Patents by Inventor Min Fu

Min Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12055419
    Abstract: An electronic rotary encoder is configured to be disposed on a vertical rotary shaft in a rotary object to obtain two encoded signals: a phase A signal and a phase B signal for calculating a rotational speed and a position. The electronic rotary encoder includes: at least one Hall element outputting Hall signals used as a square wave of the phase A signal; two capacitors, to respectively obtain a first voltage and a second voltage; two buffer gates, to respectively output waveform signals of a first X voltage and a second X voltage; two comparators outputting, a control signal through a latch; and an exclusive OR gate, where a direction signal and the control signal outputted through the latch are inputted to the exclusive OR gate, to obtain the phase B signal.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: August 6, 2024
    Assignee: HOYI ELECTRONIC TECHNOLOGY CO., LTD.
    Inventors: Chi-Yang Chen, Min-Fu Hsieh
  • Patent number: 12051641
    Abstract: Provided is an electronic package providing a circuit structure having auxiliary circuit layers. Further, an electronic component is disposed on the circuit structure and electrically connected to the auxiliary circuit layers. In addition, an encapsulant covers the electronic component, and the circuit structure is disposed on the package substrate having a plurality of main circuit layers, such that the main circuit layers are electrically connected to the auxiliary circuit layers. As such, a number of layers of the auxiliary circuit layers is used to replace a layer number configuration of the main circuit layers.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: July 30, 2024
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yi-Min Fu, Chi-Ching Ho, Cheng-Yu Kang, Yu-Po Wang
  • Patent number: 12034811
    Abstract: A method and system for transmitting and receiving data packets between two network nodes via one or more end-to-end connections. An interface is provided for selecting one or more possible end-to-end connection(s) or established end-to-end connection(s). The method and system may further comprise receiving a policy, wherein one or more selected end-to-end connections are established based, at least in part, on the policy. The policy may also restrict or promote selection of certain established end-to-end connection(s) via the interface provided. The selected and established end-to-end connection(s) are used for transmitting and receiving data packets.
    Type: Grant
    Filed: July 19, 2022
    Date of Patent: July 9, 2024
    Assignee: Pismo Labs Technology Limited
    Inventors: Patrick Ho Wai Sung, Ho Ming Chan, Kit Wai Chau, Min-Fu Tsai
  • Publication number: 20240190696
    Abstract: Disclosed is a coil module, comprising: a vibrating membrane suspended on an air chamber defined and supported by a first substrate, at least one planar coil, embedded in the vibrating membrane, and at least a soft magnet, embedded in the vibrating membrane and disposed surrounding at least a portion of a contour of the planar coil; wherein a substantial portion of the planar coil locates at substantially the same plane where a portion of the soft magnet is arranged.
    Type: Application
    Filed: February 23, 2024
    Publication date: June 13, 2024
    Inventors: Yu Min FU, Tung Yu WU, Tse Chih TANG
  • Publication number: 20240190697
    Abstract: Disclosed is a coil module, comprising: a vibrating membrane suspended on an air chamber defined and supported by a first substrate, at least one planar coil, embedded in the vibrating membrane, and at least a soft magnet, embedded in the vibrating membrane and disposed surrounding at least a portion of a contour of the planar coil; wherein a substantial portion of the planar coil locates at substantially the same plane where a portion of the soft magnet is arranged. A microspeaker and a method for preparing the same are also disclosed.
    Type: Application
    Filed: February 23, 2024
    Publication date: June 13, 2024
    Inventors: Yu Min FU, Tung Yu WU, Tse Chih TANG
  • Publication number: 20240153884
    Abstract: An electronic package is provided, in which a first electronic element and a second electronic element stacked on each other are embedded in a cladding layer, a circuit structure electrically connected to the second electronic element is formed on the cladding layer, and a passive element and a package module are disposed on the circuit structure, so as to shorten the transmission distance of electrical signals between the package module and the second electronic element.
    Type: Application
    Filed: December 30, 2022
    Publication date: May 9, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yi-Min FU, Hung-Kai WANG, Chi-Ching HO, Yih-Jenn JIANG, Yu-Po WANG
  • Publication number: 20240139234
    Abstract: Provided herein is a potassium-binding polymer prepared by polymerization reaction of a monomer and a crosslinking agent, wherein the monomer is the compound of formula (V), the crosslinking agent is the compound of formula (VI), and/or the compound of formula (VII), wherein the variables are as defined in the specification; to the use thereof for treating or preventing hyperkalemia.
    Type: Application
    Filed: November 4, 2021
    Publication date: May 2, 2024
    Applicant: WATERSTONE PHARMACEUTICALS (WUHAN) CO., LTD.
    Inventors: Min FU, Minglong HU, Tongtong LI, Ying LIANG, Xiaolong WANG, Yao YU, Faming ZHANG
  • Publication number: 20240038685
    Abstract: An electronic package is provided and includes an electronic structure and a plurality of conductive pillars embedded in a cladding layer, a circuit structure formed on the cladding layer, and a reinforcing member bonded to a side surface of the cladding layer, where a plurality of electronic elements are disposed on and electrically connected to the circuit structure, such that the electronic structure electrically bridges any two of the electronic elements via the circuit structure, so as to enhance the structural strength of the electronic package and avoid warpage by means of the design of the reinforcing member.
    Type: Application
    Filed: September 22, 2022
    Publication date: February 1, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chao-Chiang Pu, Chi-Ching Ho, Yi-Min Fu, Yu-Po Wang, Fang-Lin Tsai
  • Publication number: 20230378072
    Abstract: An electronic package is provided, in which a plurality of electronic elements are disposed on a plurality of carrier structures, and at least one bridging element is disposed between at least two of the carrier structures to electrically bridge the two carrier structures. Therefore, when there is a need to increase the function of the electronic package, only one electronic element is arranged on a single carrier structure, and there is no need to increase the panel area of the carrier structure, so as to facilitate the control of the panel area of the carrier structure and avoid warpage of the carrier structure due to the oversized panel.
    Type: Application
    Filed: July 5, 2022
    Publication date: November 23, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Shuai-Lin Liu, Nai-Hao Kao, Chao-Chiang Pu, Yi-Min Fu, Yu-Po Wang
  • Patent number: 11795544
    Abstract: A chamber for processing deposition on a wafer includes a wafer holder having a central surface region for placing a wafer and a carrier ring support surface encircling the central surface region; and a carrier ring disposed on the carrier ring support surface. The carrier ring comprises an annular disk body comprising an annular wafer support region, an annular peripheral region, and an annular transition region between the annular wafer support region and the annular peripheral region. The annular peripheral region comprises a top carrier ring surface. The annular wafer support region has a lower carrier ring surface that is in physical contact with a wafer during processing. The annular transition region comprises a curved slope between the top carrier ring surface and the lower carrier ring surface.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: October 24, 2023
    Assignee: United Semiconductor (Xiamen) Co., Ltd.
    Inventor: Min-Fu Lee
  • Patent number: 11791678
    Abstract: A motor and a rotor structure thereof are disclosed. The rotor structure includes a rotor core. The rotor core has a plurality of magnetic member units arranged around a periphery of the rotor core. Each magnetic member unit includes two first magnetic members and a second magnetic member. The two first magnetic members are obliquely arranged in a V shape relative to a center of the rotor core. The second magnetic member extends transversely between the two first magnetic members. Each first magnetic member has at least two permanent magnets that are arranged obliquely. The motor further includes a stator core covering the rotor core. The stator core has a plurality of stator windings arranged annularly. The stator windings correspond to the magnetic member units. The rotor structure has high structural strength, and the phenomenon of stress concentration is less obvious when the motor is running.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: October 17, 2023
    Assignee: National Cheng Kung University
    Inventors: Min-Fu Hsieh, Mi-Ching Tsai, Kai-Jung Shih, Lucio Jose Fernando Caceres Vera, Guan-Ming Chen
  • Publication number: 20230282586
    Abstract: An electronic package is provided in which a chip packaging module, an electronic element having a plurality of contacts, and an electronic connector are disposed on a routing structure of a carrier component, so as to communicatively connect with the chip packaging module via the electronic element and the electronic connector, thereby increasing a signal transmission speed.
    Type: Application
    Filed: May 10, 2022
    Publication date: September 7, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chao-Chiang Pu, Chi-Ching Ho, Yi-Min Fu, Yu-Po Wang, Shuai-Lin Liu
  • Publication number: 20230253331
    Abstract: An electronic package is provided, in which an electronic module and at least one support member are disposed on a substrate structure having a circuit layer, such that the stress on the substrate structure is dispersed through the at least one support member to eliminate the problem of stress concentration and prevent the substrate structure from warping.
    Type: Application
    Filed: August 29, 2022
    Publication date: August 10, 2023
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yi-Min Fu, Chi-Ching Ho, Chao-Chiang Pu, Yu-Po Wang
  • Publication number: 20230235390
    Abstract: The present invention provides a mass spectrometry-based method and a kit for genotyping of platelet and neutrophil antigens and glycoproteins, which are used for genotyping of platelet-specific antigens, platelet CD36 glycoproteins and neutrophil antigens; by designing an optimal primer combination, problems such as homologous sequences and rich GC are overcome, moreover, by improving amplification reaction conditions and using nucleic acid mass spectrometry as a platform, 35 platelet-specific antigen polymorphic sites, 10 CD36 polymorphic sites and 8 neutrophil antigen polymorphic sites can be simultaneously detected in 2 reactions. The present invention has the characteristics of high specificity and sensitivity, and fast and high throughput, and can be used in clinic, scientific research, platelet donor routine screening, etc.
    Type: Application
    Filed: January 19, 2023
    Publication date: July 27, 2023
    Inventors: Luyi YE, Huijun ZHU, Ruishu LI, Min FU, Ping LU, Ziyan ZHU
  • Patent number: 11705758
    Abstract: A wireless power transmitting terminal and control method are disclosed. The wireless power transmitting terminal including an inverter circuit, a resonance circuit and a controller, wherein in a frequency detection state, an alternating current of the inverter circuit is controlled to switch between different candidate frequencies, so as to determine a resonance frequency and a maximum peak value of an electrical parameter of the alternating current at the resonance frequency, and determine an operating state of the power transmitting terminal according to the change of the maximum peak value. Therefore, the wireless power transmitting terminal can dynamically adjust in real time a preset operating state thereof, thereby improving the device adaptability, and avoiding the damage of the device to be charged.
    Type: Grant
    Filed: September 28, 2021
    Date of Patent: July 18, 2023
    Assignee: Ningbo Weie Electronics Technology Ltd.
    Inventors: Feng Yu, Lizhi Xu, Weiyi Feng, Min Fu
  • Publication number: 20230224333
    Abstract: Provided are network security defense method and network security defense system. The method includes: processing data multiple times using a preset processing strategy, where the processing strategy includes a first strategy and a second strategy, the first strategy is used for eliminating an influence of generalized disturbance on the second strategy, the second strategy after being eliminated the influence is applied to the data for calculation, storage and communication of the data, the first strategy includes an encoding strategy, a decoding strategy and a memory elimination strategy, and the generalized disturbance includes random disturbance and/or non-random disturbance; triggering a feedback control strategy based on a decoding result of the multiple processing results; and adjusting the first strategy according to the feedback control strategy.
    Type: Application
    Filed: June 7, 2021
    Publication date: July 13, 2023
    Inventors: Jiangxing WU, Lei HE, Quan REN, Jun ZHOU, Min FU, Weili ZHANG, Ruihao DING, Yiwei GUO, Jinsuo ZHOU
  • Patent number: 11695310
    Abstract: A motor, a cooling device, and a cooling method are disclosed. The cooling device is mounted on a stator of the motor. The cooling device includes a sleeve and a spiral duct. A wall of the sleeve has a spiral groove extending along the sleeve. The sleeve is sleeved onto the stator. The spiral duct is mounted in the spiral groove. The spiral duct has a first spiral form corresponding to the spiral groove, so that the spiral duct is correspondingly installed in the spiral groove. The spiral duct has a second spiral form extending along the spiral duct. A twisted spiral cooling channel is formed along the spiral pathway. A cooling fluid flowing through the twisted spiral cooling channel is subjected to the continuously changing cross-section of the twisted spiral cooling channel to enhance the swirl intensity, thereby improving the convection heat transfer effectiveness.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: July 4, 2023
    Assignee: National Cheng Kung University
    Inventors: Mi-Ching Tsai, Shyy-Woei Chang, Min-Fu Hsieh, Kai-Jung Shih, Wei-Ling Cai, Jen-Hsiang Liu
  • Patent number: 11677303
    Abstract: A motor and a coreless stator coil winding unit thereof are disclosed. The coreless stator coil winding unit includes an overlapping coil winding assembly and a non-overlapping coil winding assembly. The overlapping coil winding assembly includes a plurality of first coils arranged annularly and a plurality of second coils arranged annularly. The first coils and the second coils overlap with a phase difference. The non-overlapping coil winding assembly includes a plurality of third coils arranged annularly. The third coils are each located between an adjacent one of the first coils and an adjacent one of the second coils. Thus, the back electromotive force constant and torque constant of the motor have a better performance.
    Type: Grant
    Filed: October 21, 2021
    Date of Patent: June 13, 2023
    Assignee: National Cheng Kung University
    Inventors: Mi-Ching Tsai, Min-Fu Hsieh, Kai-Jung Shih, Po-Wei Huang, Lucio Jose Fernando Caceres Vera, Shang-Hui Shen, Jung-Kun Chiu, Hsin-Yu Chiu
  • Publication number: 20230167404
    Abstract: A urine-derived mesenchymal stem cell mitochondria as well as a transplantation method and use thereof. The urine-derived mesenchymal stem cell mitochondrion is extracted from urine to be used for improving the quality of oocytes. The transplantation method comprises: jointly injecting sperms and the urine-derived mesenchymal stem cell mitochondria into mature oocytes for blastaea culture during the intracytoplasmic sperm microinjection.
    Type: Application
    Filed: January 13, 2022
    Publication date: June 1, 2023
    Inventors: Huan Shen, Zhixin Jiang, Cheng Shi, Yanbin Wang, Xi Chen, Hongjing Han, Min Fu, Jia Fei
  • Patent number: D1007041
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: December 5, 2023
    Assignee: NINGBO FIVEFU TECHNOLOGY LIMITED
    Inventor: Min Fu