Abstract: A gas filling docking tray having a carrier substrate includes a base surface, a plurality of guide blocks, a plurality of positioning pins, and at least one pair of nozzles. The guide blocks are at least disposed on two opposite sides of the base surface to define a wafer carrier accommodation area, and each guide block includes a vertical portion substantially perpendicular to the base surface and an inclined portion located above and connected with the vertical portion. A height of an apex of each positioning pin relative to the base surface is greater than a height of an apex of the vertical portion and less than a height of an apex of the inclined portion relative to the base surface.

Abstract: A semiconductor structure includes a conductive layer, an IMD layer and a plurality of protrusions. The IMD layer is formed on the conductive layer and has a first etch rate. Each protrusion includes an etching slowing layer, a lower electrode and a MTJ layer, wherein the etching slowing layer is formed on the IMD layer and has a second etch rate, the lower electrode passes through the IMD layer and the etching slowing layer, and the MTJ layer is formed on the lower electrode. The second etch rate is less than the first etch rate.

Abstract: A three-dimensional structure sensing system includes an image sensor that receives a reflected light from an object irradiated by an emitted light, the reflected light being converted into image data representing an image of the object; and a depth processing unit that generates depth data according to the image data. It is determined whether the depth data is affected by a reflective surface according to the image data and the depth data.

Abstract: An air conditioning system includes an indoor electronic expansion valve, and at least one liquid phase branch pipe. Each liquid phase branch pipe includes a first flow pipe and a second flow pipe. An end of the second flow pipe is communicated to an end of the first flow pipe, and another end of the second flow pipe is communicated to the indoor electronic expansion valve. The liquid phase branch pipe is configured to branch or converge a refrigerant flowing through the liquid phase branch pipe. The first flow pipe includes at least one mixing member, each mixing member has a plurality of first through holes, and the plurality of first through holes are used to communicate two ends of the first flow pipe.

Abstract: A power plug with thermal insulation-function has an output connector having a wire connecting end, an internal module, a housing, and an external module. The internal module has an outer surface and encloses the wire connecting end of the output connector. A plurality of recesses are concavely formed on the outer surface of the internal module. The housing encloses the outer surface of the internal module, wherein a plurality of gas cells are formed between the housing and each of the plurality of recesses. The external module encloses the housing and the internal module. Air can be stored in the gas cells for insulating thermal conduction from inside to outside. Heat can hardly transfer from the internal module to the external module to dissipate via the outer surface of the external module, thereby lowering the surface temperature of the external module to avoid burning the user.

Abstract: A heat dissipating structure of a power supply is disposed on an inner side of a casing and has two heat dissipating covers configured to be connected with each other, and a heat dissipating sleeve annularly mounted on and around the two heat dissipating covers and disposed between the heat dissipating covers and the casing. The heat dissipating sleeve is able to be bent according to an internal structure of the casing for attaching to the casing and increasing contact area between the heat dissipating sleeve and the casing. The heat from an interior of the power supply can be conducted to the two heat dissipating covers for a first heat spreading and then to the heat dissipating sleeve for a second heat spreading. Thus, speed of heat dissipation to an exterior of the casing can be increased and temperature inside the power supply can be effectively reduced.

Abstract: A connector outer housing is provided, which comprises a first opening at a tail end and a second opening at a connection end, the first opening is for wire entrance and the second opening is to form a connection relationship with a mating connector outer housing, wherein a elastic lock arm is provided on an operating surface of the connector outer housing and comprises a locking segment proximate to the connection end and an unlocking segment away from the connection end, the elastic lock arm is positioned on the connector outer housing by means of a support structure and can be elastically deformed to raise the locking segment under an external force applied to the unlocking segment, wherein the support structure is connected to the elastic lock arm through a plurality of connection portions.

Abstract: The light emitting diode packaging structure includes a flexible substrate, micro light emitting elements disposed on the flexible substrate, a conductive pad, a redistribution layer, and an electrode pad. The micro light emitting elements have a first surface facing to the flexible substrate and a second surface opposite to the first surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting elements. The redistribution layer covers the micro light emitting elements and the conductive pad. The redistribution layer includes an insulating layer and a circuit layer embedded in the insulating layer. The circuit layer is electrically connected to the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer.

Abstract: A gas filling docking tray having a carrier substrate includes a base surface, a plurality of guide blocks, a plurality of positioning pins, and at least one pair of nozzles. The guide blocks are at least disposed on two opposite sides of the base surface to define a wafer carrier accommodation area, and each guide block includes a vertical portion substantially perpendicular to the base surface and an inclined portion located above and connected with the vertical portion. A height of an apex of each positioning pin relative to the base surface is greater than a height of an apex of the vertical portion and less than a height of an apex of the inclined portion relative to the base surface.

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.

Abstract: The disclosure provides an electronic device including a housing, a light-emitting element and a light diffusion structure. The housing includes a first light-transmitting hole and a second light-transmitting hole. The light-emitting element is disposed in the housing, and is aligned with the first light-transmitting hole. The light diffusion structure includes a first light diffusion layer and a second light diffusion layer. The first light diffusion layer is disposed between the housing and the light-emitting element, and comprises a first semi-transparent region and a first light-shielding region. The first semi-transparent region corresponds to the first light-transmitting hole, and the first light-shielding region surrounds the first semi-transparent region. The second light diffusion layer is disposed between the housing and the light-emitting element, and comprises a second semi-transparent region and a second light-shielding region.

Abstract: A method for manufacturing a light emitting diode packaging structure includes the operations below. A flexible substrate having a first surface and a second surface is provided. A carrier substrate is formed on the first surface. An adhesive layer is formed on the second surface. A micro light emitting element is formed on the adhesive layer. The micro light emitting element has a conductive pad thereon opposite to the adhesive layer. A redistribution layer is formed and covers the micro light emitting element and the adhesive layer, wherein the redistribution layer includes a circuit layer electrically connecting to the conductive pad and an insulating layer covering the circuit layer. An electrode pad is formed on the redistribution layer and electrically connected to the circuit layer, wherein a total thickness of the flexible substrate, the adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

Abstract: Embodiments provide a micro light-emitting diode package structure and a method for forming the same. The micro light-emitting diode package structure includes a redistribution layer, a control device, micro light-emitting diodes, and a flexible material layer. The control device and the micro light-emitting diodes are disposed on and electrically connected to the redistribution layer. The flexible material layer covers the control device and the micro light-emitting diodes, wherein the micro light-emitting diodes are in contact with the flexible material layer.

Abstract: A package structure, a display device, and manufacturing methods thereof are provided. A package structure includes a conductive element, a first dielectric layer, a redistribution layer, a second dielectric layer, a light-shielding layer, a conductive layer, and a light-emitting diode unit. The first dielectric layer is disposed on the conductive element. The redistribution layer is disposed on the first dielectric layer. The redistribution layer is electrically connected to the conductive element. The second dielectric layer is disposed on the first dielectric layer. The light-shielding layer is disposed on the second dielectric layer. The conductive layer is disposed on the redistribution layer and includes a first conductive portion with a light reflectivity of less than 30%. The light-emitting diode unit is disposed on the conductive layer.

Abstract: A pixel unit includes a substrate, a wiring layer and three light-emitting elements. The wiring layer includes first electrode wires and second electrode wires. The first electrode wires and the second electrode wires are arranged side by side and separated from each other by a spacing. A first blocking wall structure is at a first end portion of each of the first electrode wires, the first end portion is near the corresponding second electrode wires, and a second blocking wall structure is at a second end portion of each of the second electrode wires, the second end portion is near the corresponding first electrode wires. Three light-emitting elements emit red light, green light and blue light respectively. The light-emitting elements are in a flip chip configuration and are connected to one of the first electrode wires and one of the second electrode wires adjacent to each other respectively.

Abstract: A purge controlling system includes a purge module and a control module. The purge module is arranged in the load port and is electrically connected with the control module. The purge module includes an air curtain unit, a flow control unit and a sensing unit. The control module controls the purge module to provide adequate gas flow of purge gas into the air curtain unit and form a gas curtain according to the displacement value of the door assembly.

Abstract: The invention relates to antibody fusion proteins. Particularly, the invention relates to antibody fusion proteins for intra-cellular and intra-nucleus drugs delivery. The fusion protein of the invention can be used as a peptide penetration system that specifically binds to various targets for the delivery of effector peptides across a biological barrier.

Abstract: A method for manufacturing a light emitting diode packaging structure includes the operations below. A flexible substrate having a first surface and a second surface is provided. A carrier substrate is formed on the first surface. An adhesive layer is formed on the second surface. A micro light emitting element is formed on the adhesive layer. The micro light emitting element has a conductive pad thereon opposite to the adhesive layer. A redistribution layer is formed and covers the micro light emitting element and the adhesive layer, wherein the redistribution layer includes a circuit layer electrically connecting to the conductive pad and an insulating layer covering the circuit layer. An electrode pad is formed on the redistribution layer and electrically connected to the circuit layer, wherein a total thickness of the flexible substrate, the adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.

Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, a micro light emitting element, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting element is disposed on the first adhesive layer. The micro light emitting element has a first surface facing to the first adhesive layer and a second surface opposite to the first surface. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting element and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A total thickness of the flexible substrate, the first adhesive layer, the redistribution layer, and the electrode pad is less than 200 um.