Patents by Inventor Min-Chul Park

Min-Chul Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967503
    Abstract: Provided are a method of depositing a thin film and a method of manufacturing a semiconductor device using the same, and the method of depositing a thin film uses a substrate processing apparatus including a chamber, a substrate support on which a substrate is mounted, a gas supply unit, and a power supply unit that supplies high-frequency and low-frequency power to the chamber, and includes: a step of mounting, on the substrate support, the substrate including a lower thin film deposited under the condition of a process temperature in a low temperature range; a step of depositing an upper thin film on the lower thin film under the condition of the process temperature in the low temperature range; and a step of treating a surface of the upper thin film under the condition of the process temperature in the low temperature range.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: April 23, 2024
    Assignee: WONIK IPS CO., LTD.
    Inventors: Su In Kim, Young Chul Choi, Chang Hak Shin, Min Woo Park, Ji Hyun Kim, Kyung Mi Kim
  • Patent number: 11958546
    Abstract: The present disclosure relates to a steering control device and a steering assist system including same. Particularly, a steering control device according to the present disclosure comprises an input-side steering control device which includes: a first controller connected to an output-side steering control device via at least one first communication bus; and a second controller connected to the output-side steering control device via at least one second communication bus and connected to the first controller via at least one third communication bus.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: April 16, 2024
    Assignee: HL MANDO CORPORATION
    Inventors: Min Woo Jeong, Sun Hong Park, Hyun Chul Tae
  • Publication number: 20240121924
    Abstract: A water-cooled heat dissipation module assembly capable of cooling a power module of a vehicle driving inverter system using a battery or fuel cell. The water-cooled heat dissipation module assembly includes a housing unit provided in the form of a housing having an opening portion at least partially opened at one side thereof. The housing unit and at least a part of a rim region of the cooling unit are made of a plastic material, and the housing unit and the cooling unit are joined to each other by plastic welding using a laser.
    Type: Application
    Filed: August 4, 2022
    Publication date: April 11, 2024
    Inventors: Kwan Ho RYU, Jeong Keun LEE, Min Woo LEE, Ju Hyun SUN, Tae Keun PARK, Kang Wook PARK, Lee Cheol JI, Hyeok Chul YANG, Tae Heon KIM, Keun Jae LEE
  • Patent number: 11957034
    Abstract: A display apparatus includes a base substrate including a display region and a peripheral region that is a non-display region surrounding the display region, a plurality of data lines disposed in the display region on the base substrate and extending to the peripheral region, a bypass data line disposed in the display region and the peripheral region on the base substrate and electrically connected to at least one of the data lines, and a dummy pattern spaced apart from the bypass data line and disposed on a same layer as the bypass data line.
    Type: Grant
    Filed: September 24, 2019
    Date of Patent: April 9, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Min-Jae Jeong, Jae-Yong Jang, Gyung-Soon Park, Kyung-Hoon Chung, Chong-Chul Chai
  • Publication number: 20240100123
    Abstract: The present invention relates to novel fragments of AIMP1 protein and a composition for improving alopecia and promoting hair growth comprising the same, more specifically it relates to a polypeptide consisting of 4 to 21 consecutive amino acids from the amino acid sequence of SEQ ID NO: 1, wherein the polypeptide comprises the 28th to 31st amino acid residue (KEKA) of amino acid sequence of SEQ ID NO: 1, or a polypeptide consisting of an amino acid sequence having 70% or more sequence homology with the polypeptide; a polynucleotide encoding the polypeptide; a pharmaceutical, cosmetic and food composition for improving alopecia and promoting hair growth comprising the polypeptide.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 28, 2024
    Applicant: CUREBIO THERAPEUTICS
    Inventors: Sunghoon KIM, Min Chul PARK, Younha KIM
  • Patent number: 11932618
    Abstract: Disclosed are novel compounds of Chemical Formula 1, optical isomers of the compounds, and pharmaceutically acceptable salts of the compounds or the optical isomers. The compounds, isomers, and salts exhibit excellent activity as GLP-1 receptor agonists. In particular, they, as GLP-1 receptor agonists, exhibit excellent glucose tolerance, thus having a great potential to be used as therapeutic agents for metabolic diseases. Moreover, they exhibit excellent pharmacological safety for cardiovascular systems.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: March 19, 2024
    Assignee: ILDONG PHARMACEUTICAL CO., LTD.
    Inventors: Hong Chul Yoon, Kyung Mi An, Myong Jae Lee, Jin Hee Lee, Jeong-geun Kim, A-rang Im, Woo Jin Jeon, Jin Ah Jeong, Jaeho Heo, Changhee Hong, Kyeojin Kim, Jung-Eun Park, Te-ik Sohn, Changmok Oh, Da Hae Hong, Sung Wook Kwon, Jung Ho Kim, Jae Eui Shin, Yeongran Yoo, Min Whan Chang, Eun Hye Jang, In-gyu Je, Ji Hye Choi, Gunhee Kim, Yearin Jun
  • Publication number: 20240085282
    Abstract: There is provide a method for manufacturing analytical semiconductor samples by using an apparatus for manufacturing analytical semiconductor samples, which minimizes a feedback time by manufacturing a viewing surface that is environment-friendly and has a large area. The method comprising mounting the analytical semiconductor samples to a holder; discharging deionized (DI) water to an upper surface of a polishing plate through a DI water nozzle; grinding the analytical semiconductor samples with the upper surface of the polishing plat; determining whether a desired viewing surface of the analytical semiconductor samples has been acquired after the grinding of the analytical semiconductor samples; and transferring the analytical semiconductor samples to analyze the viewing surface of the ground analytical semiconductor samples based on a determination that the desired viewing surface of the analytical semiconductor samples has been acquired.
    Type: Application
    Filed: August 23, 2023
    Publication date: March 14, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Min Chul JO, Sang Hyun PARK, Su Jin SHIN, Gil Ho GU, Dae Gon YU, So Yeon LEE, Yun Bin JEONG
  • Publication number: 20240072428
    Abstract: The present disclosure in at least one embodiment provides a wireless communication device, comprising a lower case, an upper radome, coupled to the lower case, creating a storage space between the lower case and the upper radome, an antenna disposed in the storage space, and a plurality of internal substrates, disposed between the antenna and the lower case in the storage space, of which one of the plurality of internal substrates is connected to the antenna, wherein each internal substrate of the plurality of internal substrates is disposed along a first direction parallel to a surface of the lower case facing the plurality of internal substrates.
    Type: Application
    Filed: November 7, 2023
    Publication date: February 29, 2024
    Applicant: KMW INC.
    Inventors: Min Sik PARK, Jun Woo YANG, Bung Chul KIM, In Ho KIM
  • Patent number: 11912895
    Abstract: The present invention relates to a fire resistant paint composition, to a production method for same and to a painting method for a fire resistant paint using same, and, one example of implementation of the present invention can provide a fire resistant paint composition comprising: between 70 and 95 wt. % of a binder; between 1 and 10 wt. % of an aerogel; between 1 and 5 wt. % of a foaming agent; and the remainder of water, and can provide a production method for same and a painting method for a fire resistant paint using same.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: February 27, 2024
    Assignee: AEROGEL R&D PTE. LTD.
    Inventors: Myung Je Roh, Young Chul Joung, Jong Chul Park, Min Woo Kim, Choon Soo Hahn, Dong Ho Jung, Do Young Park
  • Patent number: 11886783
    Abstract: Provided is a simulation method performed by a process simulator, implemented with a recurrent neural network (RNN) including a plurality of process emulation cells, which are arranged in time series and configured to train and predict, based on a final target profile, a profile of each process step included in a semiconductor manufacturing process. The simulation method includes: receiving, at a first process emulation cell, a previous output profile provided at a previous process step, a target profile and process condition information of a current process step; and generating, at the first process emulation cell, a current output profile corresponding to the current process step, based on the target profile, the process condition information, and prior knowledge information, the prior knowledge information defining a time series causal relationship between the previous process step and the current process step.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: January 30, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sanghoon Myung, Hyunjae Jang, In Huh, Hyeon Kyun Noh, Min-Chul Park, Changwook Jeong
  • Patent number: 11872263
    Abstract: The present invention relates to novel fragments of AIMP1 protein and a composition for improving alopecia and promoting hair growth comprising the same, more specifically it relates to a polypeptide consisting of 4 to 21 consecutive amino acids from the amino acid sequence of SEQ ID NO: 1, wherein the polypeptide comprises the 28th to 31st amino acid residue (KEKA) of amino acid sequence of SEQ ID NO: 1, or a polypeptide consisting of an amino acid sequence having 70% or more sequence homology with the polypeptide; a polynucleotide encoding the polypeptide; a pharmaceutical, cosmetic and food composition for improving alopecia and promoting hair growth comprising the polypeptide.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: January 16, 2024
    Assignee: CUREBIO THERAPEUTICS
    Inventors: Sunghoon Kim, Min Chul Park, Younha Kim
  • Publication number: 20230416340
    Abstract: Protein substrates are provided comprising integrin binding motif and growth factor (GF) binding peptide motif that enable binding to and activation of both a growth factor receptor and an integrin, simultaneously or selectively. The substrate proteins may be in the form of a mussel adhesive protein where extracellular matrix (ECM) protein derived integrin binding peptide motifs and GF binding peptide motifs are recombinantly incorporated into the mussel adhesive protein. Also provided are use of the protein substrate for regulating cellular behavior including cell adhesion, migration, or proliferation which are essential process in bioprocess, wound healing, tissue engineering, and therapeutic application. In other embodiments, the present invention provides a method and composition of stabilizing and protecting a growth factor from protease digestion or internalization into cells (or cellular uptake) in order to maintain the persistent and durable function of growth factors.
    Type: Application
    Filed: December 16, 2021
    Publication date: December 28, 2023
    Applicant: TME THERAPEUTICS CO., LTD.
    Inventors: Sang Jae LEE, Bong Jin HONG, Min Chul PARK
  • Publication number: 20230298154
    Abstract: A method for analyzing a wafer map using a wafer map analyzer includes generating first wafer maps each displaying characteristics of a first wafer for a corresponding channel of a plurality of channels. The first wafer maps are auto-encoded together to extract a first feature. The method also includes determining whether the first feature is a valid pattern, classifying the type of the first feature based on unsupervised learning when the first feature is a valid pattern and extracting a representative image of features classified into the same type as the first feature.
    Type: Application
    Filed: May 25, 2023
    Publication date: September 21, 2023
    Inventors: MIN CHUL PARK, JEONG HOON KO, JI YONG PARK, JE HYUN LEE, DAE SIN KIM
  • Patent number: 11741596
    Abstract: A semiconductor wafer fault analysis system includes: a database to store a first reference map, which is classified as a first fault type, and a second reference map, which is classified as a second fault type; a first auto-encoder/decoder to remove a noise corresponding to the first fault type from the first reference map to generate a first pre-processed reference map; a second auto-encoder/decoder to remove a noise corresponding to the second fault type from the second reference map to generate a second pre-processed reference map; and a fault type analyzer. The database is updated based on the first and second pre-processed reference maps, and the fault type analyzer is to classify a fault type of a target map based on the updated database. The target map is generated by measuring a target wafer.
    Type: Grant
    Filed: October 11, 2019
    Date of Patent: August 29, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min-Chul Park, Ami Ma, Jisu Ryu, Changwook Jeong
  • Publication number: 20230242584
    Abstract: The present invention relates to novel polypeptides having a skin whitening activity and use thereof. More particularly, the present invention relates to an isolated polypeptide consisting (essentially) of any one amino acid sequence selected from the group consisting of SEQ ID NO: 1, SEQ ID NO: 3, SEQ ID NO: 5, and SEQ ID NO: 7, a skin whitening cosmetic composition comprising the polypeptide as an active ingredient, or a pharmaceutical composition for preventing or treating a pigmentation disease.
    Type: Application
    Filed: January 23, 2020
    Publication date: August 3, 2023
    Applicant: Metapore Co.., Ltd
    Inventors: Min Chul PARK, Ji Na KIM, Su Jin KANG
  • Patent number: 11688050
    Abstract: A method for analyzing a wafer map using a wafer map analyzer includes generating first wafer maps each displaying characteristics of a first wafer for a corresponding channel of a plurality of channels. The first wafer maps are auto-encoded together to extract a first feature. The method also includes determining whether the first feature is a valid pattern, classifying the type of the first feature based on unsupervised learning when the first feature is a valid pattern and extracting a representative image of features classified into the same type as the first feature.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: June 27, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min Chul Park, Jeong Hoon Ko, Ji Yong Park, Je Hyun Lee, Dae Sin Kim
  • Publication number: 20230142367
    Abstract: Provided is a simulation method performed by a process simulator, implemented with a recurrent neural network (RNN) including a plurality of process emulation cells, which are arranged in time series and configured to train and predict, based on a final target profile, a profile of each process step included in a semiconductor manufacturing process. The simulation method includes: receiving, at a first process emulation cell, a previous output profile provided at a previous process step, a target profile and process condition information of a current process step; and generating, at the first process emulation cell, a current output profile corresponding to the current process step, based on the target profile, the process condition information, and prior knowledge information, the prior knowledge information defining a time series causal relationship between the previous process step and the current process step.
    Type: Application
    Filed: January 12, 2023
    Publication date: May 11, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sanghoon MYUNG, Hyunjae Jang, In Huh, Hyeon Kyun Noh, Min-Chul Park, Changwook Jeong
  • Patent number: 11578106
    Abstract: Provided are a surfactant adhesive protein comprising an amphiphilic peptide, as a surfactant adhesive protein, at the carbon or amine terminal, a silicone oil and an anticancer composition comprising the surfactant adhesive, where the surfactant adhesive enables homogeneous dispersion of hydrophilic or hydrophobic particles in a hydrophobic or hydrophilic solvent on the basis of strong adhesive strength of the mussel adhesive protein, and the surface adhesive can be favorably used as a surface coating agent requiring antibacterial or antiviral functions as well as a cosmetic product or an ink.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: February 14, 2023
    Assignee: TME THERAPEUTICS CO., LTD.
    Inventors: Sang Jae Lee, Bong Jin Hong, Min Chul Park
  • Patent number: 11574095
    Abstract: Provided is a simulation method performed by a process simulator, implemented with a recurrent neural network (RNN) including a plurality of process emulation cells, which are arranged in time series and configured to train and predict, based on a final target profile, a profile of each process step included in a semiconductor manufacturing process. The simulation method includes: receiving, at a first process emulation cell, a previous output profile provided at a previous process step, a target profile and process condition information of a current process step; and generating, at the first process emulation cell, a current output profile corresponding to the current process step, based on the target profile, the process condition information, and prior knowledge information, the prior knowledge information defining a time series causal relationship between the previous process step and the current process step.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: February 7, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sanghoon Myung, Hyunjae Jang, In Huh, Hyeon Kyun Noh, Min-Chul Park, Changwook Jeong
  • Patent number: 11507801
    Abstract: A method for detecting defects in a semiconductor device includes pre-training a pre-trained convolutional neural network (CNN) model using a sampled clean data set extracted from a first data set; training a normal convolutional neural network model and a label-noise convolutional neural network model using first data of the first data set and the pre-trained convolutional neural network model. The method also includes outputting a first prediction result on whether second data of a second data set is good or bad using the second data and the normal convolutional neural network model; and outputting a second prediction result on whether second data is good or bad using the second data and the label-noise convolutional neural network model. The first prediction result is compared with the second prediction result to perform noise correction when there is a label difference. Third data created as results of the noise correction is added to the sampled clean data set.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: November 22, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: In Huh, Min Chul Park, Tae Ho Lee, Chang Wook Jeong, Chan Young Hwang