Abstract: A head-mounted display includes a casing, a first display panel, a second display panel, a third display panel, a projection optical engine, a first thermally conductive material layer, a control module, and an imaging lens. The first display panel, the second display panel, the third display panel, and the control module are disposed in the casing. The imaging lens is disposed on the casing. The first display panel, the second display panel, and the third display panel are configured to emit image beam respectively. The control module is electrically connected to the first display panel, the second display panel, and the third display panel to adjust light intensity of the image beam respectively according to a brightness value of ambient light to adjust a surface temperature of the casing. A light intensity adjustment method of the head-mounted display is further disclosed.

Abstract: The disclosure provides a wearable display device, including a bracket body, a bearing frame, a display module, and a transparent heat dissipation sheet. The bearing frame is connected to the bracket body and has an accommodation space. The display module is disposed in the accommodation space and has a first surface and a second surface that are opposite each other. The display module is suitable for projecting an image beam, and the image beam is projected out of the display module from one of the first surface and the second surface. The transparent heat dissipation sheet is disposed on at least one of the first surface and the second surface.

Abstract: An adjustment method of a wearable display device includes steps of providing a display light beam to a light transmitting element to form an image, sensing an intensity of an ambient light to obtain a light intensity signal, and adjusting a brightness of the display light beam and/or a transmittance of the light transmitting element according to the light intensity signal. The adjustment method maintains good display effect of the wearable display device and improve user experience.

Abstract: A die stack structure including a first semiconductor die, a second semiconductor die, an insulating encapsulation and a redistribution circuit structure is provided. The first semiconductor die includes a first semiconductor substrate including a first portion and a second portion, a first interconnect structure and a first bonding structure. The first interconnect structure is disposed on a top surface of the second portion, a lateral dimension of the first portion is greater than a lateral dimension of the top surface of the second portion. The second semiconductor die is disposed on the first semiconductor die and includes a second bonding structure, the second semiconductor die is electrically connected with the first semiconductor die through the first and second bonding structures. The insulating encapsulation is disposed on the first portion and laterally encapsulating the second portion and the second semiconductor die.

Abstract: A semiconductor device and a method of fabricating the semiconductor device are disclosed. The semiconductor device includes a substrate, a semiconductor layer disposed on the substrate, a source/drain region disposed adjacent to the semiconductor layer, a gate structure disposed on the semiconductor layer, an interfacial spacer layer having a triangular cross-sectional profile disposed along sidewall of the gate structure, and a gate spacer. The gate spacer includes a first spacer portion having a first bottom surface with a substantially linear profile disposed on the semiconductor layer and a second spacer portion having a second bottom surface with a sloped profile disposed on the interfacial spacer layer.

Abstract: A control assembly configured for an electronic device, the control assembly includes a mount seat configured to be installed on the electronic device, two first connection components movably connected to the mount seat, two second connection component movably connected to the two first connection components, respectively, two controllers configured to communicate with the electronic device, the two controllers are separated apart from each other and movably connected to the second connection components, respectively, such that the two controllers are connected to the mount seat via the two second connection components and the two first connection components.

Abstract: A head-mounted display apparatus including a casing, an optical engine module, an imaging module, a heat sink, a denoiser, a sensing module, and a control module. The casing includes a body part, from which extends a supporting part. The optical engine and imaging modules are disposed in the body part. An image projected by the optical engine module is displayed on the imaging module. The heat sink is disposed alongside the optical engine module. The sensing module is disposed in the supporting part to detect audio or/and vibration signals generated by the heat sink. The control module is electrically connected to the heat sink, denoiser and sensing module. The control module receives the audio or/and vibration signals detected by the sensing module and controls the denoiser to generate a reverse shock wave to eliminate the audio or/and vibration signals generated by the heat sink.

Abstract: An electronic device is provided. The electronic device includes a panel, a protective substrate, and a first light-shielding structure. The panel has an active area and a peripheral area. The peripheral area is adjacent to the active area. The protective substrate is disposed opposite to the panel. The first light-shielding structure is disposed on a surface of the protective substrate and corresponds to the peripheral area. A portion of the first light-shielding structure that overlaps the peripheral area has at least one opening.

Abstract: A game controller is provided. The game controller includes a first handle body, a second handle body, a first support module, and a second support module. The first support module includes a first support groove, a first clamping member, and a second clamping member. The first clamping member and the second clamping member are disposed at two sides of the first support module. The second support module includes a second support groove, a third clamping member, and a fourth clamping member. The third clamping member and the fourth clamping member are disposed at two sides of the second support module. A mobile device is disposed between the first support module, the first clamping member and the second clamping member of the first support module, the second support module, and the third clamping member and the fourth clamping member of the second support module.

Abstract: An integrated circuit package and the method of forming the same are provided. The integrated circuit package may include a first die, a first gap-fill layer along sidewalls of the first die, a first bonding layer on the first die and the first gap-fill layer, and a first die connector in the first bonding layer. The first die connector may be directly over an interface between the first die and the first gap-fill layer.

Abstract: A heat dissipation module includes an airflow generator, a heat dissipation substrate connected to a heat source, a heat dissipation member, a baffle, and a heat conductive member connected to the heat dissipation substrate. The heat dissipation member includes a main body and first fins arranged around an outer periphery of the main body and forming an accommodation space with the main body. The airflow generator has a rotation axis, and is accommodated in the accommodation space and connected to the main body. The baffle is connected to the first fins and has an opening corresponded to an air inlet surface of the airflow generator. On a reference plane perpendicular to the rotation axis, at least a part of an orthographic projection of each first fin does not overlap an orthographic projection of the airflow generator, and an orthographic projection of the baffle overlaps the orthographic projections of the first fins.

Abstract: A head-mounted display, which includes a case body, a heat source, and a thermally conductive material layer. The heat source and the thermally conductive material layer are disposed in the case body. The heat source is connected to the case body through the thermally conductive material layer. The case body has a first surface connected to the thermally conductive material layer and an opposite second surface. The thermally conductive material layer has a third surface connected to the heat source and an opposite fourth surface. A first distance is greater than a second distance, in which the first distance is a distance from the third surface adjacent to the heat source toward the second surface, and the second distance is a distance from the third surface away from the heat source toward the second surface. In this way, the internal heat of the head-mounted display can be uniformly distributed.

Abstract: The disclosure provides a projection apparatus, which includes a casing, a projection module, at least one airflow generating unit, and at least one speaker. The casing has at least one air outlet. The projection module is disposed in the casing and configured to project an image beam outside the casing. The airflow generating unit is disposed in the casing and configured to generate airflow. The speaker is disposed in the casing, and the airflow generating unit is located between the projection module and the speaker. The speaker has at least one flow guiding surface, and the flow guiding surface is inclined toward the air outlet to guide the airflow toward the air outlet. The projection apparatus has a favorable heat dissipation capability and may reduce the noise generated by the airflow generating unit.

Abstract: A wearable projection device includes a body, an optical engine module, a heat-dissipation component, and a control module. The body has an air inlet, and a containing space connected to the air inlet. The optical engine module is disposed in the containing space. The heat-dissipation component disposed in the containing space is configured to dissipate heat from the optical engine module. The heat-dissipation component includes a vapor chamber and an airflow generator. The vapor chamber is connected to the optical engine module. The airflow generator is positioned on the vapor chamber, and the airflow generator includes a piezoelectric thin film. The control module is disposed on the body, electrically connected to the optical engine module and the airflow generator, and configured to drive the piezoelectric thin film to vibrate, so that an external cooling airflow enters the containing space through the air inlet to cool the vapor chamber.

Abstract: A semiconductor device and methods of manufacture are discussed herein. A device includes a first semiconductor package including a first semiconductor die encapsulated in an insulating material, a first thermal expansion resistant layer over the first semiconductor die, a bonding layer over the first thermal expansion resistant layer and the insulating material, and a second semiconductor die directly bonded to the bonding layer.

Abstract: A game controller configured for a mobile device. The game controller includes a connection mechanism, two control handles, and at least one first pad. The control handles are respectively coupled to two opposite sides of the connection mechanism. Each of the two control handles has an accommodation recess, and the two accommodation recesses of the two control handles are configured to accommodate the mobile device. The first pad is removably disposed on one of the two control handles and located in the accommodation recess of the one of the two control handles, and the at least one first pad is configured to be located between and clamped by the mobile device and the one of the two control handles.

Abstract: Embodiments include methods of forming three-dimensional packages and the packages resulting therefrom. The packages may utilize a bridge die to electrically connect one die to another die and at least one additional die adjacent to the bridge die. The height-to-width ratio of the gap between the bridge die and the at least one additional die is controlled by thinning the bridge die to be thinner than the at least one additional die. The packages may utilize landing structures to adjoin a dielectric material of an attached die to a metallic landing structure of a base die.

Abstract: Embodiments include a method and device resulting from the method, including using a radical oxidation process to oxidize a spacer layer which lines the opening after removing a dummy gate electrode. The oxidized layer is removed by an etching process. An STI region disposed below the dummy gate electrode may be partially etched.

Abstract: A die stack structure including a first semiconductor die, a second semiconductor die, an insulating encapsulation and a redistribution circuit structure is provided. The first semiconductor die includes a first semiconductor substrate including a first portion and a second portion, a first interconnect structure and a first bonding structure. The first interconnect structure is disposed on a top surface of the second portion, a lateral dimension of the first portion is greater than a lateral dimension of the top surface of the second portion. The second semiconductor die is disposed on the first semiconductor die and includes a second bonding structure, the second semiconductor die is electrically connected with the first semiconductor die through the first and second bonding structures. The insulating encapsulation is disposed on the first portion and laterally encapsulating the second portion and the second semiconductor die.

Abstract: A projection device includes a light source module, an optical engine module, a projection lens, a housing, and at least one first heat dissipating element. The housing comprises a first end and a second end opposite to each other. The at least one first heat dissipating element is disposed in the housing, and each of the at least one first heat dissipating element includes a first plate portion, a second plate portion, and a first fin portion. The first plate portion is connected to the light source module. The second plate portion is connected to the first plate portion. The first fin portion is connected to the second plate portion and includes a plurality of first fins arranged at intervals. These first fins are arranged between the first end and the second end.