a resistance of the source region and reduces an effective cell size. The memory includes tunnel insulating films and floating gates formed stacked on a plurality of prescribed regions of a semiconductor substrate, a plurality of stacked gate insulating films, control gate lines and gate cap insulating films extend in a first direction with a zigzag pattern to cover the floating gates. Thus, the distance between adjacent control gate lines varies. Source regions are formed in the semiconductor substrate where a narrow space exists between the control gate lines stacked on the floating gates, and drain regions are formed in the semiconductor substrate where a wider space exists between the control gate lines stacked on the floating gates. Source contact regions are formed to expose the source regions, and a first conductive plate is coupled to the source regions. Bit line contact regions are formed to expose the drain regions.

Abstract: An integrated circuit package (30) comprising a substrate (70) having an opening (86) and first and second surfaces (92, 94), a plurality of routing strips (82) being integral with the substrate (70) and extending to opening (86), a plurality of pads (100) disposed on the first surface (92) and electrically connected with at least one of the routing strips (82), a chip (50) having bonding pads (120) is adhered to the second surface (84) of the substrate (70) and is of substantially the same outline as substrate (70), wire bonding (80) electrically connecting at least one bonding pad (120) to at least one of the routing strips (82) and potting material (90) filling the opening (86) is disclosed.

Abstract: A lead (10) for a semiconductor device (12) comprising a strip portion (14) comprising a first substantially horizontal portion (18) connected to the semiconductor device (12), a substantially vertical portion (20) connected to the first substantially horizontal portion (18), and a second substantially horizontal portion (22) connected to the substantially vertical portion (20) with at least one hole (16) disposed in the strip portion (14). A method of providing an electrical contact for connecting a semiconductor device (12) to a surface (24) comprising the steps of extending at least one lead (10) from the semiconductor device (12) and slotting the lead (10).

Abstract: An integrated circuit package (30) including a substrate (70) having an opening (86) and first and second surfaces(92, 94), a plurality of pads (100) disposed on the first and second surfaces (92, 94) having disposed thereon solder balls (150) electrically connected by a via (84) that provides the end-user with flexibility in the location of a power supply Pin (96) is disclosed.

Abstract: The invention is to an array of stacked devices utilizing vertical surface mounted semiconductor devices stacked side by side and inserting the stack of devices into a casing. The packaged stack of devices creates a cube package which is capable of replacing SIMM boards, and saves considerable space. The casing dissipates heat generated in the devices, and may be of metal or thermally conductive plastic.

Abstract: A lead (10) for a semiconductor device (12) comprising a strip portion (14) comprising a first substantially horizontal portion (18) connected to the semiconductor device (12), a substantially vertical portion (20) connected to the first substantially horizontal portion (18), and a second substantially horizontal portion (22) connected to the substantially vertical portion (20) with at least one hole (16) disposed in the strip portion (14). A method of providing an electrical contact for connecting a semiconductor device (12) to a surface (24) comprising the steps of extending at least one lead (10) from the semiconductor device (12) and slotting the lead (10).

Abstract: A bicycle warning signal control device including a light emitting control circuit mounted within a casing and installed in a mounting hole on the rear side of a saddle, the light emitting control circuit comprising a control IC connected to a DC power supply through a vibration switch and at least one lamp controlled by the control IC to give a flashing warning signal when the vibration switch is vibrated during the running of the bicycle.

Abstract: The container (2) consists of two individual cans united by an easy separated connecting ring (4) so that the subject container (2) provide to the consumer with more functions and more flexibilities and due to this special design derive a series combination drink packing system FIG. 6.1 to FIG. 6.4 and people can enjoy more and more different kind of drinks and flavors in a very convenance way just to separate the container and to mix them making a lot of drink choice and to carry this so called container to any where and any time to meet the consumer's need at this Space Age.

Abstract: The combination tire valve and pressure gauge of the present invention is formed to be substantially the same size as current tire valve stems, such that it may be used as a replacement part therefore. The device includes a pressure sensitive bellows disposed within the stem, the movement of which is counteracted by a calibrated spring. Movements of the bellows, caused by changes in the tire pressure, are mechanically translated to a rotary motion of a pressure indicator. A window is formed in the tire stem to permit viewing of the pressure indicator, whereby different numerals corresponding to different tire pressures become visible in the window upon rotation of the indicator which is caused by movement of the bellows. An air channel is formed through the device to permit air to be pumped into the tire. A rotary indicator having an internal spiral groove rotates upon a driving rod formed with projecting driving pin members that project into the spiral groove to cause the rotation of the indicator.

Abstract: An air valve for a baby bottle that fits in the side of the baby bottle. A valve is disposed interior of an air pressure-sensitive diaphragm to permit air to enter the bottle when liquid is removed.

Abstract: A tire valve having a pressure gauge disposed therewithin. The pressure gauge mechanism includes a bellows that is mechanically connected through worm gears to a rotary drum tire pressure indicator. A clear window formed through the valve permits viewing of pressure-indicating numerals on the drum.