Patents by Inventor Min Fu

Min Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12332555
    Abstract: An optical engine module used in a projection device and configured to generate an image beam includes a housing and a plate. The housing has a surrounding side wall and a bottom wall connected to each other. The bottom wall has a first opening. The surrounding side wall has an off-state beam irradiation zone adjacent to the first opening. The first opening is configured to allow the image beam to exit. The off-state beam irradiation zone is configured to be irradiated by an off-state beam. The plate has a light receiving part and a heat dissipating part. The light receiving part is disposed in the off-state beam irradiation zone. The heat dissipating part passes through the bottom wall and extends out of the housing. A projection device adopting the optical engine module is also provided.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: June 17, 2025
    Assignee: Coretronic Corporation
    Inventors: Mao-Min Fu, Chien-Ming Peng
  • Patent number: 12334452
    Abstract: An electronic package is provided and includes an electronic structure and a plurality of conductive pillars embedded in a cladding layer, a circuit structure formed on the cladding layer, and a reinforcing member bonded to a side surface of the cladding layer, where a plurality of electronic elements are disposed on and electrically connected to the circuit structure, such that the electronic structure electrically bridges any two of the electronic elements via the circuit structure, so as to enhance the structural strength of the electronic package and avoid warpage by means of the design of the reinforcing member.
    Type: Grant
    Filed: September 22, 2022
    Date of Patent: June 17, 2025
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chao-Chiang Pu, Chi-Ching Ho, Yi-Min Fu, Yu-Po Wang, Fang-Lin Tsai
  • Publication number: 20250183239
    Abstract: An electronic package and a manufacturing method thereof are provided, in which a passive element and an interposer structure are disposed on a carrier structure, the passive element is encapsulated by an encapsulation layer, and the electronic element is disposed on and electrically connected to the passive element and the interposer structure. Therefore, by the design of the electronic element electrically connecting to the passive element, the power transmission path is shortened and the resistance is reduced, thereby achieving the effect of reducing power loss.
    Type: Application
    Filed: June 5, 2024
    Publication date: June 5, 2025
    Inventors: Yi-Min FU, Chi-Ching HO, Yu-Po WANG
  • Patent number: 12319561
    Abstract: Disclosed is a coil module, comprising: a vibrating membrane suspended on an air chamber defined and supported by a first substrate, at least one planar coil, embedded in the vibrating membrane, and at least a soft magnet, embedded in the vibrating membrane and disposed surrounding at least a portion of a contour of the planar coil; wherein a substantial portion of the planar coil locates at substantially the same plane where a portion of the soft magnet is arranged.
    Type: Grant
    Filed: February 23, 2024
    Date of Patent: June 3, 2025
    Assignee: Otowahr Technology Inc.
    Inventors: Yu Min Fu, Tung Yu Wu, Tse Chih Tang
  • Patent number: 12312234
    Abstract: Disclosed is a coil module, comprising: a vibrating membrane suspended on an air chamber defined and supported by a first substrate, at least one planar coil, embedded in the vibrating membrane, and at least a soft magnet, embedded in the vibrating membrane and disposed surrounding at least a portion of a contour of the planar coil; wherein a substantial portion of the planar coil locates at substantially the same plane where a portion of the soft magnet is arranged. A microspeaker and a method for preparing the same are also disclosed.
    Type: Grant
    Filed: February 23, 2024
    Date of Patent: May 27, 2025
    Assignee: Otowahr Technology Inc.
    Inventors: Yu Min Fu, Tung Yu Wu, Tse Chih Tang
  • Publication number: 20250154037
    Abstract: An integrated synchronous nitrogen and sulfur removal device and a wastewater treatment method includes a reactor. A partition plate is horizontally arranged in the reactor to divide the reactor into a first reaction area and a second reaction area which are arranged up and down. An annular baffle plate with a height is arranged in the first reaction area to divide the first reaction area into a first reaction chamber and a second reaction chamber, and a hollow columnar carrier is arranged in the first reaction chamber, so that a third reaction chamber is formed in the first reaction chamber, and the hollow columnar carrier is made of biological stuffing. A water inlet of the reactor is arranged above the first reaction chamber, an anode and a cathode are arranged in the third reaction chamber.
    Type: Application
    Filed: April 16, 2024
    Publication date: May 15, 2025
    Inventors: You-Peng CHEN, Bin-Hao ZHU, Peng YAN, Yu SHEN, Hui-Min FU, Man-Yi SHI
  • Publication number: 20250145829
    Abstract: Disclosed are a rubber particle-doped composite chip seal and a construction method thereof. The chip seal includes: a coarse aggregate in a lower layer, a fine aggregate in an upper layer, and an SBS-modified emulsified asphalt binding and encapsulating the coarse aggregate and the fine aggregate into a whole, wherein the coarse aggregate is a gravel having a particle size of 4.75 mm to 7.1 mm, the fine aggregate is rubber particles having a particle size of 1.18 mm to 4.75 mm after pre-treatment, and the fine aggregate has a doping amount of 30% to 45% of a volume of all aggregates.
    Type: Application
    Filed: March 8, 2024
    Publication date: May 8, 2025
    Inventors: Jianguo WEI, Yuming ZHOU, Hao YUE, Anmin ZOU, Ping LI, Haolong JU, Qiucai NAN, Min FU
  • Publication number: 20250140770
    Abstract: An electronic package and a manufacturing method thereof are provided, in which a photonic integrated circuit chip and an electronic integrated circuit chip are disposed on opposite sides of an interposer respectively, and the photonic integrated circuit chip and the electronic integrated circuit chip can accomplish signal connection with each other via a plurality of conductive vias in the interposer directly, thereby reducing the power consumption and transmission delay of the signals transmitted between the circuits.
    Type: Application
    Filed: March 27, 2024
    Publication date: May 1, 2025
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Che-Yu LEE, Chi-Ching HO, Chao-Chiang PU, Yi-Min FU, Po-Yuan SU
  • Publication number: 20250140765
    Abstract: An electronic package and a manufacturing method thereof are provided, in which a plurality of photonic integrated circuit chips and an auxiliary electronic element are separately configured on a package module to shorten the transmission distance of the optical signal. Therefore, the signal transmission rate of a circuit structure can be increased, thereby improving the overall operating performance of the electronic package.
    Type: Application
    Filed: April 10, 2024
    Publication date: May 1, 2025
    Inventors: Yi-Min FU, Chi-Ching HO, Chao-Chiang PU, Yu-Po WANG
  • Patent number: 12267303
    Abstract: A structural encoding unit and an error correction decoding unit are divided. The structure encoding unit is divided into input branch processor and an input proxy processor; and the error correction decoding unit is divided into an output routing processor, an output proxy processor, an adjudication branch processor, an adjudication proxy processor and a voting processor. The input branch processor is used for duplicating and distributing messages, the arbitration branch processor is used for duplicating and distributing data, the voting processor is used for performing voting, and the output routing processor is used for selecting an output result from processing results of the output proxy processor according to a voting result of the voting processor.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: April 1, 2025
    Assignees: CHINA NATIONAL DIGITAL SWITCHING SYSTEM ENGINEERING & TECHNOLOGICAL R&D CENTER, PURPLE MOUNTAIN LABORATORIES
    Inventors: Lei He, Jiangxing Wu, Qinrang Liu, Ke Song, Shuai Wei, Jianliang Shen, Libo Tan, Yu Li, Quan Ren, Jun Zhou, Min Fu, Weili Zhang, Ruihao Ding, Yiwei Guo
  • Publication number: 20250087601
    Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.
    Type: Application
    Filed: November 22, 2024
    Publication date: March 13, 2025
    Inventors: Chao-Chiang PU, Chi-Ching HO, Yi-Min FU, Yu-Po WANG, Po-Yuan SU
  • Publication number: 20250079254
    Abstract: An electronic package is provided and includes: a thermally conductive chip; a circuit structure having a circuit layer; and an electronic component disposed between the circuit structure and the thermally conductive chip and electrically connected to the circuit layer, so as to dissipate the heat generated during the operation of the electronic component via the thermally conductive chip. A method of manufacturing the electronic package is further provided.
    Type: Application
    Filed: January 4, 2024
    Publication date: March 6, 2025
    Inventors: Po-Yuan SU, Chi-Ching HO, Chao-Chiang PU, Yi-Min FU, Che-Yu LEE
  • Patent number: 12243332
    Abstract: An image capturing method has: providing an image capturing area on a display screen of a user device; providing an indication area in the image capturing area; identifying each license plate in the indication area; calculating a license plate area of said each license plate in the indication area; calculating a center point difference from a center point of said each license plate in the indication area to a center point of the indication area; marking a license plate that has a license plate area larger than half of a largest license plate area and has a smallest center point difference; and capturing an image including the marked license plate in the image capturing area.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: March 4, 2025
    Assignee: GOGORO, INC.
    Inventors: Yi-Chia Lin, Chih-Min Fu, I-Fen Shih
  • Patent number: 12231764
    Abstract: An image capturing method has: providing an image capturing area on a display screen of a user device; providing an indication area in the image capturing area; marking a license plate after identifying the license plate based on at least one license plate feature in the image capturing area; determining whether the marked license plate is located in the indication area and presented in a predetermined ratio; and capturing an image including the license plate in the image capturing area after the marked license plate is located in the indication area and presented in a predetermined ratio.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: February 18, 2025
    Assignee: GOGORO INC.
    Inventors: Yi-Chia Lin, Chih-Min Fu, I-Fen Shih
  • Publication number: 20250038113
    Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.
    Type: Application
    Filed: October 16, 2024
    Publication date: January 30, 2025
    Inventors: Chao-Chiang PU, Chi-Ching HO, Yi-Min FU, Yu-Po WANG, Shuai-Lin LIU
  • Patent number: 12199047
    Abstract: An electronic package is provided in which an electronic module and a heat dissipation structure combined with the electronic module are disposed on a carrier structure, and at least one adjustment structure is coupled with the heat dissipation structure and located around the electronic module. Therefore, the adjustment structure disperses thermal stress to avoid warpage of the electronic module.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: January 14, 2025
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chao-Chiang Pu, Chi-Ching Ho, Yi-Min Fu, Yu-Po Wang, Po-Yuan Su
  • Patent number: 12176291
    Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: December 24, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chao-Chiang Pu, Chi-Ching Ho, Yi-Min Fu, Yu-Po Wang, Shuai-Lin Liu
  • Publication number: 20240421026
    Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure, a heat conduction layer is formed on the electronic element, and a heat dissipation member having a recess portion is disposed on the heat conduction layer to cover the electronic element. Therefore, the arrangement of the recess portion can buffer the flow of the heat conduction layer to facilitate the formation of an intermetallic structure with sufficient thickness between the heat dissipation member and the electronic element, and the heat dissipation effect of the electronic element can meet expectations.
    Type: Application
    Filed: August 11, 2023
    Publication date: December 19, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chiu-Ling CHEN, Shuai-Lin LIU, Pin-Jing SU, Yi-Min FU, Lung-Yuan WANG
  • Publication number: 20240379590
    Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure with a circuit layer, a first encapsulating layer and a second encapsulating layer are formed on the carrier structure to cover the electronic element, a first antenna layer is formed on the first encapsulating layer, and a second antenna layer communicatively connected to the first antenna layer is formed on the second encapsulating layer. Therefore, the thickness of the first encapsulating layer is used to control the resonance distance of the antenna frequency so as to generate better resonance effect, and the distance between the first antenna layer and the second antenna layer is controlled by the thickness of the second encapsulating layer to increase the bandwidth of the antenna.
    Type: Application
    Filed: August 11, 2023
    Publication date: November 14, 2024
    Inventors: Chia-Chu LAI, Yi-Min FU, Chien-Sheng CHEN
  • Publication number: 20240371721
    Abstract: An electronic package and a manufacturing method thereof are provided, in which a heat sink with an opening is disposed on an electronic component of a carrier structure, a heat dissipation material is formed in the opening, and a heat dissipation lid is disposed on the opening to cover the heat dissipation material, such that the problem of insufficient heat dissipation due to the loss of the heat dissipation material can be prevented from occurring to the electronic component.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 7, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yi-Min FU, Chi-Ching HO, Chao-Chiang PU, Yu-Po WANG