Abstract: An illumination system including an excitation light source, a wavelength conversion element and a filter element is provided. The excitation light source is used for emitting an excitation beam. The wavelength conversion element has a wavelength conversion region. When the wavelength conversion region is cut into a transmission path of the excitation beam, the wavelength conversion region is excited by the excitation beam and emits a converted beam. A reference plane is perpendicular to the transmission path of the converted beam and is angled such that an acute angle is formed between the reference plane and the filter wheel which is disposed on a transmission path of the converted beam coming from the wavelength conversion element. The filter element allows a part of the converted beam to penetrate so as to output at least one color beam, and reflects another part of the converted beam.

Abstract: This application is directed to a display assistant device that acts as a voice-activated user interface device. The display assistant device includes a base, a screen and a speaker. The base is configured for sitting on a surface. The screen has a rear surface and is supported by the base at the rear surface. A bottom edge of the screen is configured to be held above the surface by a predefined height, and the base is substantially hidden behind the screen from a front view of the display assistant device. The speaker is concealed inside the base and configured to project sound substantially towards the front view of the display assistant device.

Abstract: In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.

Abstract: A light source module includes a light source having an optical axis, a fan for providing a cooling airflow and a deflector disposed between the light source and the fan and directing a flowing direction of the cooling airflow. The deflector includes a first air duct connected between a first side of the light source and an air outlet of the fan, a second air duct connected between a second side of the light source and the air outlet of the fan, and a first airflow control assembly controlling the first air duct in a communicating state or a non-communicating state and having a first control shaft and a first airflow passing portion rotating about the first control shaft. The first control shaft is inclined to the optical axis so that a first angle is formed therebetween. The first angle is between 0 and 90 degrees.

Abstract: Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive element and a first protective layer surrounding the semiconductor die. The chip package also includes a second protective layer over the semiconductor die and the first protective layer. The chip package further includes an antenna element over the second protective layer. The antenna element is electrically connected to the conductive element of the semiconductor die.

Abstract: In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a circuit region, a seal ring region and an assembly isolation region. The circuit region includes a first conductive layer. The seal ring region includes a second conductive layer. The assembly isolation region is between the circuit region and the seal ring region. The first conductive layer and the second conductive layer respectively include a portion extending into the assembly isolation region thereby forming an electric component in the assembly isolation region.

Abstract: An illumination system including an excitation light source, a wavelength conversion element and a filter element is provided. The excitation light source is used for emitting an excitation beam. The wavelength conversion element has a wavelength conversion region. When the wavelength conversion region is cut into a transmission path of the excitation beam, the wavelength conversion region is excited by the excitation beam and emits a converted beam. A reference plane is perpendicular to the transmission path of the converted beam and is angled such that an acute angle is formed between the reference plane and the filter wheel which is disposed on a transmission path of the converted beam coming from the wavelength conversion element. The filter element allows a part of the converted beam to penetrate so as to output at least one color beam, and reflects another part of the converted beam.

Abstract: Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die having a conductive element and a first protective layer surrounding the semiconductor die. The chip package also includes a second protective layer over the semiconductor die and the first protective layer. The chip package further includes an antenna element over the second protective layer. The antenna element is electrically connected to the conductive element of the semiconductor die.

Abstract: A range hood includes a housing, a cover, an exhaust pipe and at least two vacuum fans. The housing has a top and bottom openings opposite to each other. The cover is disposed in the housing and adjacent to the bottom opening. The cover has an air inlet facing the bottom opening. The exhaust pipe is disposed in the housing and located between the top opening and the cover. The exhaust pipe has an air outlet adjacent to the top opening and communicates with the cover. The vacuum fans are disposed in the cover and located between the air inlet and the exhaust pipe. Each vacuum fan has an air flow inlet adjacent to the air inlet and an air flow outlet adjacent to the air outlet. An area of the air inlet is greater than or equal to an area of the air flow inlets.

Abstract: In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.

Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes a circuit region, a seal ring region and an assembly isolation region. The circuit region includes a first conductive layer. The seal ring region includes a second conductive layer. The assembly isolation region is between the circuit region and the seal ring region. The first conductive layer and the second conductive layer respectively include a portion extending into the assembly isolation region thereby forming an electric component in the assembly isolation region.

Abstract: The fastener container in the present invention includes a lid and a receptacle base as main components combined together. Said lid has a first section and a second section which are connected by a hinge. This invention used the first prominent portion with flexible cushioning effect and the pressing member of the first prominent portion of the first section, and the blocking member and the third recess of the second prominent portion of the second section to reduce the wear and tear between the pressing member and the blocking member, it also can prevent the pressing member from squeezing the blocking member for a long time to result in a problem that the pressing member and the blocking member are deformed and the first section can not be held in the open position, so that the service life of the lid can be extended and the user can easily open or close the first section of the lid to take or place screws or other items.

Abstract: In accordance with some embodiments, a package structure includes an RFIC chip. an insulating encapsulation, a redistribution circuit structure, an antenna and a microwave director. The insulating encapsulation encapsulates the RFIC chip. The redistribution circuit structure is disposed on the insulating encapsulation and electrically connected to the RFIC chip. The antenna is disposed on the insulating encapsulation and electrically connected to the RFIC chip through the redistribution circuit structure. The antenna is located between the microwave director and the RFIC chip. The microwave director has a microwave directivity enhancement surface located at a propagating path of a microwave received or generated by the antenna.

Abstract: A light source module includes a light source having an optical axis, a fan for providing a cooling airflow and a deflector disposed between the light source and the fan and directing a flowing direction of the cooling airflow. The deflector includes a first air duct connected between a first side of the light source and an air outlet of the fan, a second air duct connected between a second side of the light source and the air outlet of the fan, and a first airflow control assembly controlling the first air duct in a communicating state or a non-communicating state and having a first control shaft and a first airflow passing portion rotating about the first control shaft. The first control shaft is inclined to the optical axis so that a first angle is formed therebetween. The first angle is between 0 and 90 degrees.